公开(公告)号：US20250081688A1

公开(公告)日：2025-03-06

申请号：US18951127

申请日：2024-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mingyu LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Yoonsuk LEE ,  Changkyu CHUNG

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/62

Abstract: A display module includes a plurality of inorganic light-emitting elements, a substrate including a mounting surface on which the plurality of inorganic light-emitting elements are mounted, and a non-conductive film (NCF) disposed on the substrate and configured to bond the plurality of inorganic light-emitting elements to the substrate. The NCF may have a black-based color.

公开(公告)号：US20220382399A1

公开(公告)日：2022-12-01

申请号：US17833107

申请日：2022-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonggyu JO ,  Jungchul AN ,  Byunghoon LEE

IPC: G06F3/046 ,  B32B7/12 ,  B32B3/30

Abstract: An electronic device including a bonding layer in contact with an active area of a digitizer may include: the digitizer, a main magnet attached to a surface of the digitizer, a flexible printed circuit board electrically connected to the digitizer, and a bonding layer connecting the digitizer and the flexible printed circuit board, wherein the flexible printed circuit board includes a base part overlapping the bonding layer with respect to a stacking direction of the digitizer, the flexible printed circuit board, and the bonding layer, and extension parts extending toward the main magnet from the base part.

公开(公告)号：US20210066243A1

公开(公告)日：2021-03-04

申请号：US17010231

申请日：2020-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunghoon LEE ,  Sungyong MIN ,  Changjoon LEE ,  Jamyeong KOO

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075

Abstract: A method for manufacturing a micro light emitting diode (LED) display is provided. The method includes a first operation of applying a light-to-heat conversion layer to a first surface of a carrier substrate, a second operation of forming a first adhesive layer on the light-to-heat conversion layer a third operation of aligning a plurality of micro LED chips on the first adhesive layer, a fourth operation of positioning the plurality of micro LED chips above a circuit board at a first distance, a fifth operation of radiating a laser to the plurality of micro LED chips, and a sixth operation of causing the first adhesive layer to be deformed by the light-to-heat conversion layer, so that the plurality of micro LED chips are detached from the first adhesive layer to be attached to the circuit board. Various other embodiments are possible.

公开(公告)号：US20210032514A1

公开(公告)日：2021-02-04

申请号：US16801677

申请日：2020-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul YOO ,  Byunghoon LEE ,  Myungjun KIM ,  Jikang KIM ,  Jeonghwan MIN ,  Kyoungchae SEO ,  Changyoung JEONG

IPC: C09J163/00 ,  G03F1/22 ,  G03F1/82

Abstract: An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.

公开(公告)号：US20200152845A1

公开(公告)日：2020-05-14

申请号：US16678106

申请日：2019-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byunghoon LEE ,  Jamyeong KOO

IPC: H01L33/62 ,  H01L25/075

Abstract: A micro-LED mounting structure includes a first layer having a conductive pad disposed on a surface thereof, a second layer including a first surface, a second surface opposite the first surface and disposed on the surface of the first layer, and a via-hole extending from the conductive pad of the first layer to the first surface and including a conductive material, and a micro-LED disposed on the first surface of the second layer to be electrically connected with the conductive material included in the via-hole. The via-hole includes a first opening in the first surface of the second layer and in which the conductive material is formed, the conductive material of the first surface provides a conductive area on a portion of the first surface of the second layer, and the conductive area and an area within a specified area of the conductive area define a substantially flat surface.