公开(公告)号：US20230187377A1

公开(公告)日：2023-06-15

申请号：US17987873

申请日：2022-11-16

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung Lin ,  Chih-Ming Hung ,  Shih-Chia Chiu

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/38

CPC classification number: H01L23/552 ,  H01L25/0655 ,  H01L24/16 ,  H01L25/105 ,  H01L23/49833 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49816 ,  H01L23/66 ,  H01Q1/38 ,  H01L2924/1431 ,  H01L2924/1421 ,  H01L2924/2027 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L2224/1601 ,  H01L2225/1023 ,  H01L23/145

Abstract: A semiconductor package includes a base film, a semiconductor die on the base film, metal studs on the semiconductor die, shielding pillars on the base film and around the semiconductor die, a first molding compound encapsulating the semiconductor die, the metal studs, and the shielding pillars, a first re-distribution structure on the first molding compound, a second molding compound on the first re-distribution structure, through-mold-vias in the second molding compound, and a second re-distribution structure on the second molding compound and electrically connected to the through-mold-vias. The second re-distribution structure comprises an antenna.

公开(公告)号：US20210057143A1

公开(公告)日：2021-02-25

申请号：US16940379

申请日：2020-07-27

Applicant: MEDIATEK INC.

Inventor： Yi-Chieh Lin ,  Shih-Chia Chiu

IPC: H01F27/28 ,  H01F27/29 ,  H05K1/16 ,  H03H7/01

Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

公开(公告)号：US10916854B2

公开(公告)日：2021-02-09

申请号：US16293661

申请日：2019-03-06

Applicant: MEDIATEK INC.

Inventor： Jiunn-Nan Hwang ,  Yi-Chieh Lin ,  Yen-Ju Lu ,  Shih-Chia Chiu ,  Wen-Chou Wu

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q19/10 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q11/04 ,  H01Q19/00 ,  H01L23/498 ,  H01L23/66 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H01L23/00 ,  H05K1/03

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

公开(公告)号：US20240079787A1

公开(公告)日：2024-03-07

申请号：US18233335

申请日：2023-08-14

Applicant: MEDIATEK INC.

Inventor： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC: H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q9/045 ,  H01Q1/48

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.

公开(公告)号：US11848481B2

公开(公告)日：2023-12-19

申请号：US17713105

申请日：2022-04-04

Applicant: MediaTek Inc.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01Q21/06 ,  H01L23/14 ,  H01Q15/00 ,  H01Q19/06 ,  H01Q15/10

CPC classification number: H01Q1/2283 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/66 ,  H01Q15/0013 ,  H01Q15/10 ,  H01Q19/062 ,  H01Q21/065 ,  H01L2223/6677 ,  H01L2224/02379 ,  H01L2224/02381

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US20230236222A1

公开(公告)日：2023-07-27

申请号：US18129040

申请日：2023-03-30

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Che-Hsien Huang ,  Shih-Chia Chiu ,  Yi-Chieh Lin ,  Wun-Jian Lin

IPC: G01R1/04

CPC classification number: G01R1/0466

Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

公开(公告)号：US11322823B2

公开(公告)日：2022-05-03

申请号：US16120446

申请日：2018-09-03

Applicant: MEDIATEK INC.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01Q21/06 ,  H01L23/14 ,  H01Q15/00 ,  H01Q19/06 ,  H01Q15/10

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US12062864B2

公开(公告)日：2024-08-13

申请号：US18233335

申请日：2023-08-14

Applicant: MEDIATEK INC.

Inventor： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC: H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q9/045 ,  H01Q1/48

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.

公开(公告)号：US11764475B2

公开(公告)日：2023-09-19

申请号：US17411038

申请日：2021-08-24

Applicant: MEDIATEK INC.

Inventor： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC: H01Q1/48 ,  H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q1/48

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.

公开(公告)号：US11682816B2

公开(公告)日：2023-06-20

申请号：US16940379

申请日：2020-07-27

Applicant: MEDIATEK INC.

Inventor： Yi-Chieh Lin ,  Shih-Chia Chiu

IPC: H01P1/203 ,  H01P7/08 ,  H01F27/28 ,  H01F27/29 ,  H03H7/01 ,  H05K1/16

CPC classification number: H01P1/20345 ,  H01F27/2804 ,  H01F27/29 ,  H01P1/20327 ,  H01P1/20381 ,  H01P7/08 ,  H03H7/0138 ,  H05K1/165

Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.