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公开(公告)号：US11223908B1
公开(公告)日：2022-01-11
申请号：US17013838
申请日：2020-09-07
发明人： Kai-Yu Jiang , Jen-Yi Chen , Yueh-Kang Lee
IPC分类号： H04R19/04
摘要： A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.
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公开(公告)号：US11671735B2
公开(公告)日：2023-06-06
申请号：US17878031
申请日：2022-07-31
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
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公开(公告)号：US11509984B2
公开(公告)日：2022-11-22
申请号：US17156650
申请日：2021-01-25
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
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公开(公告)号：US10609491B1
公开(公告)日：2020-03-31
申请号：US16297725
申请日：2019-03-11
摘要： A speaker includes a diaphragm and a MEMS actuator. The MEMS actuator includes a coupling member attached to the diaphragm and at least one closed cantilever ring that is surrounded around and connected to the coupling member by plural first bridge members, wherein the closed cantilever ring is configured to be electrically-biased to cause an axial movement of the coupling member and the diaphragm.
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公开(公告)号：US20220404196A1
公开(公告)日：2022-12-22
申请号：US17381207
申请日：2021-07-21
发明人： Jen-Yi Chen , Yueh-Kang Lee , Chao-Sen Chang , Kai-Yu Jiang
IPC分类号： G01H11/06
摘要： A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.
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公开(公告)号：US20220369012A1
公开(公告)日：2022-11-17
申请号：US17878031
申请日：2022-07-31
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
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公开(公告)号：US20200059734A1
公开(公告)日：2020-02-20
申请号：US16162397
申请日：2018-10-17
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang
摘要： A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.
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公开(公告)号：US10972840B2
公开(公告)日：2021-04-06
申请号：US16452546
申请日：2019-06-26
发明人： Jen-Yi Chen , Yueh-Kang Lee , Kai-Yu Jiang , Chao-Sen Chang
摘要： A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.
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公开(公告)号：US10710868B2
公开(公告)日：2020-07-14
申请号：US16262927
申请日：2019-01-31
发明人： Kai-Yu Jiang , Jen-Yi Chen , Chao-Sen Chang
摘要： A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.
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公开(公告)号：US20190222940A1
公开(公告)日：2019-07-18
申请号：US15913938
申请日：2018-03-07
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Jui-Chin Peng
IPC分类号： H04R17/02 , H01L41/047 , H01L41/053 , H01L41/113
摘要： A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.
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