-
公开(公告)号：US20240031713A1
公开(公告)日：2024-01-25
申请号：US18265572
申请日：2021-11-09
申请人： NISSHA CO.,LTD.
发明人： Chuzo TANIGUCHI , Jun SASAKI , Eiji KAWASHIMA , Yasuisa TAKINISHI
IPC分类号： H04R1/02
CPC分类号： H04R1/025 , H04R1/028 , H04R2201/02 , H04R2499/11 , H04R2499/15 , B29C45/14639
摘要： A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.
-
公开(公告)号：US20180259315A1
公开(公告)日：2018-09-13
申请号：US15759861
申请日：2016-10-14
申请人： NISSHA CO., LTD.
发明人： Kazuto NAKAMURA , Yoshihiro SAKATA , Eiji KAWASHIMA , Rokusuke TAKEMURA , Koji OKAMOTO , Hiroyuki NAGAI
IPC分类号： G01B7/16
CPC分类号： G01B7/18 , G01B7/16 , G01B7/20 , G01L1/205 , G01L1/2287
摘要： A multipoint-measurement strain sensor which is free of a conduction failure originated from slippage at the time of lamination and which can reduce the material cost, and a method for producing the multipoint-measurement strain sensor are provided. A multipoint-measurement strain sensor 31 of the present invention includes a substrate film 34, a plurality of strain-sensing parts 33 formed on a first main surface 34a of the substrate film 34, routing circuits 37, 38 formed, in correspondence with the respective strain-sensing parts 33, on a second main surface 34b of the substrate film 34, and having outer connection terminals 37b, 38b near an outer edge of the substrate film 34, and a conductive paste 41, 42 to fill via holes 39, 40 such that each of the strain-sensing parts 33 is connected to the corresponding routing circuit 37, 38.
-
公开(公告)号：US20210159592A1
公开(公告)日：2021-05-27
申请号：US16973983
申请日：2019-04-22
申请人： NISSHA CO., LTD.
摘要： Object:
A plurality of problems of an electromagnetic wave transmissive cover to be installed in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave are simultaneously eliminated.
Resolution means:
An electromagnetic wave transmissive cover 1 is a member to be installed in an electromagnetic wave irradiation direction of a millimeter wave radar 100 using an electromagnetic wave, and includes a colored resin member 3, a transparent resin member 5, and a transparent heater film 7. The transparent resin member 5 is provided on an opposite side to the millimeter wave radar 100 of the colored resin member 3. The transparent heater film 7 is provided on the opposite side to the millimeter wave radar 100 of the colored resin member 3, includes a wiring pattern formed by copper plating or etching, and has electromagnetic wave transmissivity.-
公开(公告)号：US20240227258A9
公开(公告)日：2024-07-11
申请号：US18546801
申请日：2022-01-28
申请人： NISSHA CO., LTD.
CPC分类号： B29C45/14065 , B29C45/14631 , B29C45/14655 , H05K3/0014 , H05K7/1427
摘要： An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.
-
公开(公告)号：US20240131758A1
公开(公告)日：2024-04-25
申请号：US18546801
申请日：2022-01-28
申请人： NISSHA CO., LTD.
CPC分类号： B29C45/14065 , B29C45/14631 , B29C45/14655 , H05K3/0014 , H05K7/1427
摘要： An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.
-
公开(公告)号：US20230123719A1
公开(公告)日：2023-04-20
申请号：US17995342
申请日：2021-03-22
申请人： NISSHA CO., LTD.
发明人： Chuzo TANIGUCHI , Eiji KAWASHIMA , Jun SASAKI
摘要： A switch cap for a switch device that can reduce a pressing error of a switch is provided. A three-dimensional first cap main body moves by a force applied to a first abutting portion from a finger which is an operator. A first sensor is disposed in the first cap main body, and detects abutting or approach of the finger to the first abutting portion. A first transmission member is fixed to the inside of the first cap main body, and moves together with the first cap main body for first switching to transmit movement of the first cap main body to a push button which is a predetermined location of a switch device. A first sensor is formed in a flexible printed circuit board (FPC) disposed in the first cap main body, and the FPC is fixed by the first transmission member and the first cap main body.
-
公开(公告)号：US20230152421A1
公开(公告)日：2023-05-18
申请号：US17917403
申请日：2021-05-20
申请人： NISSHA CO., LTD.
发明人： Yusuke UENO , Eiji KAWASHIMA , Chuzo TANIGUCHI
IPC分类号： G01S7/02 , G01S13/931
CPC分类号： G01S7/028 , G01S13/931 , G01S2013/93271 , B60R13/04
摘要： A decorative molded article transmits a radio wave handled by a radar device as a wireless device and illuminates a specific portion by a light irradiated from a light emitting device. A first reflective layer is formed to have a first opening portion in a back surface of a molded body, reflects light incident from the first opening portion, and transmits the millimeter wave. A first coloring unit transmits the millimeter wave and colors the light incident from the first opening portion to generate a first colored light. A shielding layer of a decorative sheet is fixedly secured to a translucent film, transmits the millimeter wave, and shields the first colored light. The shielding layer has a second opening portion arranged in the specific portion of the translucent film to take out the first colored light from the molded body to a front of a front surface.
-
公开(公告)号：US20230075178A1
公开(公告)日：2023-03-09
申请号：US17796739
申请日：2021-01-22
申请人： NISSHA CO.,LTD.
发明人： Chuzo TANIGUCHI , Ryomei OMOTE , Eiji KAWASHIMA , Junichi SHIBATA , Jun SASAKI , Yoshihiro SAKATA
摘要： A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.
-
公开(公告)号：US20230054589A1
公开(公告)日：2023-02-23
申请号：US17793922
申请日：2021-01-27
申请人： NISSHA CO.,LTD.
发明人： Chuzo TANIGUCHI , Ryomei OMOTE , Eiji KAWASHIMA , Jun SASAKI , Yoshihiro SAKATA , Toshitsugu FUJIMURA
IPC分类号： G02C11/00
摘要： A molded body is molded into a prescribed three-dimensional shape. A protective film covers at least a portion of a surface of the molded body. A circuit film is integrally molded with the molded body. An electric circuit is installed in the circuit film and causes a physical change outside of a molded article or causes an electric signal to be generated in accordance with a physical change outside of the molded article. The protective film or the circuit film has a contact area disposed on the surface of a contact portion. The molded body includes a hot melt adhesive: which is disposed on the surface of the molded body which is opposite skin, with the contact area therebetween; and which defines a three-dimensional shape of the contact area within the prescribed shape. The hot melt adhesive covers at least a portion of the circuit film.
-
公开(公告)号：US20220024178A1
公开(公告)日：2022-01-27
申请号：US17496795
申请日：2021-10-08
申请人： NISSHA CO.,LTD.
发明人： Daichi HAMA , Yasuhide FUKADA , Tatsuo ITO , Eiji KAWASHIMA
摘要： To provide a decorative molded article that enables clear visual recognition of an arbitrary pattern on a surface of a skin material when a light source is turned on. The decorative molded article is a decorative molded article capable of being illuminated by a light source on a back surface and configured so that a skin material having an OD value of 1 or more and 3.5 or less, a light-shielding layer having an arbitrary pattern, and a transparent molded body are laminated together in sequence, and so that a color difference ΔE between a light emitting unit and a non-light emitting unit of the skin material is 50 or more when the light source is turned on. The decorative molded article may further include a nonwoven fabric between the skin material and the light-shielding layer, or between the light-shielding layer and the molded body.
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.015 秒)
