公开(公告)号：US20210408358A1

公开(公告)日：2021-12-30

申请号：US17355528

申请日：2021-06-23

Applicant: NEC Corporation

Inventor： Kenji Nanba ,  Ayami Yamaguchi ,  Akira Miyata ,  Katsumi Kikuchi ,  Suguru Watanabe ,  Takanori Nishi ,  Hideyuki Satou

IPC: H01L39/24 ,  G06N10/00 ,  H01L27/18

Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); a predetermined signal line (w1) arranged in the wiring layer of the quantum chip (111); first shield wires (ws1) arranged in the wiring layer of the quantum chip (111) along the predetermined signal line (w1); a second shield wire (ws2) arranged in the wiring layer of the interposer (112); and a second connection part (150) that is provided between the interposer (112) and the quantum chip (111) so as to contact the first shield wires (ws1) and the second shield wire (ws2).