公开(公告)号：US20180261564A1

公开(公告)日：2018-09-13

申请号：US15754872

申请日：2016-08-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Barbara Behr ,  Mathias Wendt ,  Marcus Zenger

IPC: H01L23/00 ,  H01L33/62

CPC classification number: H01L24/29 ,  B23K35/3033 ,  B23K35/322 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L24/26 ,  H01L24/32 ,  H01L24/83 ,  H01L33/0095 ,  H01L33/62 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29169 ,  H01L2224/83825 ,  H01L2924/12041 ,  H01L2933/0066

Abstract: A device and a method for producing a device are disclosed. In an embodiment the device includes a first component, a second component and a connecting element directly arranged between the first component and the second component, wherein the connecting element includes at least a first metal, which is formed as an adhesive layer, a diffusion barrier and a component of a first phase and a second phase of the connecting element, wherein the adhesive layer is arranged on the first component and/or the second component, wherein the first phase and/or the second phase includes, besides the first metal, further metals different from the first metal, wherein a concentration of the first metal in the first phase is greater than a concentration of the first metal in the second phase, and wherein the connecting element includes a layer of a silicide of the first metal.