公开(公告)号：US07538642B2

公开(公告)日：2009-05-26

申请号：US11637710

申请日：2006-12-13

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P5/02

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本，提高切削性，在形成于一个电介质基板1b的波导端子2b的周围配置有多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在焊料7的两侧 通过焊接连接波导端子。

公开(公告)号：US20070085636A1

公开(公告)日：2007-04-19

申请号：US11637713

申请日：2006-12-13

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P1/04

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

公开(公告)号：US07084723B2

公开(公告)日：2006-08-01

申请号：US11305166

申请日：2005-12-19

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P5/02

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, ot reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本，提高机械加工性，在形成于一个电介质基板1b的波导端子2b周围设置多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在 焊料7，从而通过焊接连接波导端子。

公开(公告)号：US20050140470A1

公开(公告)日：2005-06-30

申请号：US11070231

申请日：2005-03-03

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： H01L23/12 ,  H01L23/66 ,  H01L25/04 ,  H01L25/18 ,  H01P1/32 ,  H01P1/20

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

公开(公告)号：US07756503B2

公开(公告)日：2010-07-13

申请号：US11449692

申请日：2006-06-09

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： H04B1/26

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

摘要翻译： 迄今为止，在定位了多个波导端子的高频模​​块中使用多个封装，导致诸如封装之间的连接线的特性劣化，安装和连接连接线时的组装方便性降低的问题， 增加成本等等。 为了解决这些问题，在多层电介质基板中形成具有金属化部分或全部的多个空腔。 多层电介质基板设置有多个波导端子，微带线路 - 波导转换器，RF线，偏置和控制信号布线以及偏置和控制信号焊盘。 高频电路安装在腔内并用密封和盖子密封。 这旨在减少包装数量，提高性能，改进制造和降低成本。

公开(公告)号：US07190243B2

公开(公告)日：2007-03-13

申请号：US10994678

申请日：2004-11-23

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P5/02

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

公开(公告)号：US20070040735A1

公开(公告)日：2007-02-22

申请号：US10555651

申请日：2005-03-24

申请人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

发明人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

IPC分类号： G01S7/28

CPC分类号： H05K1/167 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semiconductor, and is arranged within a region corresponding to the electromagnetic shielding members. The second signal via is arranged outside the region, and is connected to an external terminal for a bias and control signal. The internal-layer signal line connects between the first and the second signal vias. The internal-layer ground conductor is arranged around the first and the second signal vias and the internal-layer signal line. The ground vias are arranged around the first and the second signal vias and the internal-layer signal line, on the internal-layer ground conductor. A resistance film is provided on at least one of an upper surface and a lower surface of the internal-layer signal line.

摘要翻译： 多层介质基板包括第一信号通孔，第二信号通孔，内层信号线，内层接地导体和接地通孔。 第一信号通孔连接到高频半导体的偏置和控制信号端子，并且被布置在对应于电磁屏蔽构件的区域内。 第二信号通孔布置在区域外部，并且连接到用于偏置和控制信号的外部端子。 内层信号线连接在第一和第二信号通孔之间。 内层接地导体围绕第一和第二信号通孔和内层信号线布置。 接地通孔围绕第一和第二信号通孔和内层信号线布置在内层接地导体上。 电阻膜设置在内层信号线的上表面和下表面中的至少一个上。

公开(公告)号：US20070120732A1

公开(公告)日：2007-05-31

申请号：US11449692

申请日：2006-06-09

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： G01S13/00 ,  G01S7/28

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

摘要翻译： 迄今为止，在定位了多个波导端子的高频模​​块中使用多个封装，导致诸如封装之间的连接线的特性劣化，安装和连接连接线时的组装方便性降低的问题， 增加成本等等。 为了解决这些问题，在多层电介质基板中形成具有金属化部分或全部的多个空腔。 多层电介质基板设置有多个波导端子，微带线路 - 波导转换器，RF线，偏置和控制信号布线以及偏置和控制信号焊盘。 高频电路安装在腔内并用密封和盖子密封。 这旨在减少包装数量，提高性能，改进制造和降低成本。

公开(公告)号：US07336221B2

公开(公告)日：2008-02-26

申请号：US10555651

申请日：2005-03-24

申请人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

发明人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

IPC分类号： G01S7/28

CPC分类号： H05K1/167 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semiconductor, and is arranged within a region corresponding to the electromagnetic shielding members. The second signal via is arranged outside the region, and is connected to an external terminal for a bias and control signal. The internal-layer signal line connects between the first and the second signal vias. The internal-layer ground conductor is arranged around the first and the second signal vias and the internal-layer signal line. The ground vias are arranged around the first and the second signal vias and the internal-layer signal line, on the internal-layer ground conductor. A resistance film is provided on at least one of an upper surface and a lower surface of the internal-layer signal line.

摘要翻译： 多层介质基板包括第一信号通孔，第二信号通孔，内层信号线，内层接地导体和接地通孔。 第一信号通孔连接到高频半导体的偏置和控制信号端子，并且被布置在对应于电磁屏蔽构件的区域内。 第二信号通孔布置在区域外部，并且连接到用于偏置和控制信号的外部端子。 内层信号线连接在第一和第二信号通孔之间。 内层接地导体围绕第一和第二信号通孔和内层信号线布置。 接地通孔围绕第一和第二信号通孔和内层信号线布置在内层接地导体上。 电阻膜设置在内层信号线的上表面和下表面中的至少一个上。

公开(公告)号：US20070085635A1

公开(公告)日：2007-04-19

申请号：US11637710

申请日：2006-12-13

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P1/04

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

摘要翻译： 通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。 在本发明中，为了降低成本和提高机械加工性，在形成于一个电介质基板1b的波导端子2b周围设置多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在 焊料7，从而通过焊接连接波导端子。