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公开(公告)号：US20250038774A1
公开(公告)日：2025-01-30
申请号：US18912629
申请日：2024-10-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isao TAKENAKA
Abstract: A radio frequency circuit includes an antenna connection terminal, an acoustic wave filter, a power amplifier connected to the acoustic wave filter, a temperature sensor that measures the temperature of either one or both of the acoustic wave filter and the power amplifier, a first variable inductor circuit that includes an inductor disposed in series between the acoustic wave filter and the antenna connection terminal and that has a variable inductance value, and a second variable inductor circuit that includes an inductor connected between the ground and a first path connecting the acoustic wave filter to the antenna connection terminal and that has a variable inductance value.
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公开(公告)号：US20240154588A1
公开(公告)日：2024-05-09
申请号：US18474222
申请日：2023-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keisuke ARIMA , Isao TAKENAKA
CPC classification number: H03F3/245 , H03F1/565 , H03F2200/387 , H03F2200/451 , H04B1/04
Abstract: A radio-frequency module includes amplifiers and, a transformer including a primary coil and a secondary coil, an antenna connection terminal, an inductor disposed in series between one end of the secondary coil and the antenna connection terminal, and a capacitor connected between a path connecting the one end of the secondary coil and the inductor and a ground. One end of the primary coil is connected to an output end of the amplifier, another end of the primary coil is connected to an output end of the amplifier, another end of the secondary coil is connected to the ground, and the secondary coil and the inductor are coupled to each other via magnetic field coupling.
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公开(公告)号：US20240088841A1
公开(公告)日：2024-03-14
申请号：US18518615
申请日：2023-11-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji TAHARA , Yoshiaki SUKEMORI , Kae YAMAMOTO , Ryo WAKABAYASHI , Isao TAKENAKA
CPC classification number: H03F3/19 , H03F1/565 , H04B1/40 , H03F2200/387 , H03F2200/451
Abstract: A radio frequency circuit includes carrier amplifiers and peak amplifiers, transformers, a signal output terminal connected to a first end of an output-side coil, an LC series circuit, and a capacitor. An input-side coil is connected, at its first end, to the carrier amplifier, and is connected, at its second end, to the carrier amplifier. An input-side coil is connected, at its first end, to the peak amplifier, and is connected, at its second end, to the peak amplifier. The LC series circuit is connected between the peak amplifier and the ground. The capacitor is connected to a second end of the output-side coil and a first end of an output-side coil. The output-side coil is connected, at its second end, to the ground.
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公开(公告)号：US20220321154A1
公开(公告)日：2022-10-06
申请号：US17807512
申请日：2022-06-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isao TAKENAKA
Abstract: In a high-frequency module, a plurality of filters are connected to a first switch. A plurality of amplifiers are connected to a second switch. A first inductor is disposed on a common path between a second common terminal of the second switch and a first common terminal of the first switch. A plurality of second inductors are disposed, on a one-to-one correspondence, in sections different from the common path, the sections being included in the plurality of respective signal paths. The first inductor is a surface mount inductor located on a first main surface of a mounting substrate. The plurality of second inductors are each an inductor disposed within an IC chip including the plurality of amplifiers or an inductor including a conductive pattern formed in or on the mounting substrate.
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公开(公告)号：US20250088161A1
公开(公告)日：2025-03-13
申请号：US18959732
申请日：2024-11-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isao TAKENAKA
Abstract: An amplifier circuit includes a high frequency input terminal and a high frequency output terminal, amplifiers, an output transformer having an input-side coil and an output-side coil, inductors, and a bypass capacitor. An output end of the amplifier is connected to one end of the input-side coil and one end of the inductor. An output end of the amplifier is connected to the other end of the input-side coil and one end of the inductor. The other end of the inductor, the other end of the inductor, and one end of the bypass capacitor are connected to a midpoint of the input-side coil. One end of the output-side coil is connected to the high frequency output terminal.
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Patent Agency Ranking
公开(公告)号：US20230170862A1
公开(公告)日：2023-06-01
申请号：US18159291
申请日：2023-01-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Dai NAKAGAWA , Takanori UEJIMA , Yuji TAKEMATSU , Isao TAKENAKA
CPC classification number: H03F3/245 , H05K1/0243 , H03F1/565 , H03F2200/451 , H03F2200/294 , H03F2200/165 , H03F2200/387
Abstract: Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a plurality of transmission filters, a resin layer, and a shield layer. The mounting substrate has a first major surface and a second major surface opposite to each other. The plurality of transmission filters is mounted on the first major surface of the mounting substrate. The resin layer is disposed on the first major surface of the mounting substrate and covers at least part of an outer peripheral surface of each of the plurality of transmission filters. The shield layer covers the resin layer and at least part of each of the plurality of transmission filters. At least part of a major surface of each of the plurality of transmission filters on an opposite side to the mounting substrate side is in contact with the shield layer.
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公开(公告)号：US20220173765A1
公开(公告)日：2022-06-02
申请号：US17651491
申请日：2022-02-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isao TAKENAKA
Abstract: Desired characteristics can be achieved. A radio-frequency circuit includes an inductor and a switch. The inductor has a first end and a second end. The switch has a first input-output terminal, a second input-output terminal, a first switching terminal coupled to the first end of the inductor, and a second switching terminal coupled to the second end of the inductor. The switch can switch between a first state and a second state. In the first state, the first input-output terminal is coupled to the first switching terminal, and the second input-output terminal is coupled to the second switching terminal. In the second state, the first input-output terminal is coupled to the second switching terminal, and the second input-output terminal is coupled to the first switching terminal.
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公开(公告)号：US20220173759A1
公开(公告)日：2022-06-02
申请号：US17651478
申请日：2022-02-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isao TAKENAKA , Shogo YANASE , Takayuki OSHIMA
Abstract: To provide a radio frequency module and a communication device capable of achieving reduction in height. The radio frequency module includes a mounting substrate and one or more chip inductors. The mounting substrate has a recess at least one end of both ends in a second direction orthogonal to a first direction that is a thickness direction of the mounting substrate. A second chip inductor that is at least one chip inductor of the one or more chip inductors is disposed in the recess.
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公开(公告)号：US20210306015A1
公开(公告)日：2021-09-30
申请号：US17204963
申请日：2021-03-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masaki TADA , Isao TAKENAKA
Abstract: A radio frequency module includes: a plurality of external connection terminals including at least one input terminal and at least one output terminal; at least one power amplifier; at least one low-noise amplifier; a first switch connected between the at least one input terminal and the at least one power amplifier; a second switch connected between the at least one output terminal and the at least one low-noise amplifier; and a module substrate including a first principal surface and a second principal surface on opposite sides of the module substrate. The first switch is disposed on one of the first principal surface and the second principal surface, and the second switch is disposed on the other of the first principal surface and the second principal surface.
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公开(公告)号：US20190158036A1
公开(公告)日：2019-05-23
申请号：US16255006
申请日：2019-01-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Isao TAKENAKA
Abstract: A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.
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