摘要:
A capping shroud for a fluid ejection device is disclosed as one embodiment of the invention. A fluid ejection assembly may include the fluid ejection die and the capping shroud. The capping shroud has an aperture therethrough and surrounds the fluid ejection die. A top surface of the capping shroud is substantially flush with a top surface of the fluid ejection die.
摘要:
The present invention relates to a carriage for use in a printing device, the carriage including a carriage body with a bearing structure configured to support such carriage body for movement along a reference track. The carriage also includes a printhead anchored to the carriage body, and aligned directly relative to the carriage bearing structure.
摘要:
The valve is operable with a bubble generator that provides a restricted flow of air bubbles into a reservoir of an ink-jet pen to relieve excessive back pressure in the pen. The valve includes housed operating liquid that closes the valve in the event that the pen is tipped out of an upright orientation. A hydrophobic air-porous vent is provided for permitting passage of air bubbles through the valve into the reservoir while prohibiting the flow of the operating liquid through the vent.
摘要:
An evacuated structure removes air accumulated within a container that contains material held at a first pressure. The evacuated structure has a shell that includes a slowly defusing air-permeable material. The air permeable material interfaces to a volume of space evacuated to a second pressure less than the first pressure within the container. Unwanted air that accumulates within the container is drawn into the volume of space of the evacuated structure due to the difference in pressure between the interior of the container and the interior of the shell.
摘要:
An inkjet storage container sealing mechanism is comprised of a cover, a receptacle, a gasket compressed normal to its insertion and a support member to maintain a seal that is resistant to ink and air penetration. The receptacle has sidewalls that form an opening. A gasket is stretched over a portion the cover, then the gasket and the portion of the cover is inserted into the opening of the receptacle. The gasket forms a seal between the cover and the receptacle. The compressive forces acting on the gasket to form the seal do not contribute additional forces to a mechanical joining mechanism, which attaches the cover to the receptacle. The support member prevents the sidewalls of the receptacle from deflecting to help maintain the seal.
摘要:
A method and apparatus for attaching the outer leads of a semiconductor package (preferably a Tape Automated Bonded circuit) to the traces on a printed circuit board is described. The outer leads of the package are configured in an angled orientation so that the tip of each lead extends downwardly below the lower surface of the package. As a result, placement of the package against the circuit board causes the leads to be biased downwardly against the traces. In order to accomplish this, the package is secured to the board using a rigid frame structure. The frame structure urges the edges of the package against the board. This insures that the leads make electrical contact with the traces in a fast and efficient manner, while avoiding problems associated with a lack of lead coplanarity.