公开(公告)号：US20220302574A1

公开(公告)日：2022-09-22

申请号：US17713105

申请日：2022-04-04

Applicant: MediaTek Inc.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01Q21/06 ,  H01L23/14 ,  H01Q15/00 ,  H01Q19/06 ,  H01Q15/10

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US20220102859A1

公开(公告)日：2022-03-31

申请号：US17411038

申请日：2021-08-24

Applicant: MEDIATEK INC.

Inventor： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC: H01Q9/04 ,  H01Q1/48

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.

公开(公告)号：US20190305428A1

公开(公告)日：2019-10-03

申请号：US16293661

申请日：2019-03-06

Applicant: MEDIATEK INC.

Inventor： Jiunn-Nan Hwang ,  Yi-Chieh Lin ,  Yen-Ju Lu ,  Shih-Chia Chiu ,  Wen-Chou Wu

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q19/10 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H01Q21/06 ,  H01Q1/22 ,  H01L23/66 ,  H01L23/498

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

公开(公告)号：US20190115646A1

公开(公告)日：2019-04-18

申请号：US16120446

申请日：2018-09-03

Applicant: MEDIATEK INC.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L23/14 ,  H01Q21/06

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.