公开(公告)号：US20240258292A1

公开(公告)日：2024-08-01

申请号：US18440304

申请日：2024-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Changjoon LEE ,  Kyungwoon JANG

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/03 ,  H01L24/08 ,  H01L24/16 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/03848 ,  H01L2224/08059 ,  H01L2224/08113 ,  H01L2224/16258 ,  H01L2924/12041

Abstract: A micro light emitting diode (LED) chip includes: a first semiconductor layer doped with an N-type dopant; a second semiconductor layer provided at a lower surface of the first semiconductor layer, and doped with a P-type dopant; an active layer provided between the first semiconductor layer and the second semiconductor layer, and configured to emit light; and an electrode pad provided at a lower surface of the second semiconductor layer, wherein the electrode pad may include a groove structure having a depth that increases from an edge of the electrode pad towards a center of the electrode pad.

公开(公告)号：US20240265839A1

公开(公告)日：2024-08-08

申请号：US18638228

申请日：2024-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Jinyoung KIM ,  Sungyong MIN ,  Kyungwoon JANG ,  Changkyu CHUNG ,  Daesuck HWANG

IPC: G09G3/00 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: G09G3/006 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/62 ,  G09G2330/12

Abstract: An electroluminescence inspection apparatus includes a first substrate; a plurality of electrodes provided at a first surface of the first substrate; a driving circuit provided at a second surface of the first substrate opposite of the first surface and configured to apply a current to a plurality of light emitting diodes provided at a second substrate through the plurality of electrodes; and a plurality of wirings configured to electrically connect the plurality of electrodes with the driving circuit. At least one electrode of the plurality of electrodes includes a plurality of protrusions configured to contact the plurality of light emitting diodes of the second substrate.

公开(公告)号：US20240255563A1

公开(公告)日：2024-08-01

申请号：US18602717

申请日：2024-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Changkyu CHUNG ,  Kyungwoon JANG ,  Daeseok HWANG

IPC: G01R31/26

CPC classification number: G01R31/2635

Abstract: An electroluminescence inspection apparatus includes a first substrate, and electrode members arranged at a first surface of the first substrate, and electrically contacted respectively with a chip electrode pad of light emitting diodes arranged at a second substrate based on performing an electroluminescence inspection, wherein an electrode member includes contact protrusions configured to be elastically contacted at a chip electrode member of the light emitting diode based on the first substrate is pressed by the second substrate.

公开(公告)号：US20210066243A1

公开(公告)日：2021-03-04

申请号：US17010231

申请日：2020-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunghoon LEE ,  Sungyong MIN ,  Changjoon LEE ,  Jamyeong KOO

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075

Abstract: A method for manufacturing a micro light emitting diode (LED) display is provided. The method includes a first operation of applying a light-to-heat conversion layer to a first surface of a carrier substrate, a second operation of forming a first adhesive layer on the light-to-heat conversion layer a third operation of aligning a plurality of micro LED chips on the first adhesive layer, a fourth operation of positioning the plurality of micro LED chips above a circuit board at a first distance, a fifth operation of radiating a laser to the plurality of micro LED chips, and a sixth operation of causing the first adhesive layer to be deformed by the light-to-heat conversion layer, so that the plurality of micro LED chips are detached from the first adhesive layer to be attached to the circuit board. Various other embodiments are possible.

公开(公告)号：US20240379923A1

公开(公告)日：2024-11-14

申请号：US18627177

申请日：2024-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghoon JUNG ,  Jinyoung KIM ,  Sungyong MIN ,  Changjoon LEE

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/46

Abstract: A display module includes: a substrate including a mounting surface and a pad electrode on the mounting surface; an inorganic light emitting element including a contact electrode corresponding to the pad electrode; a bump disposed between the pad electrode and the contact electrode to bond the pad electrode and the contact electrode, the bump being electrically connecting the pad electrode to the contact electrode; a reflective member configured to underfill the inorganic light emitting element to cover side surfaces of the inorganic light emitting element and a bottom surface of the inorganic light emitting element, and configured to reflect light; and a cover member configured to cover side surfaces of the reflective member and the mounting surface of the substrate, the cover member having a black color.

公开(公告)号：US20240274754A1

公开(公告)日：2024-08-15

申请号：US18621969

申请日：2024-03-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Kyungwoon Jang ,  Jinyoung Kim ,  Changkyu Chung

IPC: H01L33/38 ,  H01L25/16 ,  H01L33/42

CPC classification number: H01L33/38 ,  H01L25/167 ,  H01L33/42 ,  H01L2933/0016

Abstract: A display module is provided and includes a driving substrate; first electrodes on the driving substrate, and light-emitting diodes (LEDs) including: semi-conductor layers; second electrodes respectively corresponding to the first electrodes; protrusions on each of the second electrodes; and metal layers on the protrusions, each of the metal layers connected to one of the second electrodes. The display module further includes a non-conductive film layer between the driving substrate and the LEDs. The first electrodes and the second electrodes are connected by the metal layers.

公开(公告)号：US20210050336A1

公开(公告)日：2021-02-18

申请号：US16992004

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong KOO ,  Sungyong MIN ,  Byunghoon LEE ,  Changjoon LEE ,  Changkyu CHUNG ,  Youngkyong JO

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075

Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.