公开(公告)号：US20190297726A1

公开(公告)日：2019-09-26

申请号：US16438519

申请日：2019-06-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirokazu YAZAKI ,  Keito YONEMORI ,  Takanori TSUCHIYA ,  Koji KAMADA ,  Takashi NOMA

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/62 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.

公开(公告)号：US20150221428A1

公开(公告)日：2015-08-06

申请号：US14685797

申请日：2015-04-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihiro KUBOTA ,  Takashi NOMA

IPC: H01F27/28 ,  H02M3/158

CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F2027/2809 ,  H02M3/158 ,  H02M2001/008 ,  Y10T307/406

Abstract: An inductor array chip includes a magnetic laminated body and a plurality of inductors. The magnetic laminated body includes a plurality of stacked magnetic layers. The plurality of inductors are arranged inside the magnetic laminated body. The inductance of a first inductor differs from the inductance of a second inductor. The inductors include a plurality of coil-shaped conductors and via-hole conductors. The plurality of coil-shaped conductors are arranged between the magnetic layers. The via-hole conductors electrically connect the plurality of coil-shaped conductors. The inductors include a plurality of inductors in which the section sizes of the coil-shaped conductors differ from one another.

Abstract translation: 电感器阵列芯片包括磁性层叠体和多个电感器。 磁性层叠体包括多个堆叠的磁性层。 多个电感器布置在磁性层叠体的内部。 第一电感器的电感与第二电感器的电感不同。 电感器包括多个线圈状导体和通孔导体。 多个线圈状导体配置在磁性层之间。 通孔导体将多个线圈状导体电连接。 电感器包括多个电感器，其中线圈状导体的截面尺寸彼此不同。

公开(公告)号：US20140203985A1

公开(公告)日：2014-07-24

申请号：US14221356

申请日：2014-03-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuhito TSUBAKI ,  Takashi NOMA ,  Noboru KATO

IPC: H01Q7/06

CPC classification number: H01Q7/08 ,  H01Q1/243 ,  H01Q7/06 ,  H01Q19/00

Abstract: To ensure a sufficient communication distance and to concurrently suppress a conductor loss, a coil antenna includes a magnetic core including a first peripheral surface including at least a first principal surface, a first coil conductor located on the first principal surface and wound around a predetermined winding axis, a first base material layer stacked on the first principal surface, including at least a first surface parallel or substantially parallel to the first principal surface, and made of a material having a lower magnetic permeability than the magnetic core, and a second coil conductor located on at least the first surface. Opposite ends of the second coil conductor are coupled to the first coil conductor on the first principal surface, and a direction in which a current flows through the first coil conductor on the first principal surface is substantially the same as a direction in which a current flows through the second coil conductor on the first surface.

Abstract translation: 为了确保足够的通信距离并且同时抑制导体损耗，线圈天线包括磁芯，该磁芯包括至少包括第一主表面的第一周边表面，位于第一主表面上的第一线圈导体并围绕预定绕组 所述第一基材层层叠在所述第一主表面上，所述第一基材层至少包括与所述第一主表面平行或基本平行的第一表面，并且由具有比所述磁芯低的磁导率的材料制成;以及第二线圈导体 至少位于第一表面。 第二线圈导体的相对端部耦合到第一主表面上的第一线圈导体，并且电流流过第一主表面上的第一线圈导体的方向与电流流动的方向基本相同 通过第一表面上的第二线圈导体。