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公开(公告)号:US20230075178A1
公开(公告)日:2023-03-09
申请号:US17796739
申请日:2021-01-22
Applicant: NISSHA CO.,LTD.
Inventor: Chuzo TANIGUCHI , Ryomei OMOTE , Eiji KAWASHIMA , Junichi SHIBATA , Jun SASAKI , Yoshihiro SAKATA
Abstract: A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.
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公开(公告)号:US20230074600A1
公开(公告)日:2023-03-09
申请号:US17904694
申请日:2020-08-03
Applicant: NISSHA CO., LTD.
Inventor: Daichi HAMA , Chuzo TANIGUCHI , Toshitsugu FUJIMURA , Masato KURAHASHI
Abstract: Provided is a decorative sheet in which a graphic is less deteriorated even after injection molding. First and second graphic layers contain a plurality of interference pigments that emit respective interference lights having respective colors in a first direction in first and second binders to exhibit first and second mixed colors. An optical functional layer changes a reflectance property of light. The first and second graphic layers represent a graphic visually recognizable from a front surface of a decorative sheet and allow visually recognizing an image displayed on a back surface from the front surface. The optical functional layer increases at least one of ratios of an amount of visible light representing the graphic and an amount of visible light representing the image that transmits through the first and second graphic layers to an amount of visible light reflected by and visible on the front surface.
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公开(公告)号:US20230054589A1
公开(公告)日:2023-02-23
申请号:US17793922
申请日:2021-01-27
Applicant: NISSHA CO.,LTD.
Inventor: Chuzo TANIGUCHI , Ryomei OMOTE , Eiji KAWASHIMA , Jun SASAKI , Yoshihiro SAKATA , Toshitsugu FUJIMURA
IPC: G02C11/00
Abstract: A molded body is molded into a prescribed three-dimensional shape. A protective film covers at least a portion of a surface of the molded body. A circuit film is integrally molded with the molded body. An electric circuit is installed in the circuit film and causes a physical change outside of a molded article or causes an electric signal to be generated in accordance with a physical change outside of the molded article. The protective film or the circuit film has a contact area disposed on the surface of a contact portion. The molded body includes a hot melt adhesive: which is disposed on the surface of the molded body which is opposite skin, with the contact area therebetween; and which defines a three-dimensional shape of the contact area within the prescribed shape. The hot melt adhesive covers at least a portion of the circuit film.
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公开(公告)号:US20220252778A1
公开(公告)日:2022-08-11
申请号:US17754387
申请日:2020-08-17
Applicant: NISSHA CO., LTD.
Inventor: Chuzo TANIGUCHI , Ryomei OMOTE , Junichi SHIBATA , Jun SASAKI , Yoshihiro SAKATA , Toshifumi KUROSAKI , Shohei MORIMOTO
Abstract: An illumination display panel that forms part of a housing and has a display portion for illuminated display comprises a resin panel having a first molded portion made of an opaque resin at a portion excluding the display portion, and a second molded portion disposed on the back surface side of the first molded portion and made of a light-transmitting resin having a protrusion where the first molded portion is not present. The protrusion is fitted to the first molded portion. A light source mounting substrate is disposed on the back surface side of the resin panel. At least a light source of the light source mounting substrate is sealed by the second molded portion. An integrally molded product of the light source mounting substrate and the second molded portion is filled and solidified at a low pressure while compressing a cavity of a molding mold.
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