公开(公告)号：US20200035451A1

公开(公告)日：2020-01-30

申请号：US16511197

申请日：2019-07-15

Applicant: KLA-Tencor Corporation

Inventor： Donald Pettibone

IPC: H01J37/28 ,  H01J37/244 ,  G01N15/02

Abstract: A system is disclosed. The system includes a stage assembly configured to receive a specimen and maintain a height of the specimen at a first working distance height during a first characterization mode and an additional working distance height during an additional characterization mode. The system further includes an illumination source configured to generate an illumination beam. The system further includes an illumination arm including a set of optical elements configured to direct a portion of the illumination beam including illumination of a first wavelength to the specimen during the first characterization mode, and direct a portion of the illumination beam including illumination of an additional wavelength to the specimen during the additional characterization mode. The system further includes a detector assembly configured to receive illumination emanated from the specimen, and a controller configured to determine a specimen height value based on the illumination received by the detector assembly.

公开(公告)号：US09747670B2

公开(公告)日：2017-08-29

申请号：US14313748

申请日：2014-06-24

Applicant: KLA-Tencor Corporation

Inventor： Donald Pettibone

IPC: G06K9/62 ,  G06T5/00 ,  G06T7/00 ,  G06T5/50

CPC classification number: G06T5/002 ,  G06T5/50 ,  G06T7/001 ,  G06T2207/30148

Abstract: Improvement of wafer surface inspection sensitivity includes acquiring a first inspection image from the surface of the wafer, generating a reference image by applying a thresholding function to the first image in order to isolate a speckle signal component of the first image induced by wafer surface roughness, acquiring one or more measurement inspection images from the surface of the wafer, and generating a difference image by subtracting the generated one or more reference images from the acquired one or more measurement inspection images.

公开(公告)号：US09726615B2

公开(公告)日：2017-08-08

申请号：US14804296

申请日：2015-07-20

Applicant: KLA-Tencor Corporation

Inventor： Chuanyong Huang ,  Qing Li ,  Donald Pettibone ,  Buzz Graves

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N2021/8825

Abstract: An inspection apparatus for simultaneous dark field (DF) and differential interference contrast (DIC) inspection includes an illumination source and a sample stage configured to secure a sample. The inspection apparatus includes a first sensor, a second sensor and an optical sub-system. The optical sub-system includes an objective, one or more optical elements arranged to direct, through the objective, illumination from the one or more illumination sources to a surface of the sample. The objective is configured to collect a signal from the surface of the sample, wherein the collected signal includes a scattering-based signal and/or a phase-based signal from the sample. The inspection apparatus includes one or more separation optical elements arranged to spatially separate the collected signal into a DF signal and a DIC signal by directing the DF signal and the DIC signal along a DF path and DIC path respectively.

公开(公告)号：US20150003721A1

公开(公告)日：2015-01-01

申请号：US14313748

申请日：2014-06-24

Applicant: KLA-Tencor Corporation

Inventor： Donald Pettibone

IPC: G06T7/00 ,  G06T5/00

CPC classification number: G06T5/002 ,  G06T5/50 ,  G06T7/001 ,  G06T2207/30148

Abstract: Improvement of wafer surface inspection sensitivity includes acquiring a first inspection image from the surface of the wafer, generating a reference image by applying a thresholding function to the first image in order to isolate a speckle signal component of the first image induced by wafer surface roughness, acquiring one or more measurement inspection images from the surface of the wafer, and generating a difference image by subtracting the generated one or more reference images from the acquired one or more measurement inspection images.

Abstract translation: 晶片表面检查灵敏度的提高包括从晶片的表面获取第一检查图像，通过对第一图像施加阈值函数来生成参考图像，以便隔离由晶片表面粗糙度引起的第一图像的斑点信号分量， 从晶片的表面获取一个或多个测量检查图像，并且通过从所获取的一个或多个测量检查图像中减去所生成的一个或多个参考图像来生成差分图像。

公开(公告)号：US20140361152A1

公开(公告)日：2014-12-11

申请号：US14296425

申请日：2014-06-04

Applicant: KLA-Tencor Corporation

Inventor： Ivan Maleev ,  Donald Pettibone

IPC: G01N21/21 ,  G01N21/01 ,  G02B27/28 ,  G02B5/30 ,  G02B1/02

CPC classification number: G02B1/02 ,  G01N21/8806 ,  G01N21/9501 ,  G01N2021/8848 ,  G02B5/3083 ,  G02B27/286

Abstract: A polarization control device includes a first wave plate having a first surface profile and a second wave plate having a second surface profile complimentary to the first surface profile. The optical axis of the first wave plate is orthogonal to the optical axis of the second wave plate. The first wave plate and the second wave plate are positioned to align the first surface profile with the second surface profile and maintain a constant thickness across the polarization control device. The first wave plate and the second wave plate may control polarization rotation as a continuous function of transverse position across a pupil plane of an optical system. The first wave plate and the second wave plate are separated by a sufficiently small distance so as to limit wave front distortion below a selected level.

Abstract translation: 偏振控制装置包括具有第一表面轮廓的第一波片和具有与第一表面轮廓互补的第二表面轮廓的第二波片。 第一波片的光轴与第二波片的光轴正交。 第一波片和第二波片被定位成使第一表面轮廓与第二表面轮廓对准，并且在偏振控制装置上保持恒定的厚度。 第一波片和第二波片可以将偏振旋转控制为跨越光学系统的光瞳平面的横向位置的连续函数。 第一波片和第二波片被分开足够小的距离，以将波前失真限制在低于选定水平。