公开(公告)号：US07538642B2

公开(公告)日：2009-05-26

申请号：US11637710

申请日：2006-12-13

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P5/02

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本，提高切削性，在形成于一个电介质基板1b的波导端子2b的周围配置有多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在焊料7的两侧 通过焊接连接波导端子。

公开(公告)号：US20070085636A1

公开(公告)日：2007-04-19

申请号：US11637713

申请日：2006-12-13

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P1/04

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

公开(公告)号：US07084723B2

公开(公告)日：2006-08-01

申请号：US11305166

申请日：2005-12-19

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P5/02

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, ot reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本，提高机械加工性，在形成于一个电介质基板1b的波导端子2b周围设置多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在 焊料7，从而通过焊接连接波导端子。

公开(公告)号：US20070085635A1

公开(公告)日：2007-04-19

申请号：US11637710

申请日：2006-12-13

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P1/04

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本和提高机械加工性，在形成于一个电介质基板1b的波导端子2b周围设置多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在 焊料7，从而通过焊接连接波导端子。

公开(公告)号：US20060097828A1

公开(公告)日：2006-05-11

申请号：US11305166

申请日：2005-12-19

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P1/04

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, ot reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

公开(公告)号：US07705697B2

公开(公告)日：2010-04-27

申请号：US11637713

申请日：2006-12-13

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P5/02

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本，提高切削性，在形成于一个电介质基板1b的波导端子2b的周围配置有多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在焊料7的两侧 通过焊接连接波导端子。

公开(公告)号：US20050190021A1

公开(公告)日：2005-09-01

申请号：US10994678

申请日：2004-11-23

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H05K1/14 ,  H01L23/12 ,  H01P1/04 ,  H05K1/02 ,  H05K3/36 ,  H01P5/12

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, ot reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本，提高机械加工性，在形成于一个电介质基板1b的波导端子2b周围设置多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在 焊料7，从而通过焊接连接波导端子。