公开(公告)号：US11823844B2

公开(公告)日：2023-11-21

申请号：US17572176

申请日：2022-01-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Min Kim ,  Hong Je Choi ,  Ji Hye Han ,  Byung Woo Kang ,  Hye Jin Park ,  Sang Wook Lee ,  Bon Seok Koo ,  Jung Won Lee

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/2325

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.

公开(公告)号：US20230197344A1

公开(公告)日：2023-06-22

申请号：US17978660

申请日：2022-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hye Han ,  Jung Min Kim ,  Hong Je Choi ,  Byung Woo Kang ,  Hye Jin Park ,  Sang Wook Lee ,  Bon Seok Koo

IPC: H01G4/232 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body, wherein the external electrodes include a first electrode layer connected to the internal electrodes and including a conductive metal, a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including an intermetallic compound and a resin and a second resin electrode layer disposed on the first resin electrode layer and including a plurality of metal particles and a resin.

公开(公告)号：US11469051B2

公开(公告)日：2022-10-11

申请号：US17233235

申请日：2021-04-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hye Han ,  Jung Min Kim ,  Jae Seok Yi ,  Hye Jin Park ,  Byung Woo Kang ,  Jeong Ryeol Kim ,  Bon Seok Koo ,  Il Ro Lee

IPC: H01G4/30 ,  H01G4/012 ,  H05K1/18 ,  H01G4/12 ,  H01G4/248

Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 μm or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.

公开(公告)号：US12283431B2

公开(公告)日：2025-04-22

申请号：US18132195

申请日：2023-04-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Su Yun Yun ,  Hong Je Choi ,  Ji Hye Han ,  Byung Woo Kang ,  Hye Jin Park ,  Sang Wook Lee ,  Jung Min Kim

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/248 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.

公开(公告)号：US20230170146A1

公开(公告)日：2023-06-01

申请号：US17747432

申请日：2022-05-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong Je Choi ,  Jung Min Kim ,  Ji Hye Han ,  Byung Woo Kang ,  Hye Jin Park ,  Sang Wook Lee ,  Bon Seok Koo ,  Jung Won Lee

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/008

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H01G4/008

Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.