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公开(公告)号：US07357898B2
公开(公告)日：2008-04-15
申请号：US10631478
申请日：2003-07-31
Applicant: Victor Samper , Lin Cong , Hongmiao Ji
Inventor： Victor Samper , Lin Cong , Hongmiao Ji
CPC classification number: B01L3/502707 , B01L7/52 , B01L2200/0689 , B01L2200/141 , B01L2300/0816 , B01L2300/0887 , B01L2300/123 , B01L2400/0655 , Y10T436/2575
Abstract: Microfluidics packages and methods of use are described, comprising in one embodiment a substrate having a top surface and means to lower pressure on the top surface; a fluidics card having a bottom surface and means to allow fluids to traverse through the card; and a polymeric barrier film, the polymeric barrier film positioned between the top surface of the substrate and the bottom surface of the fluidics card.
Abstract translation: 描述了微流体包装和使用方法，在一个实施方案中包括具有顶表面的基材和在顶表面上降低压力的装置; 具有底表面的流体卡和允许流体穿过卡的装置; 和聚合物阻挡膜，聚合物阻挡膜定位在基底的顶表面和流体卡的底表面之间。
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公开(公告)号：US20080073019A1
公开(公告)日：2008-03-27
申请号：US11945393
申请日：2007-11-27
Applicant: Victor Samper , Lin Cong , Hongmiao Ji
Inventor： Victor Samper , Lin Cong , Hongmiao Ji
IPC: B29C65/00
CPC classification number: B81C3/001 , B01L3/502707 , B01L2200/0689 , B01L2200/12 , B01L2200/141 , B01L2300/0887 , B01L2300/1827 , B81B2201/058 , Y10T137/2196 , Y10T156/10
Abstract: Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the inventive microfluidics chips to be reused without cleaning.
Abstract translation: 描述了微流体芯片和使用方法，包括一对晶片，至少一个具有图案化表面的晶片，以及在与图案化表面一致的晶片之间的两个聚合物阻挡膜。 聚合物阻挡膜允许本发明的微流体芯片的晶片在不进行清洁的情况下重复使用。
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公开(公告)号：US07335984B2
公开(公告)日：2008-02-26
申请号：US10631488
申请日：2003-07-31
Applicant: Victor Samper , Lin Cong , Hongmiao Ji
Inventor： Victor Samper , Lin Cong , Hongmiao Ji
IPC: H01L23/34
CPC classification number: B81C3/001 , B01L3/502707 , B01L2200/0689 , B01L2200/12 , B01L2200/141 , B01L2300/0887 , B01L2300/1827 , B81B2201/058 , Y10T137/2196 , Y10T156/10
Abstract: Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the inventive microfluidics chips to be reused without cleaning.
Abstract translation: 描述了微流体芯片和使用方法，包括一对晶片，至少一个具有图案化表面的晶片，以及在与图案化表面一致的晶片之间的两个聚合物阻挡膜。 聚合物阻挡膜允许本发明的微流体芯片的晶片在不进行清洁的情况下重复使用。
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公开(公告)号：US20050026300A1
公开(公告)日：2005-02-03
申请号：US10631478
申请日：2003-07-31
Applicant: Victor Samper , Lin Cong , Hongmiao Ji
Inventor： Victor Samper , Lin Cong , Hongmiao Ji
CPC classification number: B01L3/502707 , B01L7/52 , B01L2200/0689 , B01L2200/141 , B01L2300/0816 , B01L2300/0887 , B01L2300/123 , B01L2400/0655 , Y10T436/2575
Abstract: Microfluidics packages and methods of use are described, comprising in one embodiment a substrate having a top surface and means to lower pressure on the top surface; a fluidics card having a bottom surface and means to allow fluids to traverse through the card; and a polymeric barrier film, the polymeric barrier film positioned between the top surface of the substrate and the bottom surface of the fluidics card.
Abstract translation: 描述了微流体包装和使用方法，在一个实施方案中包括具有顶表面的基材和在顶表面上降低压力的装置; 具有底表面的流体卡和允许流体穿过卡的装置; 和聚合物阻挡膜，聚合物阻挡膜定位在基底的顶表面和流体卡的底表面之间。
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