公开(公告)号：US07972650B1

公开(公告)日：2011-07-05

申请号：US11457400

申请日：2006-07-13

申请人： Kenneth H. Church ,  Patrick Clark ,  Dongjiang Xu ,  Lance Swan ,  Bryan Irwin ,  Vladimir Pelekhaty

发明人： Kenneth H. Church ,  Patrick Clark ,  Dongjiang Xu ,  Lance Swan ,  Bryan Irwin ,  Vladimir Pelekhaty

IPC分类号： B05D5/12 ,  B05D3/00

CPC分类号： H05K3/125 ,  H01L21/4867 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/03 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24147 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/82101 ,  H01L2224/82801 ,  H01L2224/82874 ,  H01L2224/82948 ,  H01L2224/82986 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/14 ,  H05K1/0284 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/3484 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/06 ,  H01L2924/00

摘要： A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

摘要翻译： 用于制造三维空间中的电子电路的方法通过直接写入导线来提供电路内的电子元件互连。 该方法可以包括观察使用视觉系统的直接写入系统的直接书写工具，至少部分地基于观察步骤确定直接书写工具的正确放置，并且使用适当的位置直接在三维中写入导线。 直接写入可能在表面或自由空间中。 该方法可以包括堆叠多个芯片以提供具有顶表面的边缘和沿顶部延伸的边缘，并且通过沿着边缘之一直接写入导电线来互连芯片的连接。

公开(公告)号：US07365701B2

公开(公告)日：2008-04-29

申请号：US10072739

申请日：2002-02-08

申请人： Douglas H. Werner ,  Pingjuan L. Werner ,  Kenneth H. Church ,  Michael John Wilhelm

发明人： Douglas H. Werner ,  Pingjuan L. Werner ,  Kenneth H. Church ,  Michael John Wilhelm

IPC分类号： H01Q1/24

CPC分类号： H01Q1/38 ,  H01Q15/0093

摘要： An optimal configuration for at least one antenna and/or at least one frequency selective surface is generated. A configuration of elements is generated by selecting a simple configuration of at least one element and applying a genetic algorithm to the simple configuration to generate a configuration optimized for various characteristics. A stochastic process may be used to randomly select an arrangement of elements as the simple antenna configuration and to select elements that connect the randomly selected elements to produce a stochastic configuration to which the genetic algorithm is then applied. Alternatively, an iterated or semi-iterated process may be applied to the simple antenna configuration to produce a fractal or a semi-fractal configuration, respectively, to which the genetic algorithm is then applied. Also, the elements may be optimized independently.

摘要翻译： 产生用于至少一个天线和/或至少一个频率选择表面的最佳配置。 通过选择至少一个元素的简单配置并将遗传算法应用于简单配置以生成针对各种特征优化的配置来生成元素的配置。 可以使用随机过程来随机选择元素的布置作为简单天线配置，并且选择连接随机选择的元素以产生随后应用遗传算法的随机配置的元素。 或者，可以将迭代或半迭代过程应用于简单天线配置，以分别产生分形或半分形配置，然后应用遗传算法。 此外，元件可以独立地优化。