公开(公告)号：US20230266379A1

公开(公告)日：2023-08-24

申请号：US18041166

申请日：2020-08-24

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Sangsik JUNG ,  Junghun RHO ,  Bongwoon CHOI

IPC: G01R31/26 ,  H01L25/075

CPC classification number: G01R31/2601 ,  H01L25/0753

Abstract: A chip removing apparatus for a repair process of a μLED display comprises: a stage unit on which a substrate having at least one chip arranged thereon is mounted; a film stage on which an adhesive film is mounted such that the adhesive film is located on the substrate; a head having a pin which pressurizes the adhesive film such that the chip is attached to the lower surface of the adhesive film; and a head driver for moving the head.

公开(公告)号：US20220328716A1

公开(公告)日：2022-10-13

申请号：US17761839

申请日：2020-02-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Sangsik JUNG ,  Bongwoon CHOI

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/673

Abstract: Discussed is an assembly chamber containing a fluid. The assembly chamber includes a bottom portion, a side wall portion formed at a predetermined height on the bottom portion and disposed to surround the bottom portion, and a partition wall part formed on the bottom portion and extending from one inner surface of a plurality of inner surfaces provided in the side wall portion to another inner surface facing the one inner surface. The vertical height of at least a portion of the partition wall part is variable with respect to the bottom portion.

公开(公告)号：US20210090925A1

公开(公告)日：2021-03-25

申请号：US16818469

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Sangsik JUNG ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L33/00 ,  H01L25/075

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

公开(公告)号：US20230061671A1

公开(公告)日：2023-03-02

申请号：US17793244

申请日：2020-02-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Sangsik JUNG ,  Bongwoon CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: The present invention relates to a display device manufacturing method and, particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for carrying semiconductor light emitting diodes in a fluid received in an assembly chamber. The chip tray includes a tray unit for receiving a plurality of semiconductor light emitting diodes; a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets; and a transfer unit configured to move the tray unit and the chip alignment unit, wherein the transfer unit can vertically move one of the tray unit and the chip alignment unit with respect to the other one thereof.