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公开(公告)号：US20190115147A1
公开(公告)日：2019-04-18
申请号：US16003901
申请日：2018-06-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Il LEE , Han Wool RYU , Sang Kyun KWON
IPC: H01F27/32 , H01F27/29 , H01F1/147 , H01F27/255
Abstract: A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.
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公开(公告)号：US20190100828A1
公开(公告)日：2019-04-04
申请号：US16008928
申请日：2018-06-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Kyun KWON , Han Wool RYU , Chang Ryul JUNG , Jong Ho CHUNG , Jong Suk JEONG , Chul Min SIM
Abstract: An Fe-based nanocrystalline alloy is represented by Composition Formula, (Fe(1-a)M1a)100-b-c-d-e-gM2bBcPdCueM3g, where M1 is at least one element selected from Co and Ni, M2 is at least one element selected from the group consisting of Nb, Mo, Zr, Ta, W, Hf, Ti, V, Cr, and Mn, M3 is at least one element selected from the group consisting of C, Si, Al, Ga, and Ge, and 0≤a≤0.5, 2≤b≤3, 9≤c≤11, 1≤d≤2, 0.6≤e≤1.5, and 9≤g≤11.
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公开(公告)号：US20150028983A1
公开(公告)日：2015-01-29
申请号：US14261988
申请日：2014-04-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Han Wool RYU , Gwang Hwan HWANG , Kwi Jong LEE , Hwan Soo LEE , Hang Kyu CHO
IPC: H01F27/255 , H01F27/28 , H01F41/02 , H01F27/29
CPC classification number: H01F1/15308 , H01F17/0013 , H01F17/04 , H01F27/292 , Y10T29/49155
Abstract: A magnetic paste composition for a chip electronic component, a chip electronic component, and a manufacturing method therof are provided. The chip electronic component is capable of being manufactured in a thin-film to allow for thinness and miniaturization thereof, thereby preventing a deterioration in efficiency thereof due to core loss even under high frequency and high current conditions. The chip electronic component exhibits high permeability, high efficiency, and a high Isat value by decreasing porosity.
Abstract translation: 提供了一种用于芯片电子部件的磁性糊剂组合物，芯片电子部件和制造方法。 芯片电子部件能够以薄膜制造以允许其薄型化和小型化，从而即使在高频和高电流条件下也能防止由于铁损而导致的效率的劣化。 芯片电子元件通过降低孔隙率表现出高渗透性，高效率和高Isat值。
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公开(公告)号：US20190164689A1
公开(公告)日：2019-05-30
申请号：US15970138
申请日：2018-05-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Il LEE , Han Wool RYU , Sang Kyun KWON
Abstract: A coil electronic component includes a body having a coil portion embedded therein and having a form in which magnetic particles are dispersed in a first insulating material, a first atomic layer deposition (ALD) layer formed along a surface of the coil portion using a second insulating material, a second ALD layer formed along a surface of the first ALD layer using a third insulating material, and external electrodes connected to the coil portion.
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公开(公告)号：US20190115146A1
公开(公告)日：2019-04-18
申请号：US16008847
申请日：2018-06-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Kyun KWON , Han Wool RYU , Young Il LEE
Abstract: A coil electronic component includes a body having a coil portion embedded therein, and external electrodes connected to the coil portion, wherein the body includes a plurality of magnetic portions having a form in which magnetic particles are dispersed in an insulator and one or more insulating portions disposed between the plurality of magnetic portions.
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Patent Agency Ranking
公开(公告)号：US20190055635A1
公开(公告)日：2019-02-21
申请号：US16011131
申请日：2018-06-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Kyun KWON , Han Wool RYU , Chul Min SIM , Chang Hak CHOI , Jong Suk JEONG
Abstract: An Fe-based nanocrystalline alloy is represented by Composition Formula, (Fe(1-a)M1a)100-b-c-d-e-gM2bBcPdCueM3g, where M1 is at least one element selected from the group consisting of Co and Ni, M2 is at least one element selected from the group consisting of Nb, Mo, Zr, Ta, W, Hf, Ti, V, Cr, and Mn, M3 is at least two elements selected from the group consisting of C, Si, Al, Ga, and Ge but necessarily includes C, and 0≤a≤0.5, 1.5
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公开(公告)号：US20170194084A1
公开(公告)日：2017-07-06
申请号：US15253130
申请日：2016-08-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Woon Chul CHOI , Ji Hye OH , Jung Hyuk JUNG , Han Wool RYU
IPC: H01F27/02 , H01F41/02 , H01F27/28 , H01F41/16 , H01F41/34 , H01F27/245 , H01F27/255 , H01F41/12
Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
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公开(公告)号：US20190221351A1
公开(公告)日：2019-07-18
申请号：US16100632
申请日：2018-08-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Suk JEONG , Han Wool RYU , Seong Jae LEE , Sang Kyun KWON , Chang Hak CHOI
IPC: H01F27/02 , H01F3/10 , H01F3/08 , H01F27/255 , H01F27/32
CPC classification number: H01F27/022 , H01F3/08 , H01F3/10 , H01F27/255 , H01F27/32 , H01F2003/106
Abstract: An inductor includes a body including a coil and an encapsulant and an external electrode on an outer surface of the body. The encapsulant includes a first core surrounding the coil and a second core surrounding the first core. The first core includes a magnetic powder having high current characteristics, and the second core includes a magnetic powder having high capacity characteristics.
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公开(公告)号：US20180268990A1
公开(公告)日：2018-09-20
申请号：US15824195
申请日：2017-11-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hwan Soo LEE , Han Wool RYU , Hyo Chan OH , Jin Ho KU , Byoung Hwa LEE
CPC classification number: H01F27/29 , H01F17/0013 , H01F27/24 , H01F27/2804 , H01F27/292 , H01F41/041 , H01F2017/048 , H01F2027/2809
Abstract: A coil component includes a support member, an internal coil supported by the support member, and external electrodes connected to the internal coil. The external electrodes may each include a first layer coming into contact with the internal coil and a second layer disposed on a surface of the first layer. The first layer may serve as a buffer layer for improving a contact property between the internal coil and the external electrode. The second layer may be disposed to come into at least partial contact with a first end portion of the support member and a second end portion of the support member.
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公开(公告)号：US20230015432A1
公开(公告)日：2023-01-19
申请号：US17948656
申请日：2022-09-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Il LEE , Han Wool RYU , Sang Kyun KWON
IPC: H01F27/32 , H01F27/29 , H01F1/147 , H01F27/255 , H01F17/04 , H01F17/00 , C23C16/455 , H01F1/26
Abstract: A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.
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