公开(公告)号：US09171364B2

公开(公告)日：2015-10-27

申请号：US14168011

申请日：2014-01-30

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Tao Luo ,  Lisheng Gao ,  Eugene Shifrin ,  Aravindh Balaji

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于晶片图案确定晶片护理区域的特征。 确定特征包括确定护理区域的位置，为每个护理区域确定晶片图案中的至少一个感兴趣模式（POI），允许任何护理区域具有自由形状，允许护理区域 大于框架图像并且为至少一个护理区域选择两个或更多个POI。 该方法还包括使用检查系统搜索为晶片生成的图像中的POI。 此外，该方法包括通过确定图像中的护理区域的位置并基于图像中的护理区域的位置将一个或多个缺陷检测方法应用于图像来检测晶片上的缺陷。

公开(公告)号：US20130188859A1

公开(公告)日：2013-07-25

申请号：US13742259

申请日：2013-01-15

Applicant: KLA-Tencor Corporation

Inventor： Tao Luo ,  Yong Zhang ,  Stephanie Chen

IPC: G06T7/00

CPC classification number: G06T7/0002 ,  G06T7/0004 ,  G06T7/13 ,  G06T7/143 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned.

Abstract translation: 提供了用于分割用于晶片检查的像素的方法和系统。 一种方法包括基于由检查系统为晶片获取的图像中的各个像素的特性来确定各个像素的统计量。 该方法还包括基于统计量将各个像素分配给第一段。 此外，该方法包括检测第一段的图像中的第一段之间的一个或多个边缘，并且通过将一个或多个边缘跨越与晶片的图像对应的区域来生成边缘图。 该方法还包括通过将第一段和边缘图应用于晶片的图像来将各个像素分配给第二段，从而分割图像。 基于分配了各个像素的第二段执行缺陷检测。

公开(公告)号：US20160290934A1

公开(公告)日：2016-10-06

申请号：US15088081

申请日：2016-03-31

Applicant: KLA-Tencor Corporation

Inventor： Keith Wells ,  Xiaochun Li ,  Lisheng Gao ,  Tao Luo ,  Markus Huber

IPC: G01N21/95 ,  H01L21/66 ,  G06T7/00 ,  H01L21/67

CPC classification number: G01N21/9501 ,  G01N2201/061 ,  G01N2201/06113 ,  G01N2201/068 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L22/12

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一个系统包括被配置为基于印刷在晶片上的设计的信息来生成渲染图像的一个或多个计算机子系统。 渲染图像是由光学检查子系统为印刷在晶片上的设计产生的图像的模拟。 计算机子系统还被配置为将渲染图像与由光学检查子系统产生的晶片的光学图像进行比较。 该设计使用标线印在晶片上。 此外，计算机子系统被配置为基于比较的结果来检测晶片上的缺陷。

公开(公告)号：US20150178907A1

公开(公告)日：2015-06-25

申请号：US14563845

申请日：2014-12-08

Applicant: KLA-Tencor Corporation

Inventor： Yong Zhang ,  Tao Luo ,  Chaohong Wu ,  Stephanie Chen ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T7/33 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于如何将一个或多个设计剪辑出现在由晶片的晶片检查过程产生的输出中来改变一个或多个设计剪辑。 该方法还包括在晶片检查过程中将一个或多个改变的设计剪辑与晶片产生的输出对准。 此外，该方法包括基于与一个或多个改变的设计剪辑对准的输出来检测晶片上的缺陷。