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公开(公告)号：US20250080141A1
公开(公告)日：2025-03-06
申请号：US18655420
申请日：2024-05-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keisuke ARIMA , Hiroyuki KANI
IPC: H04B1/00
Abstract: A radio frequency module includes a switch, first and second filters. The switch includes a common terminal and two selection terminals. A first communication path is connected to a first selection terminal. A second communication path is connected to a second selection terminal. The first filter is in the first communication path and includes first and second communication bands. The second filter is in the second communication path and includes third and fourth communication bands. At least a part of the third communication band overlaps the first communication band, but not the second communication band. The switch is switchable between first and second connections. In the first connection, the common terminal is connected to the first selection terminal. In the second connection, the common terminal is connected to the first selection terminal, and the common terminal is connected to the second the selection terminal.
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Patent Agency Ranking
公开(公告)号：US20240292519A1
公开(公告)日：2024-08-29
申请号：US18656618
申请日：2024-05-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keisuke ARIMA , Hiroyuki KANI , Tomoaki SATO
CPC classification number: H05K1/0243 , H03F3/245 , H03F2200/451 , H05K2201/09036
Abstract: A high frequency module includes a mounting board, a power amplifier, an electronic component, and a resin layer. The power amplifier is disposed on a main surface of either the first main surface or the second main surface of the mounting board. The electronic component is disposed on the main surface of the mounting board on which the power amplifier is disposed. The resin layer is disposed at least between the power amplifier and the electronic component in a plan view from a thickness direction of the mounting board. A groove portion is formed in the resin layer. The groove portion includes a bottom portion positioned between a third main surface of the power amplifier and the main surface of the mounting board when the mounting board is viewed from a direction orthogonal to the thickness direction of the mounting board.
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公开(公告)号：US20240195441A1
公开(公告)日：2024-06-13
申请号：US18499326
申请日：2023-11-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keisuke ARIMA
CPC classification number: H04B1/04 , H03F3/19 , H03H11/04 , H03F2200/451
Abstract: A radio-frequency circuit includes a common terminal and a common terminal, a filter connected to the common terminal and the common terminal and having a first pass band, a filter connected to the common terminal and the common terminal and having a second pass band, and a cancellation circuit connected to the common terminal and the common terminal, connected in parallel with the filter and the filter, and configured to vary at least one of an amplitude and a phase in the bandpass characteristics.
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公开(公告)号：US20250080143A1
公开(公告)日：2025-03-06
申请号：US18780829
申请日：2024-07-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keisuke ARIMA , Kazuma SUGIURA , Hiroaki TAKAOKA
Abstract: A high frequency module includes a low noise amplifier, a switch, a first inductor, a second inductor, a first filter, and a second filter. The first inductor is connected between the low noise amplifier and an output terminal of the switch. The second inductor is connected between a path between the first inductor and the output terminal of the switch, and an input/output terminal of the switch. The switch is configured to switch between a first state where a first input terminal connected to the first filter and the output terminal are connected, and the input/output terminal and a ground terminal are connected, and a second state where a second input terminal connected to the second filter and the input/output terminal are connected.
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公开(公告)号：US20240154588A1
公开(公告)日：2024-05-09
申请号：US18474222
申请日：2023-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keisuke ARIMA , Isao TAKENAKA
CPC classification number: H03F3/245 , H03F1/565 , H03F2200/387 , H03F2200/451 , H04B1/04
Abstract: A radio-frequency module includes amplifiers and, a transformer including a primary coil and a secondary coil, an antenna connection terminal, an inductor disposed in series between one end of the secondary coil and the antenna connection terminal, and a capacitor connected between a path connecting the one end of the secondary coil and the inductor and a ground. One end of the primary coil is connected to an output end of the amplifier, another end of the primary coil is connected to an output end of the amplifier, another end of the secondary coil is connected to the ground, and the secondary coil and the inductor are coupled to each other via magnetic field coupling.
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公开(公告)号：US20230308121A1
公开(公告)日：2023-09-28
申请号：US18318891
申请日：2023-05-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Mayuka ONO , Motoji TSUDA , Keisuke ARIMA
CPC classification number: H04B1/0078 , H04B1/04 , H04B2001/0408
Abstract: Heat dissipation properties of a power amplifier is improved. A high-frequency module includes a mounting substrate, at least one power amplifier, an electronic component, a resin layer, a conductive member, and a plurality of via conductors. The power amplifier is mounted on a first main surface of the mounting substrate. The electronic component is mounted on a second main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate, and covers at least a part of the power amplifier. The conductive member covers at least a part of the resin layer, and covers at least a part of an outer peripheral surface of the mounting substrate. The plurality of via conductors is connected to the power amplifier, and passes through the mounting substrate. At least one via conductor of the plurality of via conductors is in contact with the conductive member.
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