公开(公告)号：US20240031713A1

公开(公告)日：2024-01-25

申请号：US18265572

申请日：2021-11-09

Applicant: NISSHA CO.,LTD.

Inventor： Chuzo TANIGUCHI ,  Jun SASAKI ,  Eiji KAWASHIMA ,  Yasuisa TAKINISHI

IPC: H04R1/02

CPC classification number: H04R1/025 ,  H04R1/028 ,  H04R2201/02 ,  H04R2499/11 ,  H04R2499/15 ,  B29C45/14639

Abstract: A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.

公开(公告)号：US20230067899A1

公开(公告)日：2023-03-02

申请号：US17759156

申请日：2020-12-02

Applicant: NISSHA CO., LTD.

Inventor： Nobuo KUBOSAKI ,  Chuzo TANIGUCHI ,  Jun SASAKI

IPC: H05K1/03

Abstract: Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.

公开(公告)号：US20230395000A1

公开(公告)日：2023-12-07

申请号：US18031996

申请日：2021-10-14

Applicant: NISSHA CO.,LTD.

Inventor： Shun TANAKA ,  Masaru TERASHITA ,  Jun SASAKI ,  Chuzo TANIGUCHI ,  Kenichiro SUZUKI

IPC: G09F13/04 ,  G09F13/22 ,  H01L33/62 ,  H01L25/075 ,  B60K35/00

CPC classification number: G09F13/044 ,  G09F13/22 ,  H01L33/62 ,  H01L25/0753 ,  B60K35/00 ,  G09F2013/222 ,  H01L2933/0066 ,  B60K2370/152

Abstract: A first groove is formed in a first main surface of a light guide member. A decorative layer is molded with the light guide member and provided on a second main surface of the light guide member. The decorative layer includes a first light-emitting portion that radiates the visible light emitted from a first light-emitting element from the light guide member and a second light-emitting portion that radiates the visible light emitted from the second light-emitting element from the light guide member. The first light absorbing member is disposed on a first groove bottom of the first groove, and has an absorptivity of visible light, which is higher than that of the light guide member. The first groove is positioned to block an optical path from the first light-emitting element toward a second region and an optical path from the second light-emitting element toward a first region.

公开(公告)号：US20230075178A1

公开(公告)日：2023-03-09

申请号：US17796739

申请日：2021-01-22

Applicant: NISSHA CO.,LTD.

Inventor： Chuzo TANIGUCHI ,  Ryomei OMOTE ,  Eiji KAWASHIMA ,  Junichi SHIBATA ,  Jun SASAKI ,  Yoshihiro SAKATA

IPC: B29C45/14 ,  B29C33/14 ,  B29C45/26

Abstract: A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.

公开(公告)号：US20230054589A1

公开(公告)日：2023-02-23

申请号：US17793922

申请日：2021-01-27

Applicant: NISSHA CO.,LTD.

Inventor： Chuzo TANIGUCHI ,  Ryomei OMOTE ,  Eiji KAWASHIMA ,  Jun SASAKI ,  Yoshihiro SAKATA ,  Toshitsugu FUJIMURA

IPC: G02C11/00

Abstract: A molded body is molded into a prescribed three-dimensional shape. A protective film covers at least a portion of a surface of the molded body. A circuit film is integrally molded with the molded body. An electric circuit is installed in the circuit film and causes a physical change outside of a molded article or causes an electric signal to be generated in accordance with a physical change outside of the molded article. The protective film or the circuit film has a contact area disposed on the surface of a contact portion. The molded body includes a hot melt adhesive: which is disposed on the surface of the molded body which is opposite skin, with the contact area therebetween; and which defines a three-dimensional shape of the contact area within the prescribed shape. The hot melt adhesive covers at least a portion of the circuit film.

公开(公告)号：US20220252778A1

公开(公告)日：2022-08-11

申请号：US17754387

申请日：2020-08-17

Applicant: NISSHA CO., LTD.

Inventor： Chuzo TANIGUCHI ,  Ryomei OMOTE ,  Junichi SHIBATA ,  Jun SASAKI ,  Yoshihiro SAKATA ,  Toshifumi KUROSAKI ,  Shohei MORIMOTO

IPC: F21V8/00 ,  H01L51/52 ,  H01L51/56 ,  H01L25/075 ,  H01L33/54 ,  B29C45/16 ,  B29C45/14

Abstract: An illumination display panel that forms part of a housing and has a display portion for illuminated display comprises a resin panel having a first molded portion made of an opaque resin at a portion excluding the display portion, and a second molded portion disposed on the back surface side of the first molded portion and made of a light-transmitting resin having a protrusion where the first molded portion is not present. The protrusion is fitted to the first molded portion. A light source mounting substrate is disposed on the back surface side of the resin panel. At least a light source of the light source mounting substrate is sealed by the second molded portion. An integrally molded product of the light source mounting substrate and the second molded portion is filled and solidified at a low pressure while compressing a cavity of a molding mold.

公开(公告)号：US20230123719A1

公开(公告)日：2023-04-20

申请号：US17995342

申请日：2021-03-22

Applicant: NISSHA CO., LTD.

Inventor： Chuzo TANIGUCHI ,  Eiji KAWASHIMA ,  Jun SASAKI

IPC: H01H13/14 ,  H01H13/20 ,  H01H11/00

Abstract: A switch cap for a switch device that can reduce a pressing error of a switch is provided. A three-dimensional first cap main body moves by a force applied to a first abutting portion from a finger which is an operator. A first sensor is disposed in the first cap main body, and detects abutting or approach of the finger to the first abutting portion. A first transmission member is fixed to the inside of the first cap main body, and moves together with the first cap main body for first switching to transmit movement of the first cap main body to a push button which is a predetermined location of a switch device. A first sensor is formed in a flexible printed circuit board (FPC) disposed in the first cap main body, and the FPC is fixed by the first transmission member and the first cap main body.