公开(公告)号：US20240147620A1

公开(公告)日：2024-05-02

申请号：US18135414

申请日：2023-04-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk LEE ,  Youn Gyu HAN ,  Jin Oh PARK ,  Yong Wan JI ,  Yong Duk LEE ,  Eun Sun KIM

IPC: H05K1/11 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L23/49816 ,  H01L24/32 ,  H05K1/186 ,  H05K3/4697 ,  H01L2224/32227

Abstract: The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.

公开(公告)号：US20230066381A1

公开(公告)日：2023-03-02

申请号：US17578864

申请日：2022-01-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk LEE ,  Chi Won HWANG ,  Eun Sun KIM ,  Yong Wan JI

IPC: H05K1/11 ,  H05K1/02

Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.

公开(公告)号：US20160021749A1

公开(公告)日：2016-01-21

申请号：US14736128

申请日：2015-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kang Wook BONG ,  Myung Sam KANG ,  Yong Wan JI ,  Hye Won JUNG ,  Yong Jin PARK ,  Young Gwan KO

IPC: H05K1/16 ,  H05K1/11 ,  H05K3/42 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/15311 ,  H05K1/144 ,  H05K1/182 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/422 ,  H05K3/4697 ,  H05K2201/0347 ,  H05K2201/094 ,  H05K2203/0264 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/1383 ,  Y02P70/611

Abstract: There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention includes a first insulating layer formed with a cavity and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer.

Abstract translation: 提供了一种封装板，其制造方法和使用该封装板的堆叠型封装。 根据本发明的示例性实施例的封装板包括形成有空腔的第一绝缘层和形成为穿透第一绝缘层的外部连接端子，并且具有突出到第一绝缘层的一个表面的外侧的一端 。