公开(公告)号：US09197217B2

公开(公告)日：2015-11-24

申请号：US13871030

申请日：2013-04-26

Applicant: LAPIS Semiconductor Co., Ltd.

Inventor： Kazuya Yamada ,  Toshihisa Sone ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC: G01R21/00 ,  H03L1/02 ,  H03L1/04 ,  G01R35/04 ,  G01R22/10 ,  H03K3/011 ,  G01R1/44

CPC classification number: H03L1/026 ,  G01R1/44 ,  G01R21/00 ,  G01R22/061 ,  G01R22/10 ,  G01R35/04 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/3025 ,  H03K3/011 ,  H03L1/02 ,  H03L1/027 ,  H03L1/04 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.

Abstract translation: 半导体器件包括以特定频率振荡的振荡器，集成了检测周围温度的温度传感器的半导体集成电路和与振荡器电连接的控制器，并且校正了振荡频率的温度相关误差 基于由温度传感器检测到的温度的振荡器和一体地密封振荡器和半导体集成电路的密封构件。