公开(公告)号：US20210090924A1

公开(公告)日：2021-03-25

申请号：US16818296

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L33/00 ,  H01L25/075

Abstract: Discussed are a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part, wherein the vertical moving part provided at the substrate chuck lowers the substrate on to the fluid so that a force of buoyancy by the fluid is applied to the substrate.

公开(公告)号：US20220139747A1

公开(公告)日：2022-05-05

申请号：US17579289

申请日：2022-01-19

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L25/075 ,  H01L33/00

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, the device including an assembly chamber having a space for accommodating a fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part.

公开(公告)号：US20210090928A1

公开(公告)日：2021-03-25

申请号：US16818222

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/68 ,  H01L33/00 ,  H01L25/075 ,  H01L21/677

Abstract: Discussed is a substrate chuck including: a substrate support part for supporting a substrate having an assembly electrode; a vertical moving part which moves the substrate so that one surface of the substrate comes in contact with a fluid in a state in which the substrate is supported by the substrate support; an electrode connection part for applying power to the assembly electrode to generate an electric field so that semiconductor light-emitting diodes are placed at the predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a position change of at least one magnet; and a rotating part for rotating the substrate support part around a rotating shaft so that the substrate is placed in an upward or downward direction, wherein the rotating shaft is spaced apart from a center of the substrate support part at a predetermined distance.

公开(公告)号：US20210090925A1

公开(公告)日：2021-03-25

申请号：US16818469

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Sangsik JUNG ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L33/00 ,  H01L25/075

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

公开(公告)号：US20210090916A1

公开(公告)日：2021-03-25

申请号：US16842347

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.

公开(公告)号：US20210090909A1

公开(公告)日：2021-03-25

申请号：US16842323

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L25/075 ,  H01L21/68

Abstract: Discussed is a device for self-assembling semiconductor light-emitting including: a chip supply part to supply the semiconductor light-emitting diodes to the substrate in cooperation with magnets disposed in a plurality of rows to form the magnetic field, wherein the chip supply part includes: a chip accommodating part to accommodate the semiconductor light-emitting diodes; a vertical moving part to adjust a distance between the chip supply part and the magnets; a horizontal moving part to move the chip supply part such that the chip accommodating part is alternately overlapped with a part of the magnets; and a controller to drive the vertical and horizontal moving parts to control a position of the chip supply part, and the controller moves the chip supply part in at least one of a horizontal direction and a vertical direction at a predetermined path and a plurality of points existing on the predetermined path.