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公开(公告)号：US20200256567A1
公开(公告)日：2020-08-13
申请号：US16289102
申请日：2019-02-28
Applicant: Johnson Controls Technology Company
Inventor： Sarjerao Pingale , Manjur Tamboli , Neelkanth S. Gupte , Anand Talikot , Baskaran Kandhappan
IPC: F24F1/03
Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
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公开(公告)号：US20200088439A1
公开(公告)日：2020-03-19
申请号：US16136034
申请日：2018-09-19
Applicant: Johnson Controls Technology Company
Inventor： Anil V. Bhosale , Appiya B. Suriya Prakash , Neelkanth S. Gupte , Vinay Nanjappa
Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) system including an exhaust plenum configured to receive an exhaust air flow from a cooling load. The HVAC system also includes a condenser configured to receive an input air flow and transfer thermal energy to the input air flow. A panel is positioned directly adjacent to and between the exhaust plenum and the condenser. The panel includes a passage providing a fluid flow path directly between the exhaust plenum and the condenser. The passage is configured to discharge a portion of the exhaust air flow, and the input air flow includes the portion.
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公开(公告)号：US20190353387A1
公开(公告)日：2019-11-21
申请号：US16011420
申请日：2018-06-18
Applicant: Johnson Controls Technology Company
Inventor： Neelkanth S. Gupte , Tejas Mahendra , Mukesh Sharma , Akshay Baljekar
Abstract: Embodiments of the present disclosure are directed to a heating and cooling system includes a heat exchanger configured to place an airflow and a refrigerant in thermal communication with one another, where the heat exchanger has a coil and a plurality of fans coupled to the coil, and where the plurality of fans is arranged in an array adjacent to the coil.
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公开(公告)号：US20230349640A1
公开(公告)日：2023-11-02
申请号：US18126905
申请日：2023-03-27
Applicant: Johnson Controls Technology Company
Inventor： Zhiwei Huang , Neelkanth S. Gupte
CPC classification number: F28D1/0417 , F28D1/05341 , F28D1/05391 , F28D1/0473 , F28D2021/0071
Abstract: Embodiments of the present disclosure are directed to a climate management system that includes a heat exchanger having a first set of microchannel coils fluidly coupled to a first circuit of the climate management system and a second set of microchannel coils fluidly coupled to a second circuit of the climate management system, where the first circuit and the second circuit are fluidly separate from one another, and where the first set of microchannel coils and the second set of microchannel coils are disposed in an alternating arrangement along a length of the heat exchanger such that the first set of microchannel coils and the second set of microchannel coils are interlaced in the heat exchanger.
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公开(公告)号：US11162706B2
公开(公告)日：2021-11-02
申请号：US16136034
申请日：2018-09-19
Applicant: Johnson Controls Technology Company
Inventor： Anil V. Bhosale , Appiya B. Suriya Prakash , Neelkanth S. Gupte , Vinay Nanjappa
Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) system including an exhaust plenum configured to receive an exhaust air flow from a cooling load. The HVAC system also includes a condenser configured to receive an input air flow and transfer thermal energy to the input air flow. A panel is positioned directly adjacent to and between the exhaust plenum and the condenser. The panel includes a passage providing a fluid flow path directly between the exhaust plenum and the condenser. The passage is configured to discharge a portion of the exhaust air flow, and the input air flow includes the portion.
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Patent Agency Ranking
公开(公告)号：US11137165B2
公开(公告)日：2021-10-05
申请号：US16011420
申请日：2018-06-18
Applicant: Johnson Controls Technology Company
Inventor： Neelkanth S. Gupte , Tejas Mahendra , Mukesh Sharma , Akshay Baljekar
IPC: F24F11/85 , F25B49/02 , F24F1/00 , F24F1/0033
Abstract: Embodiments of the present disclosure are directed to a heating and cooling system includes a heat exchanger configured to place an airflow and a refrigerant in thermal communication with one another, where the heat exchanger has a coil and a plurality of fans coupled to the coil, and where the plurality of fans is arranged in an array adjacent to the coil.
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公开(公告)号：US11118795B2
公开(公告)日：2021-09-14
申请号：US16289102
申请日：2019-02-28
Applicant: Johnson Controls Technology Company
Inventor： Sarjerao Pingale , Manjur Tamboli , Neelkanth S. Gupte , Anand Talikot , Baskaran Kandhappan
Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
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公开(公告)号：US11047625B2
公开(公告)日：2021-06-29
申请号：US16040269
申请日：2018-07-19
Applicant: Johnson Controls Technology Company
Inventor： Zhiwei Huang , Neelkanth S. Gupte
Abstract: Embodiments of the present disclosure are directed to a climate management system that includes a heat exchanger having a first set of microchannel coils fluidly coupled to a first circuit of the climate management system and a second set of microchannel coils fluidly coupled to a second circuit of the climate management system, where the first circuit and the second circuit are fluidly separate from one another, and where the first set of microchannel coils and the second set of microchannel coils are disposed in an alternating arrangement along a length of the heat exchanger such that the first set of microchannel coils and the second set of microchannel coils are interlaced in the heat exchanger.
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公开(公告)号：US20200370782A1
公开(公告)日：2020-11-26
申请号：US16441535
申请日：2019-06-14
Applicant: Johnson Controls Technology Company
Inventor： Manjur Tamboli , Neelkanth S. Gupte , Sarjerao D. Pingale
Abstract: A curb assembly for a heating, ventilation, and/or air conditioning (HVAC) system includes a frame configured to couple to a curb of a structure, a pedestal system configured to couple to a housing of the HVAC system and to the frame, such that the pedestal system extends from the housing to the frame, and an adjustable duct connector configured to fluidly couple an air flow passage of the housing with ductwork of the structure. The pedestal system is configured to enclose a space formed between the frame and the housing and the adjustable duct connector configured to be disposed within the space.
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公开(公告)号：US20200309393A1
公开(公告)日：2020-10-01
申请号：US16366861
申请日：2019-03-27
Applicant: Johnson Controls Technology Company
Inventor： Anil V. Bhosale , Ketan S. Khedkar , Nikhil N. Naik , Hambirarao S. Sawant , Neelkanth S. Gupte
Abstract: A heating, ventilation, and/or air conditioning (HVAC) system, includes a housing having a wall with an exterior surface configured to be exposed to an ambient environment. The HVAC system further includes a first heat exchanger disposed within the housing and forming part of a refrigerant circuit of the HVAC system and a second heat exchanger disposed within the housing and forming part of the refrigerant circuit, in which the second heat exchanger includes a coil coupled to the wall, such that the coil and the wall are configured to transfer heat between the ambient environment and refrigerant passing through the second heat exchanger.
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