公开(公告)号：US20230336472A1

公开(公告)日：2023-10-19

申请号：US17724043

申请日：2022-04-19

Applicant: MEDIATEK INC.

Inventor： Yu-Hua HUANG ,  Ming-Jun LIN ,  Huei-Jing YANG ,  Kai-Wen LIU ,  Yuan-Ting HUANG

IPC: H04L61/256 ,  H04L45/00

CPC classification number: H04L45/56 ,  H04L45/14 ,  H04L61/256

Abstract: A method of routing data packets for a router is provided. The router includes a software network address translator (NAT) and a hardware NAT. The method includes routing, by the software NAT, a first data packet based on a routing rule stored in the software NAT, wherein the software NAT has a routing rule removing function to remove the routing rule stored in the software NAT; sending, by the software NAT, the routing rule to the hardware NAT; storing the routing rule, by the hardware NAT, in the hardware NAT; and routing, by the hardware NAT instead of the software NAT, a second data packet based on the routing rule stored in the hardware NAT. The routing rule removing function of the software NAT for the routing rule stored in the software NAT is disabled.

公开(公告)号：US20210400550A1

公开(公告)日：2021-12-23

申请号：US17466044

申请日：2021-09-03

Applicant: MEDIATEK INC.

Inventor： Guan-Jie HUANG ,  Tzu-Wen CHANG ,  Kuan-Wei CHEN ,  Yu-Hua HUANG ,  Teng MA ,  Sheng-Kai CHANG

IPC: H04W36/00 ,  H04W8/08 ,  H04W76/19 ,  H04W76/27 ,  H04W68/00 ,  H04W36/14 ,  H04W36/24

Abstract: A communications apparatus and associated method communicating with at least one cellular network includes a radio transceiver and a processor. The communications apparatus includes a a radio transceiver, capable of transmitting or receiving wireless radio frequency signals to or from a cellular network; and a processor. The processor is configured to: receive an incoming call request message that will trigger a Circuit Switch Fall Back (CSFB) procedure or a Evolved Packet System Fall Back (EPS FB) procedure from the cellular network via the radio transceiver, query a user to accept or reject the incoming call request before triggering the CSFB procedure or the EPS FB procedure, and determine whether to trigger the CSFB procedure or the EPS FB procedure based on a response to the query from the user.

公开(公告)号：US20160268183A1

公开(公告)日：2016-09-15

申请号：US15066256

申请日：2016-03-10

Applicant: MediaTek Inc.

Inventor： Ming-Tzong YANG ,  Yu-Hua HUANG

IPC: H01L23/48 ,  H01L27/02 ,  H01L27/092 ,  H01L23/532 ,  H01L29/06

CPC classification number: H01L23/481 ,  H01L23/53295 ,  H01L27/0207 ,  H01L27/092

Abstract: A semiconductor structure includes a semiconductor substrate and a conductive element formed in a portion of the semiconductor substrate. The semiconductor structure further includes a plurality of insulating elements formed in portions of the semiconductor substrate at a first region surrounding the conductive element and a semiconductor device formed over a portion of the semiconductor substrate at a second region adjacent to the first region. The first region is formed between the conductive element and the second region.

Abstract translation: 半导体结构包括半导体衬底和形成在半导体衬底的一部分中的导电元件。 半导体结构还包括在围绕导电元件的第一区域处形成在半导体衬底的部分中的多个绝缘元件和在与第一区域相邻的第二区域处形成在半导体衬底的一部分上的半导体器件。 第一区域形成在导电元件和第二区域之间。

公开(公告)号：US20160211194A1

公开(公告)日：2016-07-21

申请号：US14601440

申请日：2015-01-21

Applicant: MediaTek Inc.

Inventor： Cheng-Chou HUNG ,  Ming-Tzong YANG ,  Tung-Hsing LEE ,  Wei-Che HUANG ,  Yu-Hua HUANG ,  Tzu-Hung LIN

IPC: H01L23/48 ,  H01L21/761 ,  H01L21/768 ,  H01L29/06

CPC classification number: H01L21/76898 ,  H01L21/761 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L29/0619 ,  H01L29/0623 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package structure and method for forming the same are provided. The semiconductor package structure includes a substrate and the substrate has a front side and a back side. The semiconductor package structure includes a through silicon via (TSV) interconnect structure formed in the substrate; and a first guard ring doped region and a second guard ring doped region formed in the substrate, and the first guard ring doped region and the second guard ring doped region are adjacent to the TSV interconnect structure.

Abstract translation: 提供一种半导体封装结构及其形成方法。 半导体封装结构包括衬底，并且衬底具有正面和背面。 半导体封装结构包括在衬底中形成的穿硅通孔（TSV）互连结构; 以及形成在所述衬底中的第一保护环掺杂区域和第二保护环掺杂区域，并且所述第一保护环掺杂区域和所述第二保护环掺杂区域与所述TSV互连结构相邻。

公开(公告)号：US20160118318A1

公开(公告)日：2016-04-28

申请号：US14986295

申请日：2015-12-31

Applicant: MediaTek Inc.

Inventor： Ming-Tzong YANG ,  Yu-Hua HUANG ,  Wei-Che HUANG

IPC: H01L23/48 ,  H01L23/528 ,  H01L27/088 ,  H01L29/06 ,  H01L29/423

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/528 ,  H01L23/5384 ,  H01L24/11 ,  H01L27/088 ,  H01L29/0649 ,  H01L29/42356 ,  H01L2224/02372 ,  H01L2224/0912 ,  H01L2225/06541

Abstract: The invention provides a semiconductor package with a through silicon via (TSV) interconnect. An exemplary embodiment of the semiconductor package with a TSV interconnect includes a semiconductor substrate, having a front side and a back side. A contact array is disposed on the front side of the semiconductor substrate. An isolation structure is disposed in the semiconductor substrate, underlying the contact array. The TSV interconnect is formed through the semiconductor substrate, overlapping with the contact array and the isolation structure.

公开(公告)号：US20140312470A1

公开(公告)日：2014-10-23

申请号：US14320725

申请日：2014-07-01

Applicant: MediaTek Inc.

Inventor： Cheng-Chou HUNG ,  Tung-Hsing LEE ,  Yu-Hua HUANG ,  Ming-Tzong YANG

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L23/564 ,  H01L23/585 ,  H01L27/0805 ,  H01L29/94 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor substrate of a first conductivity type having a chip region enclosed by a seal ring region. An insulating layer is on the semiconductor substrate. A seal ring structure is embedded in the insulating layer corresponding to the seal ring region. And, a plurality of doping regions are located beneath the first seal ring structure.

Abstract translation: 半导体器件包括具有由密封环区域包围的芯片区域的第一导电类型的半导体衬底。 绝缘层位于半导体衬底上。 密封环结构埋设在对应于密封圈区域的绝缘层中。 并且，多个掺杂区域位于第一密封环结构下方。

公开(公告)号：US20240412390A1

公开(公告)日：2024-12-12

申请号：US18331416

申请日：2023-06-08

Applicant: MEDIATEK INC.

Inventor： Yen-Yang CHOU ,  Keh-Tsong LI ,  Shao-Yang WANG ,  Chia-Hui KUO ,  Hung-Chih KO ,  Pin-Wei CHEN ,  Yu-Hua HUANG ,  Yun-I CHOU ,  Chien-Ho YU ,  Chi-Cheng JU ,  Ying-Jui CHEN

IPC: G06T7/33 ,  G06T3/00 ,  H04N5/265

Abstract: A method for image alignment is provided. The method for image alignment includes the following stages. A first image with a first property from a first sensor is received. A second image with a second property from a second sensor is received. The first property is similar to the second property. The first feature correspondence between the first image and the second image is calculated. A third image with a third property from the first sensor and a fourth image with a fourth property from the second image sensor are received. The third property is different from the fourth property. Image alignment is performed on the third image and the fourth image based on the first feature correspondence between the first image and the second image.

公开(公告)号：US20230344876A1

公开(公告)日：2023-10-26

申请号：US17724774

申请日：2022-04-20

Applicant: MEDIATEK INC.

Inventor： Kai-Wen LIU ,  Po-Chun LEE ,  Yuan-Ting HUANG ,  Yu-Hua HUANG

IPC: H04L65/1016 ,  H04W8/20 ,  H04L65/1069 ,  H04W76/10

CPC classification number: H04L65/1016 ,  H04W8/20 ,  H04L65/1069 ,  H04W76/10

Abstract: An IP Multimedia Subsystem (IMS) call establishing method is provided. The IMS call establishing method is applied to an electronic device which supports IMS service. The IMS call establishing method includes the steps of establishing a network connection between the electronic device and a client device; when the client device dials an IMS call, the electronic device obtains call information of the IMS call through the network connection; and the electronic device establishes the IMS call based on the call information of the IMS call.

公开(公告)号：US20200100153A1

公开(公告)日：2020-03-26

申请号：US16513884

申请日：2019-07-17

Applicant: MEDIATEK INC.

Inventor： Guan-Jie HUANG ,  Tzu-Wen CHANG ,  Kuan-Wei CHEN ,  Yu-Hua HUANG ,  Teng MA ,  Sheng-Kai CHANG

IPC: H04W36/00 ,  H04W8/08 ,  H04W76/27 ,  H04W68/00 ,  H04W76/19

Abstract: A communications apparatus communicating with at least one cellular network includes a radio transceiver and a processor. The radio transceiver is capable of transmitting or receiving wireless radio frequency signals to or from an air interface in the cellular network. The processor is configured to determine whether an inter-RAT change will be triggered in a subsequent procedure when the communications apparatus is in a connected mode. When the processor determines that an inter-RAT change procedure will be triggered, the processor is configured to selectively perform a predetermined procedure instead of the subsequent procedure to avoid the inter-RAT change.

公开(公告)号：US20170110406A1

公开(公告)日：2017-04-20

申请号：US15393387

申请日：2016-12-29

Applicant: MediaTek Inc.

Inventor： Ming-Tzong YANG ,  Cheng-Chou HUNG ,  Wei-Che HUANG ,  Yu-Hua HUANG ,  Tzu-Hung LIN ,  Kuei-Ti CHAN ,  Ruey-Beei WU ,  Kai-Bin WU

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L23/5384 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/14 ,  H01L25/0657 ,  H01L2224/16146 ,  H01L2225/06541 ,  H01L2225/06544

Abstract: The invention provides a semiconductor package assembly with a TSV interconnect. The semiconductor package assembly includes a first semiconductor package mounted on a base, having: a semiconductor die, a semiconductor substrate, and a first array of TSV interconnects and a second array of TSV interconnects formed through the semiconductor substrate, wherein the first array and second array of TSV interconnects are separated by an interval region. The assembly further includes a second semiconductor die mounted on the first semiconductor package, having a ground pad thereon. One of the TSV interconnects of the first semiconductor package has a first terminal coupled to the ground pad of the second semiconductor die and a second terminal coupled to an interconnection structure disposed on a front side of the semiconductor substrate.