摘要:
A method of fabricating an integrated circuit (IC), during which wafer warpage is controlled by appropriately controlling intrinsic stresses in one or more service layers of the layer stack of the IC's multilevel interconnect structure. In one embodiment, each interconnect level of the multilevel interconnect structure has a dielectric layer, a conducting layer formed over the dielectric layer, and a service anti-reflective coating (ARC) layer formed over the conducting layer. Each ARC layer is formed from silicon oxynitride such that at least two ARC layers corresponding to different interconnect levels have different intrinsic stresses. The amount of intrinsic stress in each ARC layer is controlled, e.g., through the control of temperature and/or gas composition during the layer deposition.
摘要:
A challenge mechanism in which a challenge is issued from one message processor to another. In generating the challenge, the message processor may select any one or more of a number of available interactive challenge types, where each type of challenge type might use different user-originated information. Upon receiving the challenge, the challengee message processor may identify the challenge type based on information provided in the challenge, and perform different actions depending on the challenge type. The challengee message processor then generates an appropriate challenge response, and issues that challenge response to the challenger message processor. The challenger message processor may then validate the challenge response.
摘要:
Exemplary embodiments disclosed herein may include a method and system for creating an attendance marker and establishing consistent recognition of an ongoing digital relationship, including receiving an identity key about a server, creating an attendance marker, associating the attendance marker with the server. Other embodiments relate to systems and methods for recognizing a server, website, and/or other system for a client, such as a computer system for a user. Such authentication involves receiving an identity key about a web server or other system, creating an attendance marker, associating the attendance marker with the server, requesting an attendance marker associated with a server, and recognizing the server based at least in part on the attendance marker.
摘要:
Creating a token for use by an entity when digitally signing documents. In a computing environment, a digital identity representation for an entity is accessed. The digital identity representation includes information identifying identity attributes about the entity and capabilities of an identity provider that provides tokens for use by the entity. Context information is accessed. The context information includes information about one or more of which, how or where the attributes for the entity identified in the digital identity representation will be used. A security token is created from the information in the digital identity representation and the context information. The security token makes assertions by the identity provider. The assertions are based on the information in the digital identity representation. The token further includes information related to at least a portion of the context information.
摘要:
Exemplary embodiments disclosed herein may include a method and system for providing information to a user and safely disclosing identity information over the Internet comprising receiving information from a server, analyzing the information, presenting the analyzed information to a user for validation in a finite number of configurations controlled by a client, and validating of the information by the user.
摘要:
Providing reference tokens. A method includes receiving a request for a token. In response to the request for a token and in place of a token, one or more rich pointers are sent referencing one or more tokens. The rich pointers point to locations where one or more actual tokens can be retrieved. When only a single pointer is sent, the pointer is a reference other than an HTTP URL.
摘要:
A system and method for managing the creation of objects in a distributed directory service system assigns quotas to entities (such as users, computers, groups) to limit the number of objects each entity is allowed to create and own. For purposes of enforcing the quotas, tombstones generated for deleted objects are taken into account in the calculation of a weighted total number of objects owned by an entity, with each tombstone counted as a configurable fraction of a regular object. When an entity requests a directory operation that will increase the number of objects owned by that entity, the number of system objects owned by that entity is added to the number of tombstones multiplied by the fractional tombstone factor to generate the weighted total, which is compared to the quota of that entity to determine when the requested operation should be performed.
摘要:
The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface has abrasive particles embedded therein and a retainer coating deposited over the metal surface and the abrasive particles. The retainer coating inhibits the abrasive particles from dislodging during a conditioning process.
摘要:
A method for recycling a used silicon wafer on which ICs have been formed by IC fabrication equipment comprised of first grinding the wafer using a coarse grinding apparatus and then grinding the wafer suing a fine grinding apparatus. The coarse grinding apparatus and the fine grinding apparatus are identical to one another except for the nature of the respective grinding they perform. Deionized water is used during both grinding processes to reduce friction and to control dust. The used wafer is first mounted on a chuck of the coarse grinding apparatus that rotates at a first predetermined speed. A diamond wheel mounted on a grinding wheel holder of the coarse grinding apparatus rotates at a second predetermined speed that is faster than the first speed. The rotating wheel and the rotating wafer are brought into contact with one another and the wafer is ground until a predetermined amount of semiconductor material is removed from the face of the wafer. The wafer is then placed in the fine grinding apparatus and subjected to an identical grinding process. The loss of wafer thickness from both the coarse and fine grinding processes is no more than 50 microns. The resulting wafer is suitable for reuse in IC fabrication processes and has performance characteristics comparable with those of virgin wafers. The recycling process of the present invention typically takes only about 30-40 seconds.
摘要:
Tungsten plugs are formed by passivating a substrate having a contact hole with SiH.sub.4, forming a nucleation layer on the passivated substrate by reducing WF.sub.6 with SiH.sub.4 at relatively low pressures and depositing tungsten to substantially fill the contact hole by reducing WF.sub.6 with H.sub.2 at relatively high pressures. Alternatively, rapid thermal annealing is used to cure pinhole defects in a titanium nitride layer on a substrate to avoid the formation of unwanted tungsten volcanoes.