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公开(公告)号：US20240132655A1
公开(公告)日：2024-04-25
申请号：US18280545
申请日：2022-09-28
Applicant: LG Chem, Ltd.
Inventor： Do Yeon Kim , Young Jo Yang , Jeong Hyun Lee , Yang Gu Kang
CPC classification number: C08G18/4018 , C08G18/246 , C08G18/73 , C08K3/22 , C08K2003/2227 , C08K2201/014
Abstract: A composition which can be cured at room temperature; and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesion force, and excellent thermal conductivity, is provided. In addition, the composition can achieve the low adhesion force, and the like without using a plasticizer or the like, or in a state where even if the plasticizer is used, the use ratio thereof is minimized. A product containing the composition, or a cured body thereof is also provided.
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公开(公告)号：US20220306796A1
公开(公告)日：2022-09-29
申请号：US17616825
申请日：2020-09-09
Applicant: LG Chem, Ltd.
Inventor： Jeong Hyun Lee , Yang Gu Kang , Eun Suk Park , Hyoung Sook Park , Young Jo Yang
IPC: C08G18/42 , C08K3/22 , C08G18/73 , C08G18/24 , H01M50/204 , H01M50/227 , H01M50/231 , H01M50/222 , H01M50/229 , H01M10/653
Abstract: A curable composition capable of securing a waiting time after curing starts, and efficiently controlling the relevant waiting time is provided. The curable composition also controls a curing rate after the waiting time to suit the application. A battery module, a battery pack or an automobile comprising a cured product of the curable composition is also provided.
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Patent Agency Ranking
公开(公告)号：US20220073671A1
公开(公告)日：2022-03-10
申请号：US17421148
申请日：2020-09-09
Applicant: LG Chem, Ltd.
Inventor： Jeong Hyun Lee , Yang Gu Kang , Eun Suk Park , Hyoung Sook Park , Young Jo Yang
Abstract: The present application may provide a curable composition capable of securing a waiting time after curing starts, efficiently controlling the relevant waiting time according to the application, and also controlling a curing rate after the waiting time to suit the application. A cured product of the curable composition may be included in a battery module, a battery pack or an automobile.
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公开(公告)号：US12297314B2
公开(公告)日：2025-05-13
申请号：US17613209
申请日：2020-09-09
Applicant: LG Chem, Ltd.
Inventor： Jeong Hyun Lee , Yang Gu Kang , Eun Suk Park , Hyoung Sook Park , Young Jo Yang
Abstract: A curable composition capable of securing a waiting time after curing starts, and efficiently controlling the relevant waiting time is provided. The curable composition also controls a curing rate after the waiting time to suit the application. A battery module, a battery pack or an automobile comprising a cured product of the curable composition is also provided.
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公开(公告)号：US20240262952A1
公开(公告)日：2024-08-08
申请号：US18280608
申请日：2022-09-28
Applicant: LG Chem, Ltd.
Inventor： Jeong Hyun Lee , Do Yeon Kim , Yang Gu Kang , Shin Hee Jun , Ha Na Lee , Ho Yeon Son
CPC classification number: C08G18/4277 , C08G18/4862 , C08K3/013 , C08K5/0016 , C08K2201/001
Abstract: The present application relates to a resin composition or a use thereof. In the present application, it is possible to provide a resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The present application can also provide a product comprising the curable composition or the cured body thereof.
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公开(公告)号：US20240124640A1
公开(公告)日：2024-04-18
申请号：US18276352
申请日：2022-09-28
Applicant: LG Chem, Ltd.
Inventor： Jeong Hyun Lee , Yang Gu Kang
CPC classification number: C08G18/4277 , C08G18/0838 , C08K3/22 , C08K5/11 , C08K2003/2227 , C08K2201/003
Abstract: A resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity is provided. Also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. A product comprising the curable composition or the cured body thereof is also provided.
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公开(公告)号：US20220289891A1
公开(公告)日：2022-09-15
申请号：US17634652
申请日：2020-08-19
Applicant: LG Chem, Ltd.
Inventor： Young Jo Yang , Eun Suk Park , Hyoung Sook Park , Yang Gu Kang , Jeong Hyun Lee
IPC: C08G18/02 , H01M50/209 , H01M50/293 , H01M50/249 , C08K3/013
Abstract: A resin composition capable of improving or minimizing a load applied to injection equipment, such as a nozzle, when injected by the equipment is provided. The resin composition includes a thermally conductive filler capable of exhibiting a desired thermal conductivity.
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