COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
    11.
    发明申请
    COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    线圈组件及其制造方法

    公开(公告)号:US20160314889A1

    公开(公告)日:2016-10-27

    申请号:US14995103

    申请日:2016-01-13

    Abstract: A coil component includes a body having a coil part disposed therein and an external electrode connected to the coil part. The body includes magnetic particles, and the magnetic particles include first magnetic particles, second magnetic particles, and third magnetic particles. A diameter of each of the first, second, and third magnetic particles is different from each other.

    Abstract translation: 线圈部件包括具有设置在其中的线圈部分的主体和连接到线圈部分的外部电极。 主体包括磁性颗粒,磁性颗粒包括第一磁性颗粒,第二磁性颗粒和第三磁性颗粒。 第一,第二和第三磁性颗粒中的每一个的直径彼此不同。

    COIL COMPONENT
    14.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号:US20190122793A1

    公开(公告)日:2019-04-25

    申请号:US16013588

    申请日:2018-06-20

    Abstract: A coil component includes a body in which a coil portion is disposed, and external electrodes connected to the coil portion. The body includes metal particles formed of an Fe-based nanocrystal grain alloy, and the Fe-based nanocrystal grain alloy has one peak or two peaks in a differential scanning calorimetry (DSC) graph, and when the Fe-based nanocrystal grain alloy has the two peaks, a primary peak is smaller than a secondary peak, where the primary peak is at a lower temperature than the secondary peak.

    COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    线圈电子元件及其制造方法

    公开(公告)号:US20170032884A1

    公开(公告)日:2017-02-02

    申请号:US15146470

    申请日:2016-05-04

    Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 μm or more.

    Abstract translation: 线圈电子部件包括具有基板和线圈部的磁性体。 线圈部分包括设置在基板的表面上的图案化绝缘膜,以及通过电镀形成在图案化的绝缘膜之间并且具有大于或等于其平行于基板的表面测量的宽度的镀层的镀层。 电镀层可以在单个电镀操作中形成,并且可以具有200μm以上的厚度。

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