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公开(公告)号：US20240222308A1
公开(公告)日：2024-07-04
申请号：US18149121
申请日：2023-01-02
Applicant: PIXART IMAGING INC.
Inventor： SAI-MUN LEE , CHEE-PIN T'NG
IPC: H01L23/00
CPC classification number: H01L24/29 , H01L24/30 , H01L24/32 , H01L24/83 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0603 , H01L2224/06155 , H01L2224/06181 , H01L2224/29007 , H01L2224/29013 , H01L2224/29015 , H01L2224/29021 , H01L2224/29023 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/3015 , H01L2224/30505 , H01L2224/30517 , H01L2224/32227 , H01L2224/48227 , H01L2224/4912 , H01L2224/73265 , H01L2224/83192 , H01L2924/0665
Abstract: A sensor packaging method and a sensor package are provided. The method includes: providing a substrate having upper and lower board surfaces, in which the upper board surface has a die-bonding region. The substrate includes a core material layer, an upper metal layer, and an upper protection layer, a first window is formed to penetrate the upper protection layer and located at a periphery of the die-bonding region, and the first window is opened for a first ground electrode connected to a first ground portion. The method further includes: performing a dispensing step to apply an adhesive material on the upper board surface in at least a portion of the die-bonding region; and attaching a sensor die to the substrate through the adhesive material, in which the sensor die is disposed in the die-bonding region and has a first ground pin electrically connected to the first ground electrode.
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公开(公告)号：US20240160026A1
公开(公告)日：2024-05-16
申请号：US18422554
申请日：2024-01-25
Applicant: PixArt Imaging Inc.
Inventor： SAI-MUN LEE
CPC classification number: G02B27/0916 , G02B27/0905 , G02B27/0955 , G06F3/0317 , G06F3/0304 , G06F3/03543
Abstract: There is provided an illumination system of a navigation device including a light beam shaping optics, and a first light source and a second light source having different characteristics. The light beam shaping optics is used to shape light beams emitted by the first light source and the second light source to illuminate a work surface with substantially identical incident angles and/or beam sizes.
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Patent Agency Ranking
公开(公告)号：US20230120755A1
公开(公告)日：2023-04-20
申请号：US18083619
申请日：2022-12-19
Applicant: PIXART IMAGING INC.
Inventor： CHEE-PIN T'NG , SAI-MUN LEE
Abstract: There is provided a module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
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公开(公告)号：US20220260849A1
公开(公告)日：2022-08-18
申请号：US17737488
申请日：2022-05-05
Applicant: PixArt Imaging Inc.
Inventor： Wan-Piang LIM , SAI-MUN LEE
Abstract: There is provided a lens piece and a lens assembly as well as an imaging device including the same. The lens assembly includes the lens piece and a lens barrel. The lens piece has a wing extending transversely from a lens sidewall. The lens barrel carries the lens piece, and includes a reservoir corresponding to the wing of the lens piece for containing adhesive.
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公开(公告)号：US20210199982A1
公开(公告)日：2021-07-01
申请号：US17197336
申请日：2021-03-10
Applicant: PixArt Imaging Inc.
Inventor： SAI-MUN LEE
IPC: G02B27/09
Abstract: There is provided an illumination system of a navigation device including a light beam shaping optics, and a first light source and a second light source having different characteristics. The light beam shaping optics is used to shape light beams emitted by the first light source and the second light source to illuminate a work surface with substantially identical incident angles and/or beam sizes.
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公开(公告)号：US20210143139A1
公开(公告)日：2021-05-13
申请号：US17155258
申请日：2021-01-22
Applicant: PixArt Imaging Inc.
Inventor： CHEE-PIN T'NG , SAI-MUN LEE
Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
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公开(公告)号：US20190138119A1
公开(公告)日：2019-05-09
申请号：US16237786
申请日：2019-01-02
Applicant: PixArt Imaging Inc.
Inventor： SAI-MUN LEE
IPC: G06F3/0354 , G06F3/03 , G06F3/01 , G06F3/0338 , G06F3/0362 , G06F3/0346
Abstract: There is provided a mode switching method of a dual mode optical navigation device. The dual mode optical navigation device is configured to be operated on a working surface and has a first bottom surface and a second bottom surface having an included angle with the first bottom surface. The mode switching method includes: determining whether the first bottom surface or the second bottom surface contacts with the working surface; switching the dual mode optical navigation device to a first mode when identifying that the first bottom surface contacts with the working surface; and switching the dual mode optical navigation device to a second mode when identifying that the second bottom surface contacts with the working surface.
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