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公开(公告)号：US20240147620A1
公开(公告)日：2024-05-02
申请号：US18135414
申请日：2023-04-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Uk LEE , Youn Gyu HAN , Jin Oh PARK , Yong Wan JI , Yong Duk LEE , Eun Sun KIM
IPC: H05K1/11 , H01L23/00 , H01L23/498 , H05K1/18 , H05K3/46
CPC classification number: H05K1/115 , H01L23/49816 , H01L24/32 , H05K1/186 , H05K3/4697 , H01L2224/32227
Abstract: The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.
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公开(公告)号：US20230066381A1
公开(公告)日：2023-03-02
申请号：US17578864
申请日：2022-01-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Uk LEE , Chi Won HWANG , Eun Sun KIM , Yong Wan JI
Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.
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公开(公告)号：US20220322528A1
公开(公告)日：2022-10-06
申请号：US17475747
申请日：2021-09-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Sun KIM , Jin Uk LEE , Young Hun YOU
Abstract: A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.
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公开(公告)号：US20150200664A1
公开(公告)日：2015-07-16
申请号：US14304207
申请日：2014-06-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hun KIM , Jin Uk LEE
IPC: H03K17/96
CPC classification number: H03K17/962 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H03K2217/96015 , H03K2217/960755
Abstract: Embodiments of the invention provide a touch sensor and a method of manufacturing the touch sensor. The touch sensor includes a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern includes a first pattern layer formed on the base substrate, a second pattern layer formed on the first pattern layer, and a third pattern layer formed to enclose the second pattern layer. The third pattern layer is formed to cover a side and an exposed upper surface of the second pattern layer and is made of tin.
Abstract translation: 本发明的实施例提供一种触摸传感器和制造该触摸传感器的方法。 触摸传感器包括基底基板和形成在基底基板上的电极图案。 电极图案包括形成在基底基板上的第一图案层，形成在第一图案层上的第二图案层和形成为包围第二图案层的第三图案层。 第三图案层形成为覆盖第二图案层的一侧和暴露的上表面并且由锡制成。
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