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11.发明申请Wafer-Level Methods For Packing Camera Modules, And Associated Camera Modules 审中-公开用于包装相机模块和相关相机模块的晶片级方法公开(公告)号：US20160219203A1
公开(公告)日：2016-07-28
申请号：US14932075
申请日：2015-11-04
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
CPC classification number: H04N5/2257 , B29C45/14336 , B29C45/14467 , B29C45/1671 , B29C2045/1454 , B29C2045/1673 , B29D11/00807 , B29K2995/0025 , B29L2011/0016 , B29L2031/3481 , G02B13/0085
Abstract: A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.
Abstract translation: 用于封装多个相机模块的晶片级方法包括（a）围绕多个图像传感器包覆模制第一外壳材料以产生封装的图像传感器的第一晶片，（b）将多个透镜单元放置在第一晶片中 分别在多个图像传感器之上，以及（d）在第一晶片上并围绕透镜单元包覆模制第二壳体材料以形成封装相机模块的第二晶片，其中每个封装的相机模块包括图像传感器之一 并且所述透镜单元中的一个，并且所述第二壳体材料与所述第一壳体材料协作以将所述透镜单元固定在所述第二晶片中。
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12.发明申请WAFER-LEVEL LENS PACKAGING METHODS, AND ASSOCIATED LENS ASSEMBLIES AND CAMERA MODULES 审中-公开水平镜头包装方法和相关镜头组件和相机模块公开(公告)号：US20160216493A1
公开(公告)日：2016-07-28
申请号：US14605298
申请日：2015-01-26
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen , Jui-Yi Chiu , Jau-Jan Deng
CPC classification number: G02B13/0085 , B29C45/0053 , B29C45/14336 , B29C45/14778 , B29C2045/14868 , B29D11/00307 , B29D11/00807 , B29L2011/0016
Abstract: A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.
Abstract translation: 包装方法适用于包装多个晶片级透镜。 每个晶片级透镜包括（a）具有相对的第一和第二表面的衬底和（b）在第一和第二表面中的至少一个上的相应透镜元件。 每个透镜元件具有背离基板的透镜表面。 该方法包括使用壳体材料部分地包围多个晶片级透镜以产生封装的晶片级透镜的晶片。 在封装的晶片级透镜的晶片中，壳体材料通过接触相应的基板来支撑多个晶片级透镜中的每一个，并且壳体被成形为分别为多个晶片级透镜形成多个壳体 。
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公开(公告)号：US10437025B2
公开(公告)日：2019-10-08
申请号：US14605298
申请日：2015-01-26
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen , Jui-Yi Chiu , Jau-Jan Deng
Abstract: A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.
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公开(公告)号：US09915763B2
公开(公告)日：2018-03-13
申请号：US14941174
申请日：2015-11-13
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Tsung-Wei Wan
CPC classification number: G02B3/0062 , B32B37/12 , B32B2551/00 , G02B3/0031 , G02B13/0085 , G03B17/12 , H01L27/14627 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14687
Abstract: A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. The upper substrate includes an upper-substrate bottom surface opposite the lower-substrate top surface and having thereon an upper element and an outer spacer, the outer spacer (i) being attached to the inner spacer and (ii) at least partially surrounding the upper element. In any cross-section of the stacked-lens assembly parallel to the upper substrate and including both the inner spacer and the outer spacer, the entirety of the inner spacer is within a perimeter of the outer spacer.
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公开(公告)号：US20170139086A1
公开(公告)日：2017-05-18
申请号：US14941174
申请日：2015-11-13
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Tsung-Wei Wan
IPC: G02B3/00 , H01L27/146 , G02B13/00 , B32B37/12 , G03B17/12
CPC classification number: G02B3/0062 , B32B37/12 , B32B2551/00 , G02B3/0031 , G02B13/0085 , G03B17/12 , H01L27/14627 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14687
Abstract: A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. The upper substrate includes an upper-substrate bottom surface opposite the lower-substrate top surface and having thereon an upper element and an outer spacer, the outer spacer (i) being attached to the inner spacer and (ii) at least partially surrounding the upper element. In any cross-section of the stacked-lens assembly parallel to the upper substrate and including both the inner spacer and the outer spacer, the entirety of the inner spacer is within a perimeter of the outer spacer.
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Patent Agency Ranking
公开(公告)号：US20170123190A1
公开(公告)日：2017-05-04
申请号：US14932368
申请日：2015-11-04
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
CPC classification number: G02B13/0085 , B29D11/00307 , B29D11/00403 , B29K2995/0029 , G02B1/041 , G02B13/005
Abstract: A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate lens along the non-planar substrate surface. A lens wafer includes a substrate wafer and resin lenses. The substrate wafer has a top surface having non-planar surface features each bordered by a planar region of the top surface and forming an obtuse angle therewith. Each resin lens has a non-planar resin surface adjoining the substrate wafer along a non-planar surface feature. A method for fabricating a wafer-level hybrid compound lens includes depositing a resin portion on a non-planar feature of a side of a substrate. The method also includes forming the resin portion into a lens on the non-planar feature.
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17.发明申请Wide-Angle Camera Using Achromatic Doublet Prism Array And Method of Manufacturing The Same 有权使用消色差双棱镜阵列的广角相机及其制造方法公开(公告)号：US20160231473A1
公开(公告)日：2016-08-11
申请号：US14616925
申请日：2015-02-09
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Jau-Jan Deng , Tsung-Wei Wan , Chuen-Yi Yin
CPC classification number: B29D11/0074 , B29K2995/0026 , G02B3/0006 , G02B3/0031 , G02B3/0056 , G02B5/045 , G02B13/006 , G02B13/0065
Abstract: A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.
Abstract translation: 广角照相机及其制造方法包括具有多个像素子阵列的传感器和在基板的第一侧上的光学元件阵列。 每个光学元件能够从视野形成图像到不同的像素子阵列上。 广角摄像机还包括在衬底的第二侧上的消色差双棱镜阵列，其中每个消色差双棱镜对准以提供与不同的一个光学元件的视角。 传感器捕获广角视野，同时具有紧凑的格式。
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公开(公告)号：US20160057323A1
公开(公告)日：2016-02-25
申请号：US14465292
申请日：2014-08-21
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Tsung-Wei Wan
IPC: H04N5/225
CPC classification number: H04N5/2254
Abstract: A PCB-mountable lens adapter includes an adapter lens for being a component of an imaging system that has a second field of view different from the first field of view, the imaging system comprising the adapter lens and the camera lens; and an adapter housing for holding the adapter lens and for attaching to a PCB. A method for modifying the field of view of an camera module includes attaching a PCB-mountable lens adapter to a PCB, the PCB-mountable lens adapter including an adapter lens mounted in an adapter housing, the PCB being configured for surface-mounting of the camera module thereto.
Abstract translation: 一种可安装PCB的透镜适配器，包括：适配器透镜，用于成像系统的部件，该成像系统具有与第一视野不同的第二视野，该成像系统包括适配器透镜和照相机镜头; 以及用于保持适配器透镜并用于附接到PCB的适配器壳体。 一种用于修改相机模块的视野的方法包括将PCB可安装的镜头适配器附接到PCB，所述PCB可安装的镜头适配器包括安装在适配器壳体中的适配器镜头，所述PCB被配置为用于表面安装 相机模块。
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公开(公告)号：US11538269B2
公开(公告)日：2022-12-27
申请号：US17243176
申请日：2021-04-28
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
IPC: G06V40/13 , G02F1/1335 , G02B13/14
Abstract: An optical fingerprint sensor (OFPS) for use with a liquid-crystal display (LCD) panel having a backlight module is positioned under the backlight module and captures an image of a fingerprint sensing area on the LCD panel through an aperture in both a reflector and a metal shield of the backlight module. The OFPS includes a sensor layer, a wafer-level optic layer bonded to the sensor layer and an infrared pass filter (IRPF) coating formed on a substantially flat top surface of the wafer-level optic layer. An OFPS may be formed with a flat top and may include a wafer-level optic layer having one or more lenses to direct light generated by a light source beneath the wafer-level optic layer. The wafer-level lenses may be bonded with the fingerprint scanner. The flat top of the OFPS may be made with an IRPF coating.
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公开(公告)号：US10455131B2
公开(公告)日：2019-10-22
申请号：US14932075
申请日：2015-11-04
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
Abstract: A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.
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