公开(公告)号：US08650755B2

公开(公告)日：2014-02-18

申请号：US11485567

申请日：2006-07-12

Applicant: Ke-Chin Lee ,  Chih-Sheng Wang ,  Chi-Te Chin

Inventor： Ke-Chin Lee ,  Chih-Sheng Wang ,  Chi-Te Chin

IPC: B23P6/00

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/0283 ,  Y10T29/49353 ,  Y10T29/49377 ,  Y10T29/49391 ,  Y10T29/53113

Abstract: A method of making a length of heat conduction pipe from a long conduction pipe filled with heat transfer medium in vacuum environment comprises: a material preparation step in which a long heat conduction pipe with predetermined length sealed at both ends is prepared, a squelching and cutting step in which squelching and cutting is conducted on pre-determined point of said long heat conduction pipe in vacuum environment; a sealing step by which the cut end of said long heat conduction pipe is brazed and sealed in vacuum. There also provides an equipment for performing the method.

Abstract translation: 在真空环境中从传热介质填充的长导电管制造长度的导热管的方法包括：制备在两端密封有预定长度的长导热管的材料制备步骤，压制切割 在真空环境中对所述长导热管的预定点进行静压切割的步骤; 密封步骤，将所述长导热管的切断端钎焊并真空密封。 还提供了一种执行该方法的设备。

公开(公告)号：US08157421B2

公开(公告)日：2012-04-17

申请号：US12683485

申请日：2010-01-07

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: F21V29/00

CPC classification number: F21V29/51 ,  F21K9/23 ,  F21V19/02 ,  F21V29/006 ,  F21V29/507 ,  F21V29/76 ,  F21V29/763 ,  F21V29/777 ,  F21W2131/103 ,  F21Y2115/10

Abstract: A light emitting diode (LED) lamp including a connector, an LED module, an angle adjusting ring, an isolating ring, and a heat dissipating module is provided. The LED module is electrically connected to the connector and has at least one LED unit. The angle adjusting ring is disposed between the LED module and the connector for rotating the LED module, and includes at least one locking element for fixing the LED module on the connector. The isolating ring is disposed between the connector and the angle adjusting ring. The heat dissipating module is in contact with the LED module for preventing the LED module from overheating. The heat dissipating module includes at least one heat pipe and a plurality of fins connecting to the at least one heat pipe, where the at least one LED unit is disposed on the at least one heat pipe.

Abstract translation: 提供了包括连接器，LED模块，角度调节环，隔离环和散热模块的发光二极管（LED）灯。 LED模块电连接到连接器并且具有至少一个LED单元。 角度调节环设置在LED模块和用于旋转LED模块的连接器之间，并且包括用于将LED模块固定在连接器上的至少一个锁定元件。 隔离环设置在连接器和角度调整环之间。 散热模块与LED模块接触，防止LED模块过热。 散热模块包括至少一个热管和连接到至少一个热管的多个翅片，其中至少一个LED单元设置在至少一个热管上。

公开(公告)号：US20100181593A1

公开(公告)日：2010-07-22

申请号：US12588125

申请日：2009-10-06

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: H01L33/00

CPC classification number: H01L33/642 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.

Abstract translation: 一种LED芯片封装，包括两相流传热装置，至少一个LED芯片，金属引线框架和封装材料。 两相流传热装置具有至少一个平坦表面。 LED芯片直接或间接地结合或粘合到两相流动传热装置的平坦表面上。 由LED芯片产生的热量可以通过诸如热管，蒸气室等的两相流传热装置容易地从LED芯片导出，以防止热量积聚在LED芯片中从而延伸 LED芯片的使用持续时间，并防止LED芯片由于热量积聚而引起的发光性能的恶化。

公开(公告)号：US20100266864A1

公开(公告)日：2010-10-21

申请号：US12588128

申请日：2009-10-06

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: B32B15/16 ,  B32B15/01

CPC classification number: B32B15/01 ,  B22F7/08 ,  F28D15/0233 ,  F28D15/046 ,  F28F2255/18 ,  Y10T428/12063 ,  Y10T428/1209

Abstract: An ultra-thin heat pipe comprises a flat metal tube and one or more sintered powder portions. The flat metal tube has an upper tube wall, a lower tube wall and two lateral walls connecting with the upper tube wall and the lower tube wall. The sintered powder portions extends axially and are formed on an inner face of at least one of the upper tube wall, the lower tube wall and the lateral walls such that vapor passage space is formed at one or more sides of the sintered powder portions.

Abstract translation: 超薄热管包括扁平金属管和一个或多个烧结粉末部分。 扁平金属管具有上管壁，下管壁和与上管壁和下管壁连接的两个侧壁。 烧结粉末部分轴向延伸并且形成在上管壁，下管壁和侧壁中的至少一个的内表面上，使得在烧结粉末部分的一侧或多侧形成蒸气通道空间。

公开(公告)号：US20100259942A1

公开(公告)日：2010-10-14

申请号：US12802965

申请日：2010-06-17

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: F21V29/00

CPC classification number: F21V29/51 ,  F21K9/233 ,  F21V15/01 ,  F21V29/004 ,  F21V29/507 ,  F21V29/763 ,  F21V29/773 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10

Abstract: An LED lamp has a metal housing, a sintered heat pipe and an LED. The metal housing has an outer surface, an inner surface, a bottom and an opening defined by an inner edge. The sintered heat pipe engages the inner surface and the bottom and the inner edge of the metal housing. The LED is attached to a flattened area of the bottom portion of the sintered heat pipe. The sintered heat pipe rapidly transports heat generated by the LED to the metal housing which then transfers heat to the environment. The sintered heat pipe makes effective heat transportation possible and allows the use of high-power LEDs or multiple LED's within one lamp.

Abstract translation: LED灯具有金属外壳，烧结热管和LED。 金属外壳具有由内边缘限定的外表面，内表面，底部和开口。 烧结的热管接合金属外壳的内表面和底部以及内边缘。 LED连接到烧结热管的底部的平坦区域。 烧结的热管快速地将由LED产生的热量输送到金属壳体，然后将热量传递到环境中。 烧结热管使得有效的热传输成为可能，并允许在一个灯内使用大功率LED或多个LED。

公开(公告)号：US20100177521A1

公开(公告)日：2010-07-15

申请号：US12319995

申请日：2009-01-14

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: F21V29/00

CPC classification number: F21V29/717 ,  F21K9/233 ,  F21V29/51 ,  F21V29/74 ,  F21V29/76 ,  F21V29/763 ,  F21V29/767 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10

Abstract: An LED lamp has a metal housing, a heat pipe and an LED. The metal housing has an outer surface, an inner surface, a bottom and an opening defined by an inner edge. The heat pipe engages the inner surface, the bottom and the inner edge of the metal housing. The LED is attached to the bottom portion of the heat pipe. The heat pipe rapidly transports heat generated by the LED to the metal housing which then transfers heat to the environment. The heat pipe makes effective heat transportation possible and allows the use of high-power LEDs or multiple LED's within one lamp.

Abstract translation: LED灯具有金属外壳，热管和LED。 金属外壳具有由内边缘限定的外表面，内表面，底部和开口。 热管接合金属外壳的内表面，底部和内边缘。 LED连接到热管的底部。 热管将LED产生的热量快速传输到金属外壳，然后将热量传递给环境。 热管可以有效地传热，并允许在一个灯内使用大功率LED或多个LED。

公开(公告)号：US07581878B2

公开(公告)日：2009-09-01

申请号：US11317120

申请日：2005-12-22

Applicant: Ke-Chin Lee ,  Chen-Chuan Lin ,  Chi-Te Chin ,  Li-Kai Wu

Inventor： Ke-Chin Lee ,  Chen-Chuan Lin ,  Chi-Te Chin ,  Li-Kai Wu

IPC: G01N25/18 ,  G01N25/20 ,  G01K17/06

CPC classification number: G01N25/18

Abstract: The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Abstract translation: 测量系统通过将加热端子处的金属加热块的温度和散热端子的散热水套的温度设定为加热端子和端子导电器件之间的温度差，并且判断导热能力 通过比较金属加热块的冷却速度，根据实际的温度降低过程中的金属加热块的热量的变化来获得相对功率值，导热装置。 可以通过相对于最大功率值的参数转换来快速获得导热装置的最大导热量（Qmax值）。 在确认标准样品的冷却曲线（冷却速度）的情况下，可以通过使用冷却曲线来实现对导热装置的导热效率进行筛选的目的。

公开(公告)号：US20070289134A1

公开(公告)日：2007-12-20

申请号：US11485567

申请日：2006-07-12

Applicant: Ke-Chin Lee ,  Chih-Sheng Wang ,  Chi-Te Chin

Inventor： Ke-Chin Lee ,  Chih-Sheng Wang ,  Chi-Te Chin

IPC: B23P6/00 ,  B23P15/26

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/0283 ,  Y10T29/49353 ,  Y10T29/49377 ,  Y10T29/49391 ,  Y10T29/53113

Abstract: A method of making a length of heat conduction pipe from a long conduction pipe filled with heat transfer medium in vacuum environment comprises: a material preparation step in which a long heat conduction pipe with predetermined length sealed at both ends is prepared, a squelching and cutting step in which squelching and cutting is conducted on pre-determined point of said long heat conduction pipe in vacuum environment; a sealing step by which the cut end of said long heat conduction pipe is brazed and sealed in vacuum. There also provides an equipment for performing the method.

Abstract translation: 在真空环境中从传热介质填充的长导电管制造长度的导热管的方法包括：制备在两端密封有预定长度的长导热管的材料制备步骤，压制切割 在真空环境中对所述长导热管的预定点进行静压切割的步骤; 密封步骤，将所述长导热管的切断端钎焊并真空密封。 还提供了一种执行该方法的设备。