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    Multilayer ceramic electronic component and fabrication method thereof
    13.
    发明授权
    Multilayer ceramic electronic component and fabrication method thereof 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US09087644B2

    公开(公告)日：2015-07-21

    申请号：US13620663

    申请日：2012-09-14

    申请人： Byung Jun Jeon ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    发明人： Byung Jun Jeon ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    IPC分类号： H01G4/232 ,  H01G4/30 ,  H01G4/228 ,  H01G4/12

    CPC分类号： H01G4/232 ,  H01G4/12 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30

    摘要： A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5≦|T1/Tc|≦1.0 is satisfied.

    摘要翻译： 多层陶瓷电子部件包括：陶瓷主体; 层叠在陶瓷主体内的多个内部电极; 以及形成在所述陶瓷主体的外表面并与内部电极电连接的外部电极，其中所述外部电极的平均厚度为10μm以下，并且当所述陶瓷主体的中心部分的外部电极的厚度 主体的宽度方向为Tc，内部电极的印刷面区域的侧缘的外部电极的厚度为T1，满足＆lt; T1 / Tc |＆nlE; 1.0。

    Multilayer ceramic electronic component and fabrication method thereof
    14.
    发明授权
    Multilayer ceramic electronic component and fabrication method thereof 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US09165712B2

    公开(公告)日：2015-10-20

    申请号：US13620656

    申请日：2012-09-14

    申请人： Byung Jun Jeon ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    发明人： Byung Jun Jeon ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    IPC分类号： H01G4/005 ,  H01G4/30 ,  H01G4/12 ,  H01G4/01 ,  H01G4/012

    CPC分类号： H01G4/005 ,  H01G4/01 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  Y10T29/43

    摘要： There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T1, 0.8≦|T1/Tc|≦1.0 is satisfied.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：陶瓷主体; 多个内部电极; 以及形成在所述陶瓷主体的外表面并与内部电极电连接的外部电极，其中所述外部电极的平均厚度为10μm以下，并且当所述陶瓷主体的中心部分的外部电极的厚度 主体的厚度方向为Tc，外部电极的厚度方向上的电容形成区域的中心部分的距离等于电容形成区域的厚度（S）的25％的距离处的厚度 是T1，0.8＆nlE; | T1 / Tc |＆nlE; 1.0。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    15.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130182369A1

    公开(公告)日：2013-07-18

    申请号：US13620663

    申请日：2012-09-14

    申请人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    发明人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    IPC分类号： H01G4/30

    CPC分类号： H01G4/232 ,  H01G4/12 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30

    摘要： A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5≦|T1/Tc|≦1.0 is satisfied.

    摘要翻译： 多层陶瓷电子部件包括：陶瓷主体; 层叠在陶瓷主体内的多个内部电极; 以及形成在陶瓷主体的外表面并与内部电极电连接的外部电极，其中外部电极的平均厚度为10μm以下，并且当陶瓷主体的中心部分的外部电极的厚度 主体的宽度方向为Tc，内部电极的印刷面区域的侧边缘的外部电极的厚度为T1，满足0.5≤| T1 / Tc | @ 1.0。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    16.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130182368A1

    公开(公告)日：2013-07-18

    申请号：US13620656

    申请日：2012-09-14

    申请人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    发明人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    IPC分类号： H01G4/30

    CPC分类号： H01G4/005 ,  H01G4/01 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  Y10T29/43

    摘要： There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T1, 0.8≦|T1/Tc|≦1.0 is satisfied.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：陶瓷主体; 多个内部电极; 以及形成在陶瓷主体的外表面并与内部电极电连接的外部电极，其中外部电极的平均厚度为10μm以下，并且当陶瓷主体的中心部分的外部电极的厚度 主体的厚度方向为Tc，外部电极的厚度方向上的电容形成区域的中心部分的距离等于电容形成区域的厚度（S）的25％的距离处的厚度 是T1，满足0.8 @ | T1 / Tc | @ 1.0。