公开(公告)号：US08035402B2

公开(公告)日：2011-10-11

申请号：US13017052

申请日：2011-01-31

申请人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

发明人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

IPC分类号： G01R27/26 ,  G01L9/12

CPC分类号： G01L9/0073

摘要： A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.

摘要翻译： 提供了包括载体，多个导电凸块，通过导电凸块连接到载体的电容感测元件和盖的传感器。 电容感测元件具有膜，并且在电容感测元件，导电凸块和载体之间形成通道。 盖子设置在载体上以覆盖电容式感测元件。 在电容式感测元件和盖子之间形成一个室。 腔室和通道分别位于膜的两侧。

公开(公告)号：US07960805B2

公开(公告)日：2011-06-14

申请号：US12348322

申请日：2009-01-05

申请人： Jen-Yi Chen ,  Chin-Horng Wang

发明人： Jen-Yi Chen ,  Chin-Horng Wang

IPC分类号： H01L29/84

CPC分类号： B81C1/00476 ,  B81B2201/0257 ,  B81C1/00801 ,  B81C2201/014 ,  B81C2203/0714 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

摘要： An MEMS structure and a method of manufacturing the same are provided. The MEMS structure includes a substrate and at least one suspended microstructure located on the substrate. The suspended microstructure includes a plurality of metal layers, at least one dielectric layer, and at least one peripheral metal wall. The dielectric layer is sandwiched by the metal layers, and the peripheral metal wall is parallel to a thickness direction of the suspended microstructure and surrounds an edge of the dielectric layer.

摘要翻译： 提供了MEMS结构及其制造方法。 MEMS结构包括衬底和位于衬底上的至少一个悬浮微结构。 悬浮的微结构包括多个金属层，至少一个电介质层和至少一个外围金属壁。 电介质层被金属层夹在中间，周边金属壁平行于悬浮微结构的厚度方向并且包围电介质层的边缘。

公开(公告)号：US20110121843A1

公开(公告)日：2011-05-26

申请号：US13017052

申请日：2011-01-31

申请人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

发明人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

IPC分类号： G01R27/26 ,  G01L9/12

CPC分类号： G01L9/0073

摘要： A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.

摘要翻译： 提供了包括载体，多个导电凸块，通过导电凸块连接到载体的电容感测元件和盖的传感器。 电容感测元件具有膜，并且在电容感测元件，导电凸块和载体之间形成通道。 盖子设置在载体上以覆盖电容式感测元件。 在电容式感测元件和盖子之间形成一个室。 腔室和通道分别位于膜的两侧。

公开(公告)号：US08468665B2

公开(公告)日：2013-06-25

申请号：US13027457

申请日：2011-02-15

申请人： Jen-Yi Chen

发明人： Jen-Yi Chen

IPC分类号： H01G7/00

CPC分类号： H04R19/04 ,  Y10T29/435 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

摘要： A method of manufacturing a capacitive microphone comprises providing a substrate having at least one cavity. The method further comprises forming a backplate on the substrate, wherein the backplate has a plurality of holes, and forming a diaphragm on the backplate, wherein there are a first distance and a second distance between the diaphragm and the backplate. The method still further comprises forming an air gap between the backplate and the diaphragm through the first distance, and fastening the diaphragm to the backplate through the second distance.

摘要翻译： 制造电容式麦克风的方法包括提供具有至少一个空腔的基板。 所述方法还包括在所述基底上形成背板，其中所述背板具有多个孔，并且在所述背板上形成隔膜，其中所述隔膜和所述背板之间具有第一距离和第二距离。 所述方法还包括在所述背板和所述隔膜之间经过所述第一距离形成气隙，并且将所述隔膜紧固到所述背板的第二距离。

公开(公告)号：US07902843B2

公开(公告)日：2011-03-08

申请号：US12110369

申请日：2008-04-28

申请人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

发明人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

IPC分类号： G01R27/26 ,  G01L9/12

CPC分类号： G01L9/0073

摘要： A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.

摘要翻译： 包括具有两个通道的载体的传感器，设置在载体上的电容式感测元件和盖。 电容式感测元件具有膜，并且在膜和载体之间形成第一室。 盖子设置在载体上以覆盖电容式感测元件。 在膜和盖之间形成第二室。 第一室和第二室位于膜的两侧，并且通道分别与第一室和第二室连通。

公开(公告)号：US20100084723A1

公开(公告)日：2010-04-08

申请号：US12348322

申请日：2009-01-05

申请人： Jen-Yi Chen ,  Chin-Horng Wang

发明人： Jen-Yi Chen ,  Chin-Horng Wang

IPC分类号： H01L29/84 ,  H01L21/34

CPC分类号： B81C1/00476 ,  B81B2201/0257 ,  B81C1/00801 ,  B81C2201/014 ,  B81C2203/0714 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

摘要： An MEMS structure and a method of manufacturing the same are provided. The MEMS structure includes a substrate and at least one suspended microstructure located on the substrate. The suspended microstructure includes a plurality of metal layers, at least one dielectric layer, and at least one peripheral metal wall. The dielectric layer is sandwiched by the metal layers, and the peripheral metal wall is parallel to a thickness direction of the suspended microstructure and surrounds an edge of the dielectric layer.

摘要翻译： 提供了MEMS结构及其制造方法。 MEMS结构包括衬底和位于衬底上的至少一个悬浮微结构。 悬浮的微结构包括多个金属层，至少一个电介质层和至少一个外围金属壁。 电介质层被金属层夹在中间，周边金属壁平行于悬浮微结构的厚度方向并且包围电介质层的边缘。

公开(公告)号：US20090115430A1

公开(公告)日：2009-05-07

申请号：US12110369

申请日：2008-04-28

申请人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

发明人： Yu-Jen Fang ,  Jen-Yi Chen ,  Kai-Hsiang Yen ,  Po-Hsun Sung

IPC分类号： G01R27/26 ,  G01L9/12

CPC分类号： G01L9/0073

摘要： A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.

摘要翻译： 包括具有两个通道的载体的传感器，设置在载体上的电容式感测元件和盖。 电容式感测元件具有膜，并且在膜和载体之间形成第一室。 盖子设置在载体上以覆盖电容式感测元件。 在膜和盖之间形成第二室。 第一室和第二室位于膜的两侧，并且通道分别与第一室和第二室连通。

公开(公告)号：US20090101998A1

公开(公告)日：2009-04-23

申请号：US11964995

申请日：2007-12-27

申请人： Kai-Hsiang Yen ,  Jen-Yi Chen ,  Po-Hsun Sung

发明人： Kai-Hsiang Yen ,  Jen-Yi Chen ,  Po-Hsun Sung

IPC分类号： B81B3/00 ,  H01L29/84

CPC分类号： B81C1/0023 ,  B81B2201/0257 ,  B81B2207/012 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  H04R31/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transducing and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.

摘要翻译： 提供了包括感测芯片，载体芯片和密封元件的电声感测装置。 感测芯片用于电声转换，从而输出电信号。 布置在感测芯片下方的载体芯片具有至少一个第二连接点，至少一个电通道和至少一个通道连接点。 第二连接点与第一连接点电接触。 第二连接点和通道连接点位于载体芯片的不同表面。 电气通道穿过载体芯片并电连接第二连接点和通道连接点。 电信号通过第一和第二连接点和电通道传输到通道连接点。 密封元件设置在感测芯片和载体芯片之间，用于气密地耦合两个芯片。