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公开(公告)号:US11251829B2
公开(公告)日:2022-02-15
申请号:US17022369
申请日:2020-09-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Tetsuro Harada
Abstract: A radio frequency module is provided. A matching circuit includes an inductor which is connected in series to the power amplifier and is formed in a substrate. The substrate includes a ground layer, a low permittivity portion, and a high permittivity portion. The ground layer at least partially overlaps with a first input terminal of the low-noise amplifier in a plan view from a thickness direction of the substrate. The low permittivity portion at least partially overlaps with the first input terminal in a plan view from the thickness direction, and is provided between the first input terminal and the ground layer. The high permittivity portion is in contact with the inductor and has the permittivity greater than the permittivity of the low permittivity portion.
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公开(公告)号:US10950569B2
公开(公告)日:2021-03-16
申请号:US16511086
申请日:2019-07-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Katsunari Nakazawa , Takanori Uejima , Motoji Tsuda , Yuji Takematsu , Dai Nakagawa , Tetsuro Harada , Masahide Takebe , Naoya Matsumoto , Yoshiaki Sukemori , Mitsunori Samata , Yutaka Sasaki , Yuki Fukuda
Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.
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