公开(公告)号：US20240191019A1

公开(公告)日：2024-06-13

申请号：US18283393

申请日：2022-09-28

Applicant: LG Chem, Ltd.

Inventor： Jeong Hyun Lee ,  Yang Gu Kang

IPC: C08G18/42 ,  C08G18/73 ,  C08K3/22

CPC classification number: C08G18/4277 ,  C08G18/73 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/003

Abstract: A resin composition comprising a polyol component, and a filler, and a use thereof are described. Such resin composition or a cured product thereof exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized.

公开(公告)号：US20220282067A1

公开(公告)日：2022-09-08

申请号：US17634359

申请日：2020-08-19

Applicant: LG Chem, Ltd.

Inventor： Young Jo Yang ,  Eun Suk Park ,  Hyoung Sook Park ,  Yang Gu Kang ,  Jeong Hyun Lee

IPC: C08K7/18 ,  C08K3/22 ,  H01M50/218

Abstract: A resin composition capable of improving or minimizing a load applied to injection equipment, such as a nozzle, when injected by the equipment is provided. The resin composition includes a thermally conductive filler capable of exhibiting a desired thermal conductivity.

公开(公告)号：US20240262948A1

公开(公告)日：2024-08-08

申请号：US18291017

申请日：2022-09-28

Applicant: LG CHEM, LTD.

Inventor： Jeong Hyun Lee ,  Yang Gu Kang

IPC: C08G18/10 ,  C08G18/42 ,  C08G18/48 ,  C08K3/22 ,  C08K5/11

CPC classification number: C08G18/10 ,  C08G18/4277 ,  C08G18/4845 ,  C08K3/22 ,  C08K5/11 ,  C08K2003/2227 ,  C08K2201/003 ,  C08K2201/014

Abstract: A resin composition and a use thereof are described herein. Such resin composition or a cured product thereof exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity, wherein the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. A product comprising the curable composition or the cured product thereof is also described.

公开(公告)号：US20240132657A1

公开(公告)日：2024-04-25

申请号：US18276797

申请日：2022-09-20

Applicant: LG Chem, Ltd.

Inventor： Do Yeon Kim ,  Ho Yeon Son ,  Yang Gu Kang ,  Shin Hee Jun ,  Ha Na Lee ,  Jeong Hyun Lee

IPC: C08G18/42 ,  C08G18/12 ,  C08G63/08 ,  C08G63/82 ,  C08G63/85 ,  C08K3/22 ,  C08K5/11 ,  C08L75/06 ,  H01M10/653

CPC classification number: C08G18/4277 ,  C08G18/12 ,  C08G18/4202 ,  C08G63/08 ,  C08G63/823 ,  C08G63/85 ,  C08K3/22 ,  C08K5/11 ,  C08L75/06 ,  H01M10/653 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/014 ,  C08L2201/02

Abstract: A curable composition or a thermal interface material exhibiting low adhesion force to a predetermined adherend while having a low density as well as exhibiting a high thermal conductivity is provided. It also has excellent flame retardant properties, and exhibits ejection properties and thixotropy suitable for processes in a state where halogen flame retardants or phosphorus-based flame retardants are not used, or the use ratio thereof is minimized.

公开(公告)号：US20240132656A1

公开(公告)日：2024-04-25

申请号：US18276358

申请日：2022-09-28

Applicant: LG Chem, Ltd.

Inventor： Jeong Hyun Lee ,  Yang Gu Kang ,  Do Yeon Kim

IPC: C08G18/42 ,  C08G18/48 ,  C08G18/73 ,  C08K3/22 ,  C08K5/11

CPC classification number: C08G18/4277 ,  C08G18/48 ,  C08G18/73 ,  C08K3/22 ,  C08K5/11 ,  C08K2003/2227 ,  C08K2201/005 ,  C08K2201/014

Abstract: A resin composition or a cured body thereof exhibiting low adhesion force to a predetermined adherend while exhibiting high thermal conductivity is provided. Also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. A product containing the curable composition or the cured body thereof is also provided.

公开(公告)号：US20220227914A1

公开(公告)日：2022-07-21

申请号：US17613209

申请日：2020-09-09

Applicant: LG Chem, Ltd.

Inventor： Jeong Hyun Lee ,  Yang Gu Kang ,  Eun Suk Park ,  Hyoung Sook Park ,  Young Jo Yang

IPC: C08G18/10 ,  C08G18/24 ,  C08G18/42 ,  C08G18/73 ,  C08K3/22 ,  C08K5/37 ,  H01M50/204

Abstract: A curable composition capable of securing a waiting time after curing starts, and efficiently controlling the relevant waiting time is provided. The curable composition also controls a curing rate after the waiting time to suit the application. A battery module, a battery pack or an automobile comprising a cured product of the curable composition is also provided.

公开(公告)号：US20240191071A1

公开(公告)日：2024-06-13

申请号：US18283574

申请日：2022-09-28

Applicant: LG Chem, Ltd.

Inventor： Jeong Hyun Lee ,  Do Yeon Kim ,  Yang Gu Kang ,  Shin Hee Jun ,  Ha Na Lee ,  Ho Yeon Son

IPC: C08L29/02 ,  C08K3/013

CPC classification number: C08L29/02 ,  C08K3/013

Abstract: A resin composition comprising an oil-modified polyol component, and a filler, or a cured product thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized, are described herein.

公开(公告)号：US20240182679A1

公开(公告)日：2024-06-06

申请号：US18283113

申请日：2022-09-28

Applicant: LG Chem, Ltd.

Inventor： Jeong Hyun Lee ,  Yang Gu Kang ,  Do Yeon Kim

IPC: C08K5/11 ,  C08G18/24 ,  C08G18/34 ,  C08G18/42 ,  C08G18/66 ,  C08G18/73 ,  C08K3/08

CPC classification number: C08K5/11 ,  C08G18/244 ,  C08G18/34 ,  C08G18/4277 ,  C08G18/6659 ,  C08G18/73 ,  C08K3/08 ,  C08K2003/0812 ,  C08K2201/003

Abstract: A resin composition comprising a polyol component comprising a first polyol compound containing a linear or branched hydrocarbon group having 3 or more carbon atoms bonded to a polyester skeleton or a polyether skeleton, and a second polyol compound without the linear or branched hydrocarbon group having 3 or more carbon atoms, and a use thereof are described herein. Such resin composition or a cured product thereof exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized.

公开(公告)号：US20240228690A9

公开(公告)日：2024-07-11

申请号：US18280545

申请日：2022-09-29

Applicant: LG Chem, Ltd.

Inventor： Do Yeon Kim ,  Young Jo Yang ,  Jeong Hyun Lee ,  Yang Gu Kang

IPC: C08G18/40 ,  C08G18/24 ,  C08G18/73 ,  C08K3/22

CPC classification number: C08G18/4018 ,  C08G18/246 ,  C08G18/73 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/014

Abstract: A composition which can be cured at room temperature; and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesion force, and excellent thermal conductivity, is provided. In addition, the composition can achieve the low adhesion force, and the like without using a plasticizer or the like, or in a state where even if the plasticizer is used, the use ratio thereof is minimized. A product containing the composition, or a cured body thereof is also provided.

公开(公告)号：US20240132655A1

公开(公告)日：2024-04-25

申请号：US18280545

申请日：2022-09-28

Applicant: LG Chem, Ltd.

Inventor： Do Yeon Kim ,  Young Jo Yang ,  Jeong Hyun Lee ,  Yang Gu Kang

IPC: C08G18/40 ,  C08G18/24 ,  C08G18/73 ,  C08K3/22

CPC classification number: C08G18/4018 ,  C08G18/246 ,  C08G18/73 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/014

Abstract: A composition which can be cured at room temperature; and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesion force, and excellent thermal conductivity, is provided. In addition, the composition can achieve the low adhesion force, and the like without using a plasticizer or the like, or in a state where even if the plasticizer is used, the use ratio thereof is minimized. A product containing the composition, or a cured body thereof is also provided.