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公开(公告)号：US11561129B2
公开(公告)日：2023-01-24
申请号：US17381207
申请日：2021-07-21
发明人： Jen-Yi Chen , Yueh-Kang Lee , Chao-Sen Chang , Kai-Yu Jiang
摘要： A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.
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公开(公告)号：US20220191605A1
公开(公告)日：2022-06-16
申请号：US17156650
申请日：2021-01-25
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
IPC分类号： H04R1/08
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
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公开(公告)号：US20200131024A1
公开(公告)日：2020-04-30
申请号：US16262927
申请日：2019-01-31
发明人： Kai-Yu Jiang , Jen-Yi Chen , Chao-Sen Chang
摘要： A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.
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公开(公告)号：US10536780B2
公开(公告)日：2020-01-14
申请号：US15913938
申请日：2018-03-07
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Jui-Chin Peng
IPC分类号： H04R17/00 , H04R17/02 , H01L41/047 , H01L41/113 , H01L41/053
摘要： A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.
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