-
公开(公告)号：US20200322731A1
公开(公告)日：2020-10-08
申请号：US16909973
申请日：2020-06-23
发明人： Jen-Yi Chen , Chao-Sen Chang , Yung-Hsiang Chang
摘要： An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions and a plurality of elastic structures. The elastic structures are concentrically arranged along peripheries of the vibratile portions. The acoustic transducer further has a connecting portion extending from the back plate to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The elastic structures include a first elastic structure and a second elastic structures arranged alongside of the boundary, and a third elastic structure arranged along an outer periphery of the vibrating membrane. The vibratile portions are geometrically different from each other and different in rigidity, and the vibratile portions can vibrate independently to respond to various sound pressure levels.
-
公开(公告)号：US11952264B2
公开(公告)日：2024-04-09
申请号：US17557050
申请日：2021-12-21
发明人： Jia Yin Wu , Yung-Hsiang Chang , Yueh-Kang Lee
CPC分类号： B81B3/0051 , B81C1/00158 , H04R19/04 , B81B2201/0257
摘要： An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.
-
公开(公告)号：US20220191605A1
公开(公告)日：2022-06-16
申请号：US17156650
申请日：2021-01-25
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
IPC分类号： H04R1/08
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
-
公开(公告)号：US20220369012A1
公开(公告)日：2022-11-17
申请号：US17878031
申请日：2022-07-31
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
-
公开(公告)号：US20230124360A1
公开(公告)日：2023-04-20
申请号：US17557050
申请日：2021-12-21
发明人： Jia Yin Wu , Yung-Hsiang Chang , Yueh-Kang Lee
摘要： An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.
-
公开(公告)号：US20240034620A1
公开(公告)日：2024-02-01
申请号：US18085513
申请日：2022-12-20
发明人： Yung-Hsiang Chang , Jia Yin Wu , Yueh-Kang Lee
IPC分类号： B81B7/00
CPC分类号： B81B7/0077 , B81B2201/0257 , B81B2203/0127 , B81B2203/0353 , B81B2203/04 , B81B2207/115
摘要： A micro-electromechanical packaging structure including a substrate, a sensing module, a waterproof layer, and a cover is provided. The substrate has a first surface, a second surface, and an acoustic hole penetrating through the first surface and the second surface. The acoustic hole has an upper opening and a lower opening, and an aperture of the lower opening is larger than an aperture of the upper opening. The sensing module is disposed on the first surface of the substrate and covers the upper opening. The waterproof layer is disposed on the second surface of the substrate and covers the lower opening. The waterproof layer has multiple fine holes. The fine holes are communicated with the acoustic hole. The cover is disposed on the first surface and covers the sensing module.
-
公开(公告)号：US20230175910A1
公开(公告)日：2023-06-08
申请号：US18165260
申请日：2023-02-06
发明人： Yueh-Kang Lee , Jia Yin Wu , Yung-Hsiang Chang
IPC分类号： G01L19/06
CPC分类号： G01L19/0609
摘要： An electronic device includes a substrate, a sensor, a pressurizing component, and a stopping structure. The substrate has a bearing surface. The sensor is disposed on the bearing surface. The pressurizing component is disposed on the sensor. The stopping structure is disposed between the pressurizing component and the sensor. The stopping structure has opposite upper and lower surfaces and a plurality of openings, and each opening penetrates from the upper surface to the lower surface.
-
公开(公告)号：US11671735B2
公开(公告)日：2023-06-06
申请号：US17878031
申请日：2022-07-31
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
-
公开(公告)号：US11509984B2
公开(公告)日：2022-11-22
申请号：US17156650
申请日：2021-01-25
发明人： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Yung-Hsiang Chang
摘要： A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.016 秒)
