公开(公告)号：US20160126435A1

公开(公告)日：2016-05-05

申请号：US14927471

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Takanori AKAISHI ,  Kensaku HAMADA ,  Saiki YAMAMOTO

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A light emitting device includes an electrically conductive member, a light emitting element, a wire, and a sealing member. The wire contains gold and silver and connects the electrically conductive member and the light emitting element. The wire includes a ball portion and a recrystallized region. The ball portion is provided on an electrode of the light emitting element. The recrystallized region is provided on the ball portion and has a length in a range of 50 μm to 90 μm. The sealing member has a lower surface and an upper surface opposite to the lower surface and covers the light emitting element and the wire so that the lower surface faces the electrically conductive member and the light emitting element and so that a distance from a top of the ball portion to the upper surface of the sealing member is 90 μm to 230 μm.

Abstract translation: 发光装置包括导电构件，发光元件，线和密封构件。 导线包含金和银并且连接导电构件和发光元件。 线包括球部分和再结晶区域。 球部设置在发光元件的电极上。 再结晶区域设置在球部上，长度为50μm〜90μm。 密封构件具有下表面和与下表面相对的上表面，并且覆盖发光元件和电线，使得下表面面向导电构件和发光元件，并且使得与顶部的距离 密封部件的上表面的球部为90μm〜230μm。