公开(公告)号：US20230199976A1

公开(公告)日：2023-06-22

申请号：US17726896

申请日：2022-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Guh Hwan LIM ,  Chi Seong KIM ,  Won Seok LEE ,  Jin Oh PARK ,  Yu Mi KIM ,  Sang Yun LEE ,  Eun Sun KIM

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K3/4038 ,  H05K3/4644 ,  H05K1/115 ,  H05K2201/09036

Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.

公开(公告)号：US20240147620A1

公开(公告)日：2024-05-02

申请号：US18135414

申请日：2023-04-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk LEE ,  Youn Gyu HAN ,  Jin Oh PARK ,  Yong Wan JI ,  Yong Duk LEE ,  Eun Sun KIM

IPC: H05K1/11 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L23/49816 ,  H01L24/32 ,  H05K1/186 ,  H05K3/4697 ,  H01L2224/32227

Abstract: The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.