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    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    2.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130182369A1

    公开(公告)日：2013-07-18

    申请号：US13620663

    申请日：2012-09-14

    申请人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    发明人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    IPC分类号： H01G4/30

    CPC分类号： H01G4/232 ,  H01G4/12 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30

    摘要： A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5≦|T1/Tc|≦1.0 is satisfied.

    摘要翻译： 多层陶瓷电子部件包括：陶瓷主体; 层叠在陶瓷主体内的多个内部电极; 以及形成在陶瓷主体的外表面并与内部电极电连接的外部电极，其中外部电极的平均厚度为10μm以下，并且当陶瓷主体的中心部分的外部电极的厚度 主体的宽度方向为Tc，内部电极的印刷面区域的侧边缘的外部电极的厚度为T1，满足0.5≤| T1 / Tc | @ 1.0。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130182368A1

    公开(公告)日：2013-07-18

    申请号：US13620656

    申请日：2012-09-14

    申请人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    发明人： Byung Jun JEON ,  Kyu Ha Lee ,  Hyun Hee Gu ,  Chang Hoon Kim ,  Myung Jun Park

    IPC分类号： H01G4/30

    CPC分类号： H01G4/005 ,  H01G4/01 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  Y10T29/43

    摘要： There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T1, 0.8≦|T1/Tc|≦1.0 is satisfied.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：陶瓷主体; 多个内部电极; 以及形成在陶瓷主体的外表面并与内部电极电连接的外部电极，其中外部电极的平均厚度为10μm以下，并且当陶瓷主体的中心部分的外部电极的厚度 主体的厚度方向为Tc，外部电极的厚度方向上的电容形成区域的中心部分的距离等于电容形成区域的厚度（S）的25％的距离处的厚度 是T1，满足0.8 @ | T1 / Tc | @ 1.0。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
    5.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130050896A1

    公开(公告)日：2013-02-28

    申请号：US13569738

    申请日：2012-08-08

    申请人： Myung Jun PARK ,  Sang Hoon KWON ,  Jae Young PARK ,  Kyu Ha LEE ,  Byung Jun JEON ,  Da Young CHOI ,  Hyun Hee GU ,  Chang Hoon KIM

    发明人： Myung Jun PARK ,  Sang Hoon KWON ,  Jae Young PARK ,  Kyu Ha LEE ,  Byung Jun JEON ,  Da Young CHOI ,  Hyun Hee GU ,  Chang Hoon KIM

    IPC分类号： H01G4/12

    CPC分类号： H01G4/228 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30

    摘要： There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

    摘要翻译： 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括：陶瓷主体，其包括电介质层; 第一和第二内部电极，其设置成在陶瓷主体内彼此面对; 以及第一外部电极和第二外部电极，其中所述第一和第二外部电极包括导电金属和玻璃，并且当所述第一外部电极和第二外部电极中的至少一个在厚度方向上被分成三个相等的部分时， 的中心部分的玻璃的总面积的35％至80％。 具有提高的可靠性的多层陶瓷电子部件可以通过提高芯片气密性来实现。