Radio frequency module
    11.
    发明授权

    公开(公告)号:US11251829B2

    公开(公告)日:2022-02-15

    申请号:US17022369

    申请日:2020-09-16

    Inventor: Tetsuro Harada

    Abstract: A radio frequency module is provided. A matching circuit includes an inductor which is connected in series to the power amplifier and is formed in a substrate. The substrate includes a ground layer, a low permittivity portion, and a high permittivity portion. The ground layer at least partially overlaps with a first input terminal of the low-noise amplifier in a plan view from a thickness direction of the substrate. The low permittivity portion at least partially overlaps with the first input terminal in a plan view from the thickness direction, and is provided between the first input terminal and the ground layer. The high permittivity portion is in contact with the inductor and has the permittivity greater than the permittivity of the low permittivity portion.

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