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    Device housing and manufacturing method
    11.
    发明授权
    Device housing and manufacturing method 有权
    设备外壳和制造方法

    公开(公告)号：US08624113B2

    公开(公告)日：2014-01-07

    申请号：US13336012

    申请日：2011-12-23

    Applicant: Po-Feng Ho

    Inventor： Po-Feng Ho

    IPC: H05K5/00

    CPC classification number: G06F1/1656 ,  B29C45/14336 ,  B29C45/14434 ,  B29C45/14467 ,  B29C45/14778 ,  B29C2045/1454 ,  B29L2031/3437 ,  B29L2031/3475

    Abstract: A housing includes a transparent panel and a housing body. The housing body includes a main body and a flange portion extending from the main body. The filler is formed between the transparent panel and the housing body. The filler includes a first connecting portion, a second connecting portion, and a support portion integrally formed together, the first connecting portion connecting the transparent panel to the flange portion, the support portion supporting the transparent panel, and the second connecting portion connected to the housing body.

    Abstract translation: 壳体包括透明板和壳体。 壳体包括主体和从主体延伸的凸缘部分。 填料形成在透明板和壳体之间。 填料包括第一连接部分，第二连接部分和一体地形成在一起的支撑部分，第一连接部分将透明板连接到凸缘部分，支撑部分支撑透明板，第二连接部分连接到 住房体。

    Housing for electronic devices and method for making the same
    12.
    发明授权
    Housing for electronic devices and method for making the same 有权
    电子设备外壳及其制造方法

    公开(公告)号：US08422205B2

    公开(公告)日：2013-04-16

    申请号：US12911831

    申请日：2010-10-26

    Applicant: Kai-Rong Liao ,  Peng-Cheng Tong ,  Po-Feng Ho ,  Shih-Wei Yang

    Inventor： Kai-Rong Liao ,  Peng-Cheng Tong ,  Po-Feng Ho ,  Shih-Wei Yang

    IPC: G06F1/16

    CPC classification number: H04M1/0283 ,  B29C45/0055 ,  B29C45/36 ,  B29C2045/0058

    Abstract: An electronic device includes a housing and an electronic module. The housing includes a transparent main body, a masking layer partially adhered to the transparent main body, and a cover. A bare area is exposed forming the masking layer to define a transparent window. The housing defines a receiving chamber and an open end communicating with the receiving chamber. The electronic module includes a touch display screen. The electronic module is received in the receiving chamber, the touch display screen aligns to the transparent window, and the cover seals the open end. The present disclosure further discloses a housing for the electronic device and a method for making the housing.

    Abstract translation: 电子设备包括壳体和电子模块。 壳体包括透明主体，部分地粘附到透明主体的掩模层和盖。 曝光的裸露区域形成掩模层以限定透明窗口。 壳体限定接收室和与接收室连通的开口端。 电子模块包括触摸显示屏。 电子模块被容纳在接收室中，触摸显示屏幕与透明窗口对准，盖子封闭开口端。 本公开进一步公开了一种用于电子设备的壳体和用于制造壳体的方法。

    Electronic device housing and method for manufacturing the same
    15.
    发明授权
    Electronic device housing and method for manufacturing the same 有权
    电子设备外壳及其制造方法

    公开(公告)号：US09241435B2

    公开(公告)日：2016-01-19

    申请号：US13709472

    申请日：2012-12-10

    Applicant: Po-Feng Ho ,  Shi-Jie Yan

    Inventor： Po-Feng Ho ,  Shi-Jie Yan

    IPC: H05K1/03 ,  H05K13/00 ,  H05K7/00 ,  H01Q1/40 ,  H05K3/18

    CPC classification number: H05K13/00 ,  H01Q1/40 ,  H05K3/184 ,  H05K7/00 ,  H05K2201/0236 ,  H05K2201/0999

    Abstract: An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

    Abstract translation: 电子设备外壳包括塑料基板。 塑料基板包括第一表面。 电子设备壳体还包括形成在第一表面上的激活层。 活化层含有金属粉末。 激活层限定凹陷部分。 一些金属粉末部分露出在凹部的表面上。 一些金属粉末部分地插入到与凹部对应的塑料基板中。 电子设备壳体还包括形成在凹部上的天线层。 天线层是金属层。 还公开了一种用于制造电子设备外壳的方法。

    Positioning mechanism for use in mold structure
    17.
    发明授权
    Positioning mechanism for use in mold structure 失效
    用于模具结构的定位机构

    公开(公告)号：US08007265B2

    公开(公告)日：2011-08-30

    申请号：US12164257

    申请日：2008-06-30

    Applicant: Juan-Rong Wu ,  Po-Feng Ho ,  Zhi-Zhong Xiao ,  Guan-Qun Zeng ,  Bo Zhang ,  Kao-Hua Guan

    Inventor： Juan-Rong Wu ,  Po-Feng Ho ,  Zhi-Zhong Xiao ,  Guan-Qun Zeng ,  Bo Zhang ,  Kao-Hua Guan

    IPC: B29C45/14 ,  B29C70/78

    CPC classification number: B29C45/14065 ,  B29C45/14688 ,  B29C2045/14918 ,  B29L2031/3437

    Abstract: A positioning mechanism (24) for use in a mold structure (100) to position a film (30) within the mold structure is provided. The mold structure includes a core mold portion (10) and a cavity mold portion (20) mating with the core mold portion. The core mold portion includes a core plate (12) and a core insert (14) formed on the plate. The cavity mold portion includes a positioning mechanism having a moveable cavity insert (242) and an elastic member (244) for outwardly biasing the cavity insert.

    Abstract translation: 提供了一种用于在模具结构（100）中将膜（30）定位在模具结构内的定位机构（24）。 模具结构包括芯模部分（10）和与芯模部分配合的模腔部分（20）。 芯模部分包括芯板（12）和形成在板上的芯插入件（14）。 空腔模具部分包括定位机构，该定位机构具有可移动的空腔插入件（242）和用于向外偏压空腔插入件的弹性构件（244）。

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