Environmentally robust lighting devices and methods of manufacturing same
    11.
    发明授权
    Environmentally robust lighting devices and methods of manufacturing same 有权
    环保的照明装置及其制造方法

    公开(公告)号:US07915061B2

    公开(公告)日:2011-03-29

    申请号:US12129925

    申请日:2008-05-30

    IPC分类号: H01L21/00

    摘要: An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.

    摘要翻译: 说明性照明装置包括:发光芯片; 设置在所述发光芯片上的硅氧烷密封剂; 以及密封包括至少硅树脂密封剂和发光芯片的组件的透光乙烯基或丙烯酸层。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及使用透光乙烯基或丙烯酸层密封至少包括硅氧烷密封剂和发光芯片的组件。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及通过在所述组件上设置透光塑料层作为单元来密封包括至少所述硅酮密封剂和所述发光芯片的组件。

    LED lighting system for a cabinet sign
    13.
    发明授权
    LED lighting system for a cabinet sign 有权
    LED照明系统用于橱柜标志

    公开(公告)号:US07926977B2

    公开(公告)日:2011-04-19

    申请号:US12212136

    申请日:2008-09-17

    IPC分类号: F21S4/00

    摘要: A lighting system generally includes a plurality of electrically interconnected modules. Each module includes a support, circuitry on the support, at least two light emitting diodes (“LEDs”) on the support and electrically connected to the circuitry, and a housing over the support for covering the circuitry. A first LED on a first surface of the support emits light in a first general direction and a second LED mounted on a second surface of the support emits light in a second general direction, which is opposite the first general direction.

    摘要翻译: 照明系统通常包括多个电互连模块。 每个模块包括支撑件,支撑件上的电路,支撑件上的至少两个发光二极管(“LED”)和电连接到电路,以及用于覆盖电路的支撑件上的壳体。 支撑件的第一表面上的第一LED在第一大体方向上发光,并且安装在支撑件的第二表面上的第二LED在与第一总方向相反的第二大体方向上发光。

    LED LIGHTING SYSTEM FOR A CABINET SIGN
    14.
    发明申请
    LED LIGHTING SYSTEM FOR A CABINET SIGN 有权
    用于橱柜标志的LED照明系统

    公开(公告)号:US20090073693A1

    公开(公告)日:2009-03-19

    申请号:US12212136

    申请日:2008-09-17

    IPC分类号: F21V21/00

    摘要: A lighting system generally includes a plurality of electrically interconnected modules. Each module includes a support, circuitry on the support, at least two light emitting diodes (“LEDs”) on the support and electrically connected to the circuitry, and a housing over the support for covering the circuitry. A first LED on a first surface of the support emits light in a first general direction and a second LED mounted on a second surface of the support emits light in a second general direction, which is opposite the first general direction.

    摘要翻译: 照明系统通常包括多个电互连模块。 每个模块包括支撑件,支撑件上的电路,支撑件上的至少两个发光二极管(“LED”)和电连接到电路,以及用于覆盖电路的支撑件上的壳体。 支撑件的第一表面上的第一LED在第一大体方向上发光,并且安装在支撑件的第二表面上的第二LED在与第一总方向相反的第二大体方向上发光。

    ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME
    15.
    发明申请
    ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME 有权
    环保的照明设备及其制造方法

    公开(公告)号:US20080296607A1

    公开(公告)日:2008-12-04

    申请号:US12129925

    申请日:2008-05-30

    IPC分类号: H01L33/00 H01L21/00

    摘要: An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.

    摘要翻译: 说明性照明装置包括:发光芯片; 设置在所述发光芯片上的硅氧烷密封剂; 以及密封包括至少硅树脂密封剂和发光芯片的组件的透光乙烯基或丙烯酸层。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及使用透光乙烯基或丙烯酸层密封至少包括硅氧烷密封剂和发光芯片的组件。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及通过在所述组件上设置透光塑料层作为单元来密封包括至少所述硅酮密封剂和所述发光芯片的组件。

    LED LIGHT ENGINE AND METHOD OF MANUFACTURING
    16.
    发明申请
    LED LIGHT ENGINE AND METHOD OF MANUFACTURING 审中-公开
    LED发光体及其制造方法

    公开(公告)号:US20080137377A1

    公开(公告)日:2008-06-12

    申请号:US11609197

    申请日:2006-12-11

    摘要: The present invention relates to a light emitting diode (LED) light engine. The LED light engine includes at least one LED, the at least one LED having at least one first electrical terminal and at least one second electrical terminal. The LED light engine further includes an electrical cable having a first conductor and a second conductor, the at least one LED being secured to the first conductor by a first insulation displacement connector (IDC) and to the second conductor by a second IDC. The first IDC includes at least one socket for receiving the at least one first electrical terminal and a piercing portion for displacing the insulating portion and electrically contacting the first conductor of the electrical cable. The second IDC includes at least one socket for receiving the second terminal of the at least one LED and a piercing portion for displacing the insulating portion and contacting the second conductor of the electrical cable.

    摘要翻译: 本发明涉及发光二极管(LED)光引擎。 LED光引擎包括至少一个LED,所述至少一个LED具有至少一个第一电端子和至少一个第二电端子。 LED光引擎还包括具有第一导体和第二导体的电缆,所述至少一个LED通过第一绝缘位移连接器(IDC)固定到第一导体,并通过第二IDC固定到第二导体。 第一IDC包括用于接收至少一个第一电端子的至少一个插座和用于移动绝缘部分并电接触电缆的第一导体的穿刺部分。 第二IDC包括用于接收至少一个LED的第二端子的至少一个插座和用于移动绝缘部分并接触电缆的第二导体的刺穿部分。