公开(公告)号：US20230411832A1

公开(公告)日：2023-12-21

申请号：US18459597

申请日：2023-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min CHO ,  Chan-Gi PARK ,  Yeon-Sang YUN ,  Tae-Wook HAM ,  Hei-Seong KWAK ,  Byoung-Il SON ,  Sung-Chul PARK

IPC: H01Q1/24 ,  H01Q5/35 ,  H05K1/02 ,  H01Q21/28 ,  H01Q1/38 ,  H01R12/79 ,  H01R13/66 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

CPC classification number: H01Q1/243 ,  H01Q5/35 ,  H05K1/0218 ,  H01Q21/28 ,  H01Q1/38 ,  H01R12/79 ,  H01R13/6691 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/115 ,  H05K1/142 ,  H05K1/148 ,  H05K1/18 ,  H05K7/1427 ,  H05K2201/0999 ,  H05K2201/09609 ,  H05K2201/10098

Abstract: Disclosed is a portable communication device including a housing; a first PCB; a wireless communication circuitry disposed on the first PCB; and a second PCB having a plurality of layers including a first PCB portion; a second PCB portion extended from the first PCB portion and more flexible than the first PCB portion; a third PCB portion extended from the second PCB portion and less flexible than the second PCB portion; a fourth PCB portion extended from the third PCB portion and more flexible than the third PCB portion; and a plurality of lines formed at a same layer of the plurality of layers as extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line, and a first signal line between the first and second ground lines.

公开(公告)号：US11749880B2

公开(公告)日：2023-09-05

申请号：US18090214

申请日：2022-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min Cho ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-Il Son ,  Sung-Chul Park

IPC: H01Q1/24 ,  H01Q5/35 ,  H05K1/02 ,  H01Q21/28 ,  H01Q1/38 ,  H01R12/79 ,  H01R13/66 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q5/35 ,  H01Q21/28 ,  H01R12/79 ,  H01R13/6691 ,  H05K1/028 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/115 ,  H05K1/142 ,  H05K1/148 ,  H05K1/18 ,  H05K7/1427 ,  H05K2201/0999 ,  H05K2201/09609 ,  H05K2201/10098

Abstract: Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.

公开(公告)号：US20190075678A1

公开(公告)日：2019-03-07

申请号：US15697902

申请日：2017-09-07

Applicant: Lear Corporation

Inventor： Alberto Aragones Carrete ,  Enric Aparicio Rollan ,  Jose Gabriel Fernández Bañares

IPC: H05K7/20 ,  H05K1/11 ,  H01R9/24 ,  B60R16/023 ,  H02S40/34

CPC classification number: H05K7/205 ,  B60R16/0238 ,  B60R16/0239 ,  H01R9/2458 ,  H01R13/41 ,  H02S40/345 ,  H05K1/119 ,  H05K7/02 ,  H05K7/20854 ,  H05K2201/0999

Abstract: An electrical unit includes a thermally conductive housing, an electrically insulating frame disposed in the thermally conductive housing, a plurality of bus bars disposed at least partially between a base wall of the thermally conductive housing and a first side of the electrically insulating frame, and a plurality of electrical components connected to a second side of the electrically insulating frame. At least one bus bar of the plurality of bus bars may be connected to the electrically insulating frame via one or more plastic rivets. Thermally conductive material may be disposed between at least one bus bar of the plurality of bus bars and a wall of the housing.

公开(公告)号：US09936577B1

公开(公告)日：2018-04-03

申请号：US15703257

申请日：2017-09-13

Applicant: WIESON TECHNOLOGIES CO., LTD.

Inventor： Qiang-Long Hu ,  Wen-Sheng Liu

IPC: H05K1/11 ,  H01R12/62 ,  G06F13/40 ,  H01R12/59 ,  H01R43/20 ,  H05K3/36 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/11 ,  G06F13/409 ,  H01R12/592 ,  H01R12/62 ,  H01R12/79 ,  H01R43/20 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/2009

Abstract: The present disclosure illustrates a dual-channel flexible circuit bridge connector and a dual graphics card system using the same. The dual-channel flexible circuit bridge connector includes a dual-channel flexible circuit board, a first connection interface and a second connection interface. The dual-channel flexible circuit board includes, in a sequential order, a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer and a fourth insulating layer. The first connection interface and the second connection interface can be used to link two graphics cards spaced apart by a non-fixed distance, thereby forming a bridging status. Therefore, the dual graphics card system can manipulate two graphics cards to perform parallel computation, so as to achieve better efficiency in computing process and graphics display.

公开(公告)号：US09914065B2

公开(公告)日：2018-03-13

申请号：US14917564

申请日：2014-09-03

Applicant: BRIXO SMART TOYS LTD.

Inventor： Boaz Almog ,  Amir Saraf

IPC: A63H33/04 ,  A63H33/08 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: A63H33/042 ,  A63H33/086 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0999 ,  H05K2201/209

Abstract: The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

公开(公告)号：US09730312B2

公开(公告)日：2017-08-08

申请号：US14497705

申请日：2014-09-26

Applicant: Nokia Corporation

Inventor： Romeo Dumpit ,  Rolf G. Laido ,  Mikko J. Timperi ,  Vincent Phan ,  Toni Kyroenlampi ,  Jani Haapamaki ,  Tim McGaffigan

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K7/14

CPC classification number: H05K1/0215 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H05K1/0237 ,  H05K1/028 ,  H05K3/30 ,  H05K7/14 ,  H05K2201/0999 ,  H05K2201/10386 ,  Y10T29/49149 ,  Y10T29/53174

Abstract: A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.

公开(公告)号：US20170196077A1

公开(公告)日：2017-07-06

申请号：US15375718

申请日：2016-12-12

Applicant: FUJITSU LIMITED

Inventor： Shigeo IRIGUCHI ,  Naoki Nakamura ,  Mitsunori Abe ,  Nobuo Taketomi ,  Kiyoyuki Hatanaka ,  Ryo Kanai

IPC: H05K1/02 ,  H05K3/12 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/0281 ,  H05K1/185 ,  H05K3/1258 ,  H05K3/429 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/0133 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2203/0346 ,  H05K2203/063

Abstract: A rigid flexible board includes: a substrate that has flexibility and electric insulation; a protective layer formed at a central portion of each of opposite surfaces of the substrate; and a plurality of core layers partially covering the protective layer and formed at a circumferential edge of each of the opposite surfaces of the substrate; wherein a gap is formed close to a center of the substrate in a thickness direction thereof between the core layers and the protective layer.

公开(公告)号：US20170136945A1

公开(公告)日：2017-05-18

申请号：US15417453

申请日：2017-01-27

Applicant: YAZAKI CORPORATION

Inventor： Kazuhiro SHOHHARA

IPC: B60Q3/20 ,  F21V23/06 ,  H01L33/62 ,  F21V14/02

CPC classification number: B60Q3/20 ,  F21V14/02 ,  F21V15/012 ,  F21V19/00 ,  F21V19/0015 ,  F21V23/06 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L33/62 ,  H02G5/005 ,  H05K1/183 ,  H05K2201/09045 ,  H05K2201/09072 ,  H05K2201/0999 ,  H05K2201/10106 ,  H05K2201/10272

Abstract: An illumination device includes a light emitting element, a bus bar in which the light emitting element is attached, and a housing in which the bus bar is insert-molded. The bus bar includes a bus bar main body which is flat-plate-shaped and a bent piece extended in the bus bar main body and bent so as to be inclined to the bus bar main body. The housing includes a protruding part which protrudes from a surface covering the bus bar main body so as to cover at least a part of the bent piece and which has an inclined surface parallel to the bent piece, and a hole on the inclined surface of the protruding part formed so that the bent piece is exposed. The light emitting element is attached to the bent piece so as to be accommodated in the hole.

公开(公告)号：US09615458B2

公开(公告)日：2017-04-04

申请号：US13941630

申请日：2013-07-15

Applicant: NAGANO KEIKI CO., LTD.

Inventor： Nobutaka Yamagishi ,  Naoki Yamashita ,  Atsushi Imai

IPC: H05K1/16 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/16 ,  H05K1/0284 ,  H05K3/34 ,  H05K3/3442 ,  H05K2201/09118 ,  H05K2201/0999 ,  Y10T29/49144

Abstract: For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

公开(公告)号：US20170020012A1

公开(公告)日：2017-01-19

申请号：US15184292

申请日：2016-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Seungyup LEE ,  Sangil LEE ,  Won-Jea JANG

IPC: H05K5/02 ,  H05K5/00 ,  H04M1/18 ,  H01G2/10 ,  H04B1/3888 ,  H04M1/02 ,  G06F1/16 ,  H05K5/04

CPC classification number: H05K5/0247 ,  G06F1/1656 ,  H01G2/106 ,  H01G4/01 ,  H01G4/224 ,  H01G4/228 ,  H01M10/4264 ,  H01M16/00 ,  H04B1/3888 ,  H04M1/0277 ,  H04M1/185 ,  H05K5/0013 ,  H05K5/04 ,  H05K2201/0999

Abstract: An electronic device is provided. The electronic device includes a first metal plate of a metal bezel that forms the external appearance of the electronic device, a second metal plate that overlaps the first metal plate while being spaced apart from the first metal plate, a dielectric member interposed between the first metal plate and the second metal plate, and a substrate electrically connected to a contact terminal of the second metal plate to feed power. Other embodiments are possible.

Abstract translation: 提供电子设备。 电子设备包括形成电子设备的外观的金属边框的第一金属板，与第一金属板重叠的第二金属板，同时与第一金属板间隔开;电介质构件，介于第一金属 板和第二金属板，以及电连接到第二金属板的接触端子以供电的基板。 其他实施例是可能的。