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公开(公告)号：US11252843B2
公开(公告)日：2022-02-15
申请号：US16876342
申请日：2020-05-18
Applicant: Quanta Computer Inc.
Inventor： Hsiao-Tsu Ni , Chun Chang , Hsin-Chieh Lin , Chia-Jung Tsai
Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.
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公开(公告)号：US11249523B2
公开(公告)日：2022-02-15
申请号：US16988333
申请日：2020-08-07
Applicant: Quanta Computer Inc.
Inventor： Chun Chang , Hsin-Chieh Lin , Chih-Hao Chang , Tzu-Fong Wang
Abstract: An air baffle insertable between a chassis wall and a computer component such as a GPU and heat sink mounted on a GPU tray to divert air flow to the computer component is disclosed. The air baffle includes a single sheet having a bottom panel, a top panel, and a pair of parallel side walls. Each of the parallel side walls are connected to the bottom and top panels. A first end wall is joined to the side walls and the top and bottom panel. The first end wall directs air flow toward the computer component.
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公开(公告)号：US11200920B1
公开(公告)日：2021-12-14
申请号：US17097218
申请日：2020-11-13
Applicant: Quanta Computer Inc.
Inventor： Chun Chang , Hsin-Chieh Lin , Yao-Long Lin , You-Jin Liu
Abstract: Described herein are example carrier systems for supporting memory storage drives of multiple sizes. The carrier systems include a carrier tray having a u-shape formed by a front bezel that extends between first and second lateral plates, and a tray adapter removably attached to the carrier tray. The carrier tray has a carrier internal space between the first and second lateral plates and is configured to receive a first memory storage drive. The tray adapter has a bottom plate that extends between first and second side walls. The tray adapter has a tray internal space between the first and second side walls, the tray internal space is configured to receive a second memory storage drive. The second memory storage drive has a smaller size than the first memory storage drive.
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公开(公告)号：US10517189B1
公开(公告)日：2019-12-24
申请号：US16295827
申请日：2019-03-07
Applicant: QUANTA COMPUTER INC.
Inventor： Yaw-Tzorng Tsorng , Chun Chang , Hsin-Chieh Lin , Chih-Hao Chang
Abstract: The present disclosure provides a system and method for enabling cableless connections within a server system. The server system comprises a motherboard (MB) module, a power distribution board (PDB) module, power supply unit (PSU) modules, network interface controller (NIC) modules, fan modules, graphic process unit (GPU) modules, and a hyperscale GPU accelerator (HGX) platform. These components of the server system are interconnected by a plurality of circuit boards. The plurality of circuit boards includes, but is not limited to, a main board, linking boards (BDs), a PDB, a fan board, a power linking board, peripheral-component-interconnect-express (PCIe) expander boards, a plurality of NVLink bridges, and HGX base boards.
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