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公开(公告)号:US07926977B2
公开(公告)日:2011-04-19
申请号:US12212136
申请日:2008-09-17
申请人: Jeffrey M. Nall , Koushik Saha , Xin Wang , Kevin Carpenter , Douglas R. Halley , John Owens
发明人: Jeffrey M. Nall , Koushik Saha , Xin Wang , Kevin Carpenter , Douglas R. Halley , John Owens
IPC分类号: F21S4/00
CPC分类号: G09F13/22 , G09F13/04 , G09F2013/1895
摘要: A lighting system generally includes a plurality of electrically interconnected modules. Each module includes a support, circuitry on the support, at least two light emitting diodes (“LEDs”) on the support and electrically connected to the circuitry, and a housing over the support for covering the circuitry. A first LED on a first surface of the support emits light in a first general direction and a second LED mounted on a second surface of the support emits light in a second general direction, which is opposite the first general direction.
摘要翻译: 照明系统通常包括多个电互连模块。 每个模块包括支撑件,支撑件上的电路,支撑件上的至少两个发光二极管(“LED”)和电连接到电路,以及用于覆盖电路的支撑件上的壳体。 支撑件的第一表面上的第一LED在第一大体方向上发光,并且安装在支撑件的第二表面上的第二LED在与第一总方向相反的第二大体方向上发光。
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公开(公告)号:US20090073693A1
公开(公告)日:2009-03-19
申请号:US12212136
申请日:2008-09-17
申请人: Jeffrey M. Nall , Koushik Saha , Xin Wang , Kevin Carpenter , Douglas R. Halley , John Owens
发明人: Jeffrey M. Nall , Koushik Saha , Xin Wang , Kevin Carpenter , Douglas R. Halley , John Owens
IPC分类号: F21V21/00
CPC分类号: G09F13/22 , G09F13/04 , G09F2013/1895
摘要: A lighting system generally includes a plurality of electrically interconnected modules. Each module includes a support, circuitry on the support, at least two light emitting diodes (“LEDs”) on the support and electrically connected to the circuitry, and a housing over the support for covering the circuitry. A first LED on a first surface of the support emits light in a first general direction and a second LED mounted on a second surface of the support emits light in a second general direction, which is opposite the first general direction.
摘要翻译: 照明系统通常包括多个电互连模块。 每个模块包括支撑件,支撑件上的电路,支撑件上的至少两个发光二极管(“LED”)和电连接到电路,以及用于覆盖电路的支撑件上的壳体。 支撑件的第一表面上的第一LED在第一大体方向上发光,并且安装在支撑件的第二表面上的第二LED在与第一总方向相反的第二大体方向上发光。
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公开(公告)号:US09836999B2
公开(公告)日:2017-12-05
申请号:US14330752
申请日:2014-07-14
申请人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, Jr. , Xin Wang , Tomislav J. Stimac
发明人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, Jr. , Xin Wang , Tomislav J. Stimac
IPC分类号: G09F13/04 , F21V29/507 , G09F13/22 , F21V21/14 , F21V19/00 , F21S2/00 , F21V23/00 , F21V23/06 , F21V29/00 , F21Y105/10 , F21Y103/10 , F21Y115/10
CPC分类号: G09F13/04 , F21S2/005 , F21V19/003 , F21V21/14 , F21V23/004 , F21V23/005 , F21V23/06 , F21V29/507 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G09F13/22 , G09F2013/0418 , G09F2013/222 , Y10T29/49002 , Y10T29/49117
摘要: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
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4.
公开(公告)号:US07915061B2
公开(公告)日:2011-03-29
申请号:US12129925
申请日:2008-05-30
IPC分类号: H01L21/00
CPC分类号: H01L33/56 , H01L33/501 , H01L33/54
摘要: An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.
摘要翻译: 说明性照明装置包括:发光芯片; 设置在所述发光芯片上的硅氧烷密封剂; 以及密封包括至少硅树脂密封剂和发光芯片的组件的透光乙烯基或丙烯酸层。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及使用透光乙烯基或丙烯酸层密封至少包括硅氧烷密封剂和发光芯片的组件。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及通过在所述组件上设置透光塑料层作为单元来密封包括至少所述硅酮密封剂和所述发光芯片的组件。
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公开(公告)号:US20140254140A1
公开(公告)日:2014-09-11
申请号:US14181087
申请日:2014-02-14
申请人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, JR. , Xin Wang , Tamislav J. Stimac
发明人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, JR. , Xin Wang , Tamislav J. Stimac
CPC分类号: G09F13/04 , F21S2/005 , F21V19/003 , F21V21/14 , F21V23/004 , F21V23/005 , F21V23/06 , F21V29/507 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G09F13/22 , G09F2013/0418 , G09F2013/222 , Y10T29/49002 , Y10T29/49117
摘要: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
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6.
公开(公告)号:US20080296607A1
公开(公告)日:2008-12-04
申请号:US12129925
申请日:2008-05-30
CPC分类号: H01L33/56 , H01L33/501 , H01L33/54
摘要: An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.
摘要翻译: 说明性照明装置包括:发光芯片; 设置在所述发光芯片上的硅氧烷密封剂; 以及密封包括至少硅树脂密封剂和发光芯片的组件的透光乙烯基或丙烯酸层。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及使用透光乙烯基或丙烯酸层密封至少包括硅氧烷密封剂和发光芯片的组件。 制造照明装置的说明性方法包括:用硅胶密封剂封装发光芯片; 以及通过在所述组件上设置透光塑料层作为单元来密封包括至少所述硅酮密封剂和所述发光芯片的组件。
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公开(公告)号:US10223944B2
公开(公告)日:2019-03-05
申请号:US14181087
申请日:2014-02-14
申请人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, Jr. , Xin Wang , Tomislav J. Stimac
发明人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, Jr. , Xin Wang , Tomislav J. Stimac
IPC分类号: H01L51/50 , G09F13/22 , G09F13/04 , F21V29/507 , F21V21/14 , F21V19/00 , F21S2/00 , F21V23/00 , F21V23/06 , F21Y105/10 , F21Y103/10 , F21Y115/10
摘要: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
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公开(公告)号:US20150007469A1
公开(公告)日:2015-01-08
申请号:US14330752
申请日:2014-07-14
申请人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, JR. , Xin Wang , Tamislav J. Stimac
发明人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, JR. , Xin Wang , Tamislav J. Stimac
CPC分类号: G09F13/04 , F21S2/005 , F21V19/003 , F21V21/14 , F21V23/004 , F21V23/005 , F21V23/06 , F21V29/507 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G09F13/22 , G09F2013/0418 , G09F2013/222 , Y10T29/49002 , Y10T29/49117
摘要: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
摘要翻译: 用于橱柜标志的背光系统可以包括多个面板。 每个面板包括附接到面板的多个发光二极管(“LED”)。 二极管的箱体符号深度系数小于约1.4。 集成电路也可以位于面板上。 电线物理连接相邻的面板。
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公开(公告)号:US20140317975A1
公开(公告)日:2014-10-30
申请号:US14330631
申请日:2014-07-14
申请人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, JR. , Xin Wang , Tamislav J. Stimac
发明人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, JR. , Xin Wang , Tamislav J. Stimac
CPC分类号: G09F13/04 , F21S2/005 , F21V19/003 , F21V21/14 , F21V23/004 , F21V23/005 , F21V23/06 , F21V29/507 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G09F13/22 , G09F2013/0418 , G09F2013/222 , Y10T29/49002 , Y10T29/49117
摘要: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
摘要翻译: 用于橱柜标志的背光系统可以包括多个面板。 每个面板包括附接到面板的多个发光二极管(“LED”)。 二极管的箱体符号深度系数小于约1.4。 集成电路也可以位于面板上。 电线物理连接相邻的面板。
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公开(公告)号:US09165487B2
公开(公告)日:2015-10-20
申请号:US14330631
申请日:2014-07-14
申请人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, Jr. , Xin Wang , Tamislav J. Stimac
发明人: Jeffrey Marc Nall , Kevin Carpenter , Koushik Saha , Chenyang Li , Ronald K. Brengartner, Jr. , Xin Wang , Tamislav J. Stimac
IPC分类号: F21V33/00 , G09F13/04 , G09F13/22 , F21V21/14 , F21V19/00 , F21S2/00 , F21V23/00 , F21V23/06 , F21V29/00 , F21Y103/00 , F21Y105/00
CPC分类号: G09F13/04 , F21S2/005 , F21V19/003 , F21V21/14 , F21V23/004 , F21V23/005 , F21V23/06 , F21V29/507 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G09F13/22 , G09F2013/0418 , G09F2013/222 , Y10T29/49002 , Y10T29/49117
摘要: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
摘要翻译: 用于橱柜标志的背光系统可以包括多个面板。 每个面板包括附接到面板的多个发光二极管(“LED”)。 二极管的箱体符号深度系数小于约1.4。 集成电路也可以位于面板上。 电线物理连接相邻的面板。
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