公开(公告)号：US20140027156A1

公开(公告)日：2014-01-30

申请号：US13664091

申请日：2012-10-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

Inventor： Ki Hwan Kim ,  Myung Sam Kang ,  Keung Jin Sohn ,  Yoong Oh ,  Da Hee Kim ,  Ki Young Yoo ,  Han Ui Lee ,  Sang Hyuck Oh

IPC: H05K3/46 ,  H05K3/14 ,  H05K3/10 ,  H05K3/40 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/4682 ,  H05K3/0097 ,  H05K3/4647 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars.

Abstract translation: 本发明公开了一种制造多层型无芯基板的方法，该方法包括：（A）制备载体基板，其包括在绝缘表面的一个表面或两个表面上形成的至少一个铜箔; （B）在载体基板的一个表面或两个表面上形成无芯无印刷电路前体; （C）分离载体基板; （D）对无芯印刷电路前体进行抛光切割处理; 以及（E）在所述无芯印刷电路前体的平坦外表面上层叠多个其它绝缘层，所述多个其它绝缘层依次包括其它电路层和其他柱。